scholarly journals Ductile grinding of Silicon carbide in high speed grinding

2016 ◽  
Vol 10 (2) ◽  
pp. JAMDSM0020-JAMDSM0020 ◽  
Author(s):  
Chongjun WU ◽  
Beizhi LI ◽  
Jingzhu PANG ◽  
Steven Y. LIANG
Keyword(s):  
Silicon Carbide ◽  
High Speed ◽  
Ductile Grinding ◽  
High Speed Grinding

Experimental Investigations on Cylindrical Grinding Temperature of Silicon Carbide

2015 ◽  
Vol 1120-1121 ◽  
pp. 1251-1256 ◽  
Author(s):  
Chong Jun Wu ◽  
Bei Zhi Li ◽  
Steven Y. Liang ◽  
Jian Guo Yang
Keyword(s):  
Silicon Carbide ◽  
High Speed ◽  
Ground Surface ◽  
High Energy ◽  
Dynamics Simulation ◽  
Distribution Model ◽  
Experimental Investigations ◽  
Grinding Temperature ◽  
Temperature Characteristics ◽  
High Speed Grinding

The grinding process requires a high energy expenditure per unit volume of material removed. The high temperature generated in abrasive processes is the main factor responsible for thermal damage to a ground surface. An investigation was undertaken to explore the temperature characteristics in high speed grinding (HSG) of silicon carbide (SiC) with a vitrified diamond wheel. A grindable thermocouople technique including a NI-DAQ device will be used to measure the grinding temperature. This paper will discuss the temperature characteristics in high speed grinding of SiC in detail and give an experiment-based temperature distribution model for SiC. A molecular dynamics simulation will be used to illustrate the effect of a high loading rate on SiC material’s mechanical property, which will further elaborate its unique HSG temperature characteristics. The experimental investigation will provide more practical application support in utilizing HSG technology in a high quality ceramic grinding.

Investigation of High-Speed Nanogrinding Mechanism Based on Molecular Dynamics

2018 ◽  
Author(s):  
Yao Liu ◽  
Beizhi Li ◽  
Yihao Zheng
Keyword(s):  
Molecular Dynamics ◽  
Silicon Carbide ◽  
Brittle Material ◽  
High Speed ◽  
Ground Surface ◽  
Wheel Speed ◽  
Depth Of Cut ◽  
Silicon Carbide Ceramic ◽  
Ductile Grinding ◽  
Sic Ceramic

The SiC ceramic ductile grinding, which can obtain crack-free ground surface, is a challenge in brittle material machining. To understand the brittle material ductile grinding mechanism in the nanoscale, a molecular dynamics (MD) model is built to study the single diamond grit grinding silicon carbide ceramic. Through analyzing the MD simulation process, the grit forces the SiC to deform and form the chip through the plastic deformation and flow. The ground surface has no crack on the surface and damage layer thickness is less than one atom layer under the nanoscale depth of cut, which indicates the nanogrinding can achieve the pure ductile grinding for the SiC ceramic and obtain a crack-free and high-quality ground surface. Grinding force, stress, temperature, and specific energy increase with the wheel speed and depth of cut due to the higher grinding speed and a smaller depth of cut can generate a higher density of defects (vacancies, interstitial atoms, and dislocations) on the workpiece, which can make the silicon carbide ceramic more ductile. The high wheel speed is favorable for the ductile grinding.

High Speed Grinding of Advanced Ceramics: A Review

2009 ◽  
Vol 404 ◽  
pp. 11-22 ◽  
Author(s):  
Han Huang
Keyword(s):  
Silicon Carbide ◽  
Silicon Nitride ◽  
Material Removal ◽  
High Speed ◽  
Advanced Ceramics ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms ◽  
High Speed Grinding

In this paper, the characteristics of high speed grinding of advanced ceramics, including alumina, alumina-titania, zirconia, silicon nitride and silicon carbide, were reviewed. The associated material removal mechanisms were discussed. Pragmatic technologies for the high speed grinding of advanced ceramics were also presented.

Effect of Powder-Mixed Dielectric on EDM Process Performance

2020 ◽  
Vol 38 (8A) ◽  
pp. 1226-1235
Author(s):  
Safa R. Fadhil ◽  
Shukry. H. Aghdeab
Keyword(s):  
Silicon Carbide ◽  
High Speed ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
High Speed Steel ◽  
Transformer Oil ◽  
Dielectric Fluid ◽  
Peak Current ◽  
Powder Concentration ◽  
Pulse On Time

Electrical Discharge Machining (EDM) is extensively used to manufacture different conductive materials, including difficult to machine materials with intricate profiles. Powder Mixed Electro-Discharge Machining (PMEDM) is a modern innovation in promoting the capabilities of conventional EDM. In this process, suitable materials in fine powder form are mixed in the dielectric fluid. An equal percentage of graphite and silicon carbide powders have been mixed together with the transformer oil and used as the dielectric media in this work. The aim of this study is to investigate the effect of some process parameters such as peak current, pulse-on time, and powder concentration of machining High-speed steel (HSS)/(M2) on the material removal rate (MRR), tool wear rate (TWR) and the surface roughness (Ra). Experiments have been designed and analyzed using Response Surface Methodology (RSM) approach by adopting a face-centered central composite design (FCCD). It is found that added graphite-silicon carbide mixing powder to the dielectric fluid enhanced the MRR and Ra as well as reduced the TWR at various conditions. Maximum MRR was (0.492 g/min) obtained at a peak current of (24 A), pulse on (100 µs), and powder concentration (10 g/l), minimum TWR was (0.00126 g/min) at (10 A, 100 µs, and 10 g/l), and better Ra was (3.51 µm) at (10 A, 50 µs, and 10 g/l).

Simulation and Experiment on the Residual Stress in Super-High Speed Grinding

2010 ◽  
Vol 135 ◽  
pp. 238-242
Author(s):  
Yue Ming Liu ◽  
Ya Dong Gong ◽  
Wei Ding ◽  
Ting Chao Han
Keyword(s):  
Residual Stress ◽  
High Speed ◽  
Element Model ◽  
Residual Stress Distribution ◽  
X Ray Diffraction ◽  
Machined Surface ◽  
X Ray ◽  
High Speed Grinding ◽  
Simulation And Experiment ◽  
Cylindrical Workpiece

In this paper, effective finite element model have been developed to simulation the plastic deformation cutting in the process for a single particle via the software of ABAQUS, observing the residual stress distribution in the machined surface, the experiment of grinding cylindrical workpiece has been brought in the test of super-high speed grinding, researching the residual stress under the machined surface by the method of X-ray diffraction, which can explore the different stresses from different super-high speed in actual, and help to analyze the means of reducing the residual stresses in theory.

Explosion accident analysis of ultra-high-speed grinding wheel

2020 ◽  
pp. 105209
Author(s):  
Yao Wu ◽  
Pan Lu ◽  
Feihong Lin ◽  
Wencheng Bao ◽  
Meina Qu ◽  
...  
Keyword(s):  
High Speed ◽  
Grinding Wheel ◽  
Accident Analysis ◽  
Ultra High Speed ◽  
High Speed Grinding
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