scholarly journals Electrical Dielectric Authorship of Polyvinyl-Acetate and Toluene Diisocyanate (PVA-TDI) with Manufactured Sulfonated Phenol-formaldehyde (SPF) Viscous Mass Material Composite

2017 ◽  
Vol 14 (2) ◽  
pp. 418-426
Author(s):  
Baghdad Science Journal
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
Polyvinyl Acetate ◽  
Phenol Formaldehyde ◽  
Dissipation Factor ◽  
Toluene Diisocyanate ◽  
Total Conductivity ◽  
Viscous Mass ◽  
The Fourier Transform ◽  
Quality Factor Q

The electrical insulation of the manufacture sulfonated phenol-formaldehyde viscous material (product) has been studied with Polyvinyl-acetate (PVA) and toluene diisocyanate (TDI) blend has been prepared by fixing percentage by weight 3:1 and mixed with different percentages by weight of the product sulfonated phenol formaldehyde viscous mass (SPF). The Fourier transform infrared (FTIR) spectroscopy is done on (SPF) resin powder and prepared film of PVA-TDI-SPF viscous mass. The quality factor (Q), dissipation factor (D), parallel resistance (Rp), series resistance (Rs), parallel capacitance (Cp), series capacitance (Cs) and phase shift (?) are measured. The calculated maximum dielectric constant (??) is 3.49x107 at sample (1) wt.1% SPF viscous mass to the weight of (PVA-TDI), the minimum dielectric constant is 1.12x106 at sample (3) wt.3% of SPF viscous mass to PVA-TDI weight. The maximum dielectric loss factor (??) is 3.68x107 at sample (1) and the minimum dielectric loss is 2.04x106 for sample (3). The maximum conductance is 1.06x10-4 S at sample (1) and minimum conductance is 6.64x10-6 at sample (3). The maximum frequency dependent ac. conductivity (?ac) is 2.048 S m-1 for sample (1) and the minimum is 0.113 S m-1 at sample (3). The maximum total conductivity (?t) is 126.2 S m-1 for sample (1) and minimum (?t) is 1.129 S m-1 for sample (3). The maximum independent conductivity (?dc) is 124 S m-1 for sample (1) and minimum value is 1.015 S m-1 for sample (3). The maximum capacitive reactance (Xs) is 0.83 M? at sample (5) wt.5% SPF viscous mass to PVA-TDI weight and the minimum is 0.14 M? for sample (3).

Microstructure and Microwave Dielectric Properties of BaTi4O9 Ceramics Derived from a Sol-Gel Precursor

2011 ◽  
Vol 326 ◽  
pp. 127-130
Author(s):  
Xian Li Huang ◽  
Fu Ping Wang ◽  
Ying Song
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
Sol Gel ◽  
Microwave Dielectric Properties ◽  
Sintering Process ◽  
Temperature Coefficients ◽  
Microwave Dielectric ◽  
Ceramic Samples ◽  
Quality Factor Q

In the present work, the microstructure and microwave dielectric properties of BaTi4O9 ceramics derived from a sol-gel precursor were presented. Density measuring results demonstrated that the largest densities of ceramic sample about 96.7% could be reached by virtue of a cool iso-static press and a sintering process at at 1300 °C for 6 hours. The dielectric constant (εr), quality factor (Q×f) and the temperature coefficients (τf) of the BaTi4O9 ceramic samples were 36.65, 28000 GHz, +20.2 ppm/°C, respectively. XRD, SEM and XPS were used to characterize the microstructure of the ceramics samples. Substantial Ti3+ was proposed to be the cause of dielectric loss.

scholarly journals The Effects of TDI on Selected Properties of Ester Epoxy Alkyd Varnish

2020 ◽  
Vol 36 (4) ◽  
Author(s):  
Nguyen Trung Thanh
Keyword(s):  
Dielectric Constant ◽  
Electrical Properties ◽  
Dielectric Loss ◽  
Heat Resistance ◽  
Epoxy Resin ◽  
Breakdown Voltage ◽  
Toluene Diisocyanate

This article presents the effects of toluene diisocyanate (TDI) on electrical properties of ester epoxy alkyd varnish. Through testing on breakdown voltage, dielectric constant, block resistivity, Tang (Tg) dielectric loss, the electrical properties of varnish were investigated. When TDI amount increased from to 4 - 10 (w/100w of epoxy resin), the breakdown voltage increased from 21.78 to 65.69 KV/mm. With TDI of 8 - 10 w/w, the dielectric constant was the best, about 2.78 - 3.02. With TDI of 8 w/w, the block resistivity was 6.8.1014 W.cm and Tg dielectric loss was 0.0069. The article also presents the effect of TDI on solvent- and heat resistance of the varnish.

