Sensor fusion of phase measuring profilometry and stereo vision for three-dimensional inspection of electronic components assembled on printed circuit boards

2009 ◽  
Vol 48 (21) ◽  
pp. 4158 ◽  
Author(s):  
Deokhwa Hong ◽  
Hyunki Lee ◽  
Min Young Kim ◽  
Hyungsuck Cho ◽  
Jeon Il Moon
Keyword(s):  
Sensor Fusion ◽  
Stereo Vision ◽  
Printed Circuit Boards ◽  
Three Dimensional ◽  
Circuit Boards ◽  
Electronic Components ◽  
Dimensional Inspection ◽  
Printed Circuit ◽  
Phase Measuring Profilometry

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

2021 ◽  
Author(s):  
Alexander Otto ◽  
Eberhard Kaulfersch ◽  
Prashant Kumar Singh ◽  
Claudio Romano ◽  
Marcus Hildebrandt ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Experimental Methods ◽  
Accelerated Ageing ◽  
Deformation Analysis ◽  
Electronic Control ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit ◽  
Early Warning Indicators ◽  
Warning Indicators

Abstract Canary structures being used as early warning indicators represent an important tool for condition and health monitoring of electronic components and systems. In this paper, printed circuit boards with canary structures based on SMD 2512 ceramic chip resistors with reduced solder pad sizes were studied. Focus of these investigations was set on thermo-mechanical and mechanical stresses caused by passive thermal cycling as well as by vibrational loads. For this purpose, experimental methods such as deformation analysis and accelerated ageing tests as well as finite element based methods were applied. In addition, an outlook on the implementation of these canary structures into dual inverter electronic control boards for electrical powertrain applications will be given.

scholarly journals Dismantling of Waste Printed Circuit Boards with the Simultaneous Recovery of Copper: Experimental Study and Process Modeling

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5186
Author(s):  
Szabolcs Fogarasi ◽  
Árpád Imre-Lucaci ◽  
Florica Imre-Lucaci
Keyword(s):  
Environmental Performance ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Different Types ◽  
Leaching Solution ◽  
The Impact

The study was carried out with the aim to demonstrate the applicability of a combined chemical–electrochemical process for the dismantling of waste printed circuit boards (WPCBs) created from different types of electronic equipment. The concept implies a simple and less polluting process that allows the chemical dismantling of WPCBs with the simultaneous recovery of copper from the leaching solution and the regeneration of the leaching agent. In order to assess the performance of the dismantling process, various tests were performed on different types of WPCBs using the 0.3 M FeCl3 in 0.5 M HCl leaching system. The experimental results show that, through the leaching process, the electronic components (EC) together with other fractions can be efficiently dismounted from the surface of WPCBs, with the parallel electrowinning of copper from the copper rich leaching solution. In addition, the process was scaled up for the dismantling of 100 kg/h WPCBs and modeled and simulated using process flow modelling software ChemCAD in order to assess the impact of all steps and equipment on the technical and environmental performance of the overall process. According to the results, the dismantling of 1 kg of WPCBs requires a total energy of 0.48 kWh, and the process can be performed with an overall low environmental impact based on the obtained general environmental indexes (GEIs) values.

Selective Desoldering Separation of Tin–Lead Alloy for Dismantling of Electronic Components from Printed Circuit Boards

2015 ◽  
Vol 3 (8) ◽  
pp. 1696-1700 ◽  
Author(s):  
Xiaojiao Zhang ◽  
Jie Guan ◽  
Yaoguang Guo ◽  
Xingru Yan ◽  
Hao Yuan ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Lead Alloy ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit

Three Dimensional Packaging of Bare IC Into Printed Circuit Boards for SIP

2003 ◽  
Author(s):  
Erik Jung ◽  
Dirk Wojakowski ◽  
Alexander Neumann ◽  
Rolf Aschenbrenner ◽  
Herbert Reichl
Keyword(s):  
Thermal Management ◽  
Printed Circuit Boards ◽  
Electrical Contact ◽  
Autonomous Systems ◽  
Three Dimensional ◽  
Circuit Boards ◽  
Passive Components ◽  
Electronic Products ◽  
Printed Circuit ◽  
Manufacturing Methods

The demand to miniaturize products especially for mobile applications and autonomous systems is continuing to drive the evolution of electronic products and manufacturing methods. To further the miniaturization of future products the integration of functions on miniaturized subsystems, i.e. System-in-Package (SiP) is a promising approach. Here, use of recent manufacturing methods allows to merge the SiP concept with a volumetric integration of IC’s. Up to now, most of the systems make use of single- or double-sided populated system carriers. A new challenge is to incorporate not only passive components, but as well active circuitry (IC’s) and the necessary thermal management. Ultra thin chips (i.e. silicon dies thinned down to <50μm total thickness) lend themselves to reach these goals. Chips with that thickness can be embedded in the dielectric layers of modern laminate PCB’s. Micro via technology allows to contact the embedded chip to the outer faces of the system circuitry. The aspects of embedding and making the electrical contact as well as the thermal management are highlighted. Results on FEM simulations and technical achievements are presented.

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