Bionic design for the heat sink inspired by phyllotactic pattern

2020 ◽  
pp. 095440622095909
Author(s):  
Yushan Lyu ◽  
Haiyue Yu ◽  
Yuheng Hu ◽  
Qilin Shu ◽  
Jun Wang
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Electronic Components ◽  
Electronic Industry ◽  
Bionic Design ◽  
Phyllotactic Pattern ◽  
Infrared Imager ◽  
Pin Fins ◽  
Good Heat ◽  
Thermal Infrared Imager

A good heat dissipating condition will help give full play to the performance and reliability of electronic components and devices. To strengthen the heat dissipating performance, a novel bionic heat sink of pin fins has been designed. The configuration of cooling pin fins in this heat sink is based on phyllotaxis theory in biology. The bionic configuration of the cooling pin fins has better homogeneity and complementarity, which can form a reasonable air flow channel to improve its cooling efficiency. For testing and analyzing the performance of the bionic heat sink and the effects of the phyllotactic parameters on the heat dissipating, some contrast experiments have been conducted using thermal infrared imager. The results show that the bionic heat sink has better heat dissipating performance, which can make the surface temperature of the heat block lower by 14.7%. This paper will supply a new and effective solution to heat dissipation problem and has a certain contribution for the development of electrical and electronic industry.

Effect of Heat Sink Structure Improvement on Heat Dissipation Performance in High Heat Flux

2016 ◽  
Author(s):  
Zhuo Cui
Keyword(s):  
Heat Resistance ◽  
Water Flow ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Convection Heat Transfer ◽  
Cooling Water ◽  
High Heat Flux ◽  
Pin Fin ◽  
Pin Fins ◽  
Pin Fin Arrays

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.

scholarly journals The flow and heat performance of tree-like network heat sink with diverging–converging channel

2021 ◽  
Vol 236 ◽  
pp. 01027
Author(s):  
Xiugen Zhu ◽  
Peng Qian ◽  
Zizhen Huang ◽  
Chengyuan Luo ◽  
Minghou Liu
Keyword(s):  
Pressure Drop ◽  
Flow Rate ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Maximum Temperature ◽  
Pumping Power ◽  
Flow Recirculation ◽  
Converging Channel ◽  
Converging Angle ◽  
Good Heat

A tree-like network heat sink with diverging–converging channel is designed, and effect of flow rate, channel diverging-converging angles on the flow and heat dissipation performance of the tree-like network heat sink is analysed and compared by numerical simulation. Results show that the diverging– converging angle of 2° can reduce the pressure drop by 14% when inlet mass flow rate is 0.00499kg/s. And the maximum temperature, the temperature difference between the maximum and minimum of the heat sink increases by 0.63K and 0.92K respectively. As the diverging-converging angle increases to 4°, however, it only reduces the pressure drop by 13% and can not bring more pressure drop due to formation of flow recirculation inside the tree-like network heat sink channel. Therefore, the diverging–converging fractal micro-channel heat sink with 2° has good heat dissipation performance with obvious lower pumping power.

An Elaborate Review for Micro-Fin Heat Sink

2020 ◽  
Vol 38 (1A) ◽  
pp. 105-112
Author(s):  
Ibtisam A. Hasan ◽  
Sahar R. Fafraj ◽  
Israa A. Mohmmad
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Low Cost ◽  
High Heat ◽  
Heat Sinks ◽  
Nano Particles ◽  
High Heat Flux ◽  
Pin Fins

Heat sinks are low cost, the process of manufacturing reliability, and design simplicity which leads to taking into consideration various cutting-edge applications for heat transfer. Like stationary, fuel cells, automotive electronic devices also PV panels cooling and other various applications to improve the heat sinks thermal performance. The aim is to focus on some countless fundamental issues in domains such as; mechanics of fluids and heat transfer, sophisticated prediction for temperature distribution, high heat flux removal, and thermal resistance reduction. The outcome of this survey concluded that the best configuration of heat sinks has a thermal resistance about (0.140 K/W to 0.250 K/W) along with a drop of pressure less than (90.0 KPa) with a temperature gradient about 2 °C/mm. Heat sinks with square pin fins lead to enhance the effectiveness of heat dissipation than heat sinks with microcolumn pin fins. While other researches recommend the use of high conductive coating contains nano-particles. The present survey focuses on the researches about future heat sink with micro fin and the development to resolve the fundamental issues. The main benefits and boundaries of micro fins heat sink briefed.

Comparative Analysis of Heat Transfer and Fluid Flow in Circular and Rhombus Pin Fin Heat Sink Using Nanofluid

2021 ◽  
Vol 13 (5) ◽  
Author(s):  
Dungali Sreehari ◽  
Yogesh K. Prajapati
Keyword(s):  
Heat Transfer ◽  
Fluid Flow ◽  
Comparative Analysis ◽  
Pressure Drop ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Flow Behavior ◽  
Computational Domain ◽  
Pin Fin ◽  
Pin Fins