Dielectric Properties of Importance in Operations of Post-harvest of Sorghum

2017 ◽  
Vol 13 (4) ◽  
Author(s):  
Caciano P. Z. Noreña ◽  
Carlos E. Lescano-Anadón
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Electrical Properties ◽  
Dielectric Loss ◽  
Moisture Content ◽  
Loss Factor ◽  
Dissipation Factor ◽  
Post Harvest ◽  
Moisture Contents ◽  
And Storage

Abstract The knowledge of electrical properties and their relationship with moisture content is of great importance in operations of post-harvest and storage in grains. The dielectric properties of sorghum samples were studied at different moisture contents and temperatures (25 at 41 °C), at frequencies of 1 and 10 kHz. In order to measure changes in the capacitance and dissipation factor of the samples, the method of impedance bridge was used. Both the dielectric constant and the dielectric loss factor of the samples increased with increasing moisture content and temperature; however, they decreased with increasing frequency. Models were proposed to relate the dielectric properties to either the moisture (exponential and polynomial) or temperature (linear).

scholarly journals THE EFFECT OF NANO ZnO MORPHOLOGY ON STRUCTURE, DIELECTRIC CONSTANT, AND DISSIPATION FACTOR OF CA-NANO ZnO/ITO FILMS

2018 ◽  
Vol 10 (2) ◽  
pp. 65 ◽  
Author(s):  
Ayu Azrurin Mustikasari ◽  
Markus Diantoro ◽  
Nandang Mufti ◽  
Risa Suryana
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
Dielectric Material ◽  
Composite Films ◽  
Morphological Difference ◽  
Dissipation Factor ◽  
High Porosity ◽  
Natural Polymers ◽  
Nano Zno ◽  
Ito Glass

<p>Research to utilize natural polymers continues to be driven primarily by utilization as an environmental friendly energy-generating and storage material. The high porosity makes cellulose acetate (CA) a good candidate as a dielectric material as the basis of the supercapacitor device. Various dopants and compositions have been widely used, but the nano size morphological differences of the same material are rarely reported. Two types of ZnO are prepared, i.e., nanoparticles and nanorods deposited with CA and deposited on ITO glass substrate. The CA-ZnO / ITO composite film was fabricated through spin coating technique. This study focused on ZnO morphological difference on the microstructure and the dielectricity of CA-ZnO /ITO composite films. The morphology of nanoparticles and nanorods of ZnO were analyzed more detail with respect to its microstructure and dielectric properties. It is revealed that the change of ZnO morphology from nanoparticles to nanorod increase the capacitance and dielectric constant significantly from the order of the nano to the micro and decrease the dielectric loss. The dielectric constant of CA-ZnONP/ITO and CA-ZnONR/ITO are respectively of 2569 and 97159 at 100 Hz. The capacitance and dielectric loss of CA-ZnONP/ITO and CA-ZnONR/ITO reach to 69.809 nF; 678 and 2,15765 µF; 13,23 respectively. </p>

scholarly journals Dielectric Behavior of Medical PMMA Polymer Filled With Copper Nanobud Particles

2019 ◽  
Vol 8 (3) ◽  
pp. 50-56
Author(s):  
I. I. Marhoon ◽  
A. H. Majeed ◽  
M. A. Abdulrehman
Keyword(s):  
Dielectric Constant ◽  
Composite Materials ◽  
Dielectric Loss ◽  
Average Particle Size ◽  
Weight Fraction ◽  
Dissipation Factor ◽  
Dielectric Behavior ◽  
Nano Particles ◽  
Average Particle ◽  
Vis Spectroscopy

In this paper, the effect of weight fraction and frequency on dielectric properties of polymethylmethacrylate filled with copper nanobud particles is studied. copper nano particles were synthesized by chemical reduction method. The resultant copper nano particles were characterized by UV-Vis spectroscopy and X-ray diffraction (XRD). Results show that the Cu Nps have bud shapes, and their average particle size obtained from the XRD study is 53.78 nm. For the resultant composite materials, such as the dielectric behavior of composite materials reinforced with 5%, 10%, 15%, and 20% weight fractions of copper nanobud particles and frequency ranges of 50, 250, 103, 104, 105, and 106 Hz at 25 °C were investigated. Results reveal that the dielectric constant, dielectric loss factor, and dissipation factor increased with the increase in weight fraction of copper nanobud particles due to their high conductivity. The dielectric constant, dielectric loss, and dissipation factor decreased with the increase in frequency.

