scholarly journals Analysis for the heat transfer of fully tempered vacuum glazing based on the thermal resistance model and finite element model

2018 ◽  
Vol 10 (9) ◽  
pp. 168781401879598 ◽  
Author(s):  
Dongfang Hu ◽  
Yichen Li ◽  
Chang Liu ◽  
Yanbing Li

The fully tempered vacuum glazing, consisting of two fully tempered glass plates detached through a limited vacuum medium (below 0.01 Pa), is presented. The heat transfer through fully tempered vacuum glazing is complex, including heat conduction, thermal radiation, and convection. To analyze heat conduction through a stainless steel support ball, the thermal resistance of the support ball is established based on Hertzian contact model. And the total thermal resistance of the unit cell with one support ball is defined. The three-dimensional finite element model for a center unit cell of fully tempered vacuum glazing is simulated to validate the result of the total thermal resistance. The simulation transmission U-values are 0.26 W/m2 K. Meanwhile, the simulation transmission U-values of entire fully tempered vacuum glazing are 0.84 W/m2 K without frame insulation.

2020 ◽  
Vol 26 (9) ◽  
pp. 1627-1635
Author(s):  
Dongqing Yang ◽  
Jun Xiong ◽  
Rong Li

Purpose This paper aims to fabricate inclined thin-walled components using positional wire and arc additive manufacturing (WAAM) and investigate the heat transfer characteristics of inclined thin-walled parts via finite element analysis method. Design/methodology/approach An inclined thin-walled part is fabricated in gas metal arc (GMA)-based additive manufacturing using a positional deposition approach in which the torch is set to be inclined with respect to the substrate surface. A three-dimensional finite element model is established to simulate the thermal process of the inclined component based on a general Goldak double ellipsoidal heat source and a combined heat dissipation model. Verification tests are performed based on thermal cycles of locations on the substrate and the molten pool size. Findings The simulated results are in agreement with experimental tests. It is shown that the dwell time between two adjacent layers greatly influences the number of the re-melting layers. The temperature distribution on both sides of the substrate is asymmetric, and the temperature peaks and temperature gradients of points in the same distance from the first deposition layer are different. Along the deposition path, the temperature distribution of the previous layer has a significant influence on the heat dissipation condition of the next layer. Originality/value The established finite element model is helpful to simulate and understand the heat transfer process of geometrical thin-walled components in WAAM.


Author(s):  
Amir Khalilollahi ◽  
Russell L. Warley ◽  
Oladipo Onipede

Boards made of composites are susceptible of structural failure or irreversible damage under thermally raised stresses. A thermal/structural finite element model is integrated in this study to enable the predictions of the temperature and stress distribution of vertically clamped parallel circuit boards that include series of symmetrically mounted heated electronic modules (chips). The board is modeled as a thin plate containing four heated flush rectangular areas that represent the electronic modules. The finite element model should be to able to accept the convection heat transfer on the board surface, heat generation in the modules, and directional conduction inside the board. A detailed 3-D CFD model is incorporated to predict the conjugate heat transfer coefficients that strongly affect the temperature distribution in the board and modules. Structural analyses are performed by a FE model that uses the heat transfer coefficients mentioned above, and structural elements capable of handling orthotropic material properties. The stress fields are obtained and studied for the models possessing two and there laminates with different fiber orientations, and inter-fiber angles. Appreciable differences in values of max stress intensity were observed as the fiber orientation and inter-fiber angle changed. The angular parameters in this study were guided by experimental design (DOE) concepts leading to a metamodel of the stress intensity in the board. The optimum design variables found by the equations of the metamodel.


2014 ◽  
Vol 1008-1009 ◽  
pp. 583-587
Author(s):  
Rui Bo Su ◽  
Peng Wang ◽  
Gang Liu ◽  
Peng Yu Wang

This paper first describes a variety of heat transfer which exists in cable’s discharge pipe laying process, and analyzes the entire heat transfer process of 10kV three core cable in a two-dimensional interface qualitatively according to the heat transfer ways. Meanwhile, a finite element model of 10kV three-core cable’s discharged pipe-laying is established, and its temperature field equations and boundary condition equations has been discussed. Finally, we get the heat transfer process of the three core cable’s pipe-laying discharged and a finite element model which can be applied to simulated calculation.


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