Abstract Numerical investigation has been carried out to compare the heat transfer performance and fluid flow behavior of microchannel heat sinks with circular and rhombus pin fins which are arranged in an in-line manner. Diameter and sides are 1 mm for circular and rhombus fins. Three-dimensional (3D) computational domain has been simulated using two types of cooling medium, i.e., water and Al2O3–H2O nanofluid. A comprehensive comparative analysis has been presented considering the coolants and pin fin profiles as variable parameters. Two operating variables, i.e., heat flux (q) and Reynolds number (Re), are varied in the range of q = 100–400 kW/m2 and Re = 100–400. A total of 64 cases have been simulated to identify the promising features of both the pin fins attributed to improved heat transfer and overall thermal performance. Comparison has also been made between the coolant medium to find out their heat dissipation potential and flow characteristics in the heat sink. Results obtained in terms of average bottom wall temperature, heat transfer coefficient, Nusselt number (Nu), and pressure drop demonstrate that heat sink with rhombus pin fins dissipates more heat compared to its counterpart. It is attributed to the shape and geometry of rhombus fins that facilitate distinct fluid flow behavior; nevertheless, the pressure drop is less in the circular fin heat sink. Moreover, for constant value of Re, nanofluid extracts more heat compared to water in both configurations of the heat sink.

scholarly journals Heat Dissipation Performance of Micro-channel Heat Sink with Various Protrusion Designs

2021 ◽  
Vol 20 ◽  
pp. 240-249
Author(s):  
Siyuan Bai ◽  
Khalil Guy ◽  
Yuxiang Jia ◽  
Weiyi Li ◽  
Qingxia Li ◽  
...  
Keyword(s):  
Porous Medium ◽  
Partial Differential Equations ◽  
Differential Equations ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Volume Averaging ◽  
Micro Channel ◽  
Partial Differential ◽  
Micro Channels ◽  
Pin Fins

This research will focus on studying the effect of aperture size and shape of the micro-channel heat sink on heat dissipation performance for chip cooling. The micro-channel heat sink is considered to be a porous medium with fluid subject inter-facial convection. Derivation based on energy equation gives a set of governing partial differential equations describing the heat transfer through the micro-channels. Numerical simulation, including steady-state thermal analysis based on CFD software, is used to create a finite element solver to tackle the derived partial differential equations with properly defined boundary conditions related to temperature. After simulating three types of heat sinks with various protrusion designs including micro-channels fins, curly micro-channels fins, and Micro-pin fins, the result shows that the heat sink with the maximum contact area per unit volume will have the best heat dissipation performance, we will interpret the result by using the volume averaging theorem on the porous medium model of the heat sink.

NUMERICAL ANALYSIS OF THE THERMAL PERFORMANCE OF A NOVEL DOUBLE-LAYERED HEAT SINK WITH STAGGERED PIN FINS

2019 ◽  
Vol 50 (8) ◽  
pp. 757-772 ◽  
Author(s):  
Yicang Huang ◽  
Hui Li ◽  
Shengnan Shen ◽  
Yongbo Xue ◽  
Mingliang Xu ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Thermal Performance ◽  
Heat Sink ◽  
Pin Fins

scholarly journals Geometric correction for thermographic images of asteroid 162173 Ryugu by TIR (thermal infrared imager) onboard Hayabusa2

2021 ◽  
Vol 73 (1) ◽  
Author(s):  
Takehiko Arai ◽  
Tatsuaki Okada ◽  
Satoshi Tanaka ◽  
Tetsuya Fukuhara ◽  
Hirohide Demura ◽  
...  
Keyword(s):  
Surface Roughness ◽  
High Surface ◽  
Thermal Inertia ◽  
Thermal Infrared ◽  
Shape Model ◽  
Infrared Imager ◽  
Least Squares Fit ◽  
Temperature Maps ◽  
Pixel Scale ◽  
Thermal Infrared Imager

AbstractThe thermal infrared imager (TIR) onboard the Hayabusa2 spacecraft performed thermographic observations of the asteroid 162173 Ryugu (1999 JU$$_3$$ 3 ) from June 2018 to November 2019. Our previous reports revealed that the surface of Ryugu was globally filled with porous materials and had high surface roughness. These results were derived from making the observed temperature maps of TIR using a projection method onto the shape model of Ryugu as geometric corrections. The pointing directions of TIR were calculated using an interpolation of data from the SPICE kernels (NASA/NAIF) during the periods when the optical navigation camera (ONC) and the light detection and ranging (LIDAR) observations were performed. However, the mapping accuracy of the observed TIR images was degraded when the ONC and LIDAR were not performed with TIR. Also, the orbital and attitudinal fluctuations of Hayabusa2 increased the error of the temperature maps. In this paper, to solve the temperature image mapping problems, we improved the correction method by fitting all of the observed TIR images with the surface coordinate addressed on the high-definition shape model of Ryugu (SFM 800k v20180804). This correction adjusted the pointing direction of TIR by rotating the TIR frame relative to the Hayabusa2 frame using a least squares fit. As a result, the temperature maps spatially spreading areas were converged within high-resolved $$0.5^\circ$$ 0 . 5 ∘ by $$0.5^\circ$$ 0 . 5 ∘ maps. The estimated thermal inertia, for instance, was approximately 300$$\sim$$ ∼ 350 Jm$$^{-2}$$ - 2 s$$^{-0.5}$$ - 0.5 K$$^{-1}$$ - 1 at the hot area of the Ejima Saxum. This estimation was succeeded in case that the surface topographic features were larger than the pixel scale of TIR. However, the thermal inertia estimation of smooth terrains, such as the Urashima crater, was difficult because of surface roughness effects, where roughness was probably much smaller than the pixel scale of TIR.

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

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