Thick Film Capacitors with Variable Tc on Cu Foils

2008 ◽  
Vol 1075 ◽  
Author(s):  
Byeong Kon Kim ◽  
Dong Joo Shin ◽  
Jun Kwang Song ◽  
Yong Soo Cho
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
Low Temperature ◽  
Thick Film ◽  
Dissipation Factor ◽  
Embedded Capacitors ◽  
High K ◽  
Dielectric Performance ◽  
Cu Foil ◽  
High K Dielectric

ABSTRACTHigh k dielectric thick films, consisting of BaTiO3, a low softening glass and fluoride compounds, were studied to apply them as potential low temperature N2-fireable capacitors on commercially-available Cu foils. Different additive combinations of LiF, ZnF2 and BaF2 were specifically compared in terms of dielectric constant, dielectric loss and Curie temperature (Tc) for the purpose of optimizing dielectric performance. The thick film consisting of 95BaTiO3-1.5LiF-1.5ZnF2-2 bismuth borosilicate glass exhibited the best performance, i.e., a dielectric constant of 2,382 and a dissipation factor of 0.021 at Tc of 27°C at the firing temperature of 950°C. This result can be regarded as one of the best performance, compared to literature reported on embedded capacitors in Cu-PCB applications. No apparent Cu-diffusion was detected across the Cu-thick film-Cu foil structure.

Skin–core structured fluorinated MWCNTs: a nanofiller towards a broadband dielectric material with a high dielectric constant and low dielectric loss

2018 ◽  
Vol 6 (9) ◽  
pp. 2370-2378 ◽  
Author(s):  
Yang Liu ◽  
Cheng Zhang ◽  
Benyuan Huang ◽  
Xu Wang ◽  
Yulong Li ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
High Dielectric Constant ◽  
Dielectric Material ◽  
Epoxy Composite ◽  
Low Dielectric ◽  
High Dielectric

A novel skin–core structured fluorinated MWCNT nanofiller was prepared to fabricate epoxy composite with broadband high dielectric constant and low dielectric loss.

Enhanced dielectric properties and thermostability in polyimide composites with core-shell structured polyimide@BaTiO3 nanoparticles

2021 ◽  
pp. 095400832199352
Author(s):  
Wei Deng ◽  
Guanguan Ren ◽  
Wenqi Wang ◽  
Weiwei Cui ◽  
Wenjun Luo
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
Energy Density ◽  
Breakdown Strength ◽  
In Situ Polymerization ◽  
Dielectric Materials ◽  
High Energy ◽  
Amic Acid ◽  
High Energy Density ◽  
Core Shell

Polymer composites with high dielectric constant and thermal stability have shown great potential applications in the fields relating to the energy storage. Herein, core-shell structured polyimide@BaTiO3 (PI@BT) nanoparticles were fabricated via in-situ polymerization of poly(amic acid) (PAA) and the following thermal imidization, then utilized as fillers to prepare PI composites. Increased dielectric constant with suppressed dielectric loss, and enhanced energy density as well as heat resistance were simultaneously realized due to the presence of PI shell between BT nanoparticles and PI matrix. The dielectric constant of PI@BT/PI composites with 55 wt% fillers increased to 15.0 at 100 Hz, while the dielectric loss kept at low value of 0.0034, companied by a high energy density of 1.32 J·cm−3, which was 2.09 times higher than the pristine PI. Moreover, the temperature at 10 wt% weight loss reached 619°C, demonstrating the excellent thermostability of PI@BT/PI composites. In addition, PI@BT/PI composites exhibited improved breakdown strength and toughness as compared with the BT/PI composites due to the well dispersion of PI@BT nanofillers and the improved interfacial interactions between nanofillers and polymer matrix. These results provide useful information for the structural design of high-temperature dielectric materials.

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