Fabrication of a composite Yb:YAG/diamond laser by use of the room-temperature-bonding technique

2013 ◽  
Author(s):  
Hiroki Togashi ◽  
Syunsuke Souma ◽  
Shinnosuke Matsumoto ◽  
Tomomi Onda ◽  
Ichiro Shoji
Keyword(s):  
Room Temperature ◽  
Bonding Technique

Low-Temperature Indium Bonding for MEMS Devices

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 002543-002566
Author(s):  
Daniel Harris ◽  
Robert Dean ◽  
Ashish Palkar ◽  
Mike Palmer ◽  
Charles Ellis ◽  
...  
Keyword(s):  
Electron Beam ◽  
Low Temperature ◽  
Room Temperature ◽  
Electron Beam Evaporation ◽  
Mems Devices ◽  
Microfabrication Technique ◽  
Mems Device ◽  
Low Temperature Bonding ◽  
Bonding Technique ◽  
Si Wafer

Low–temperature bonding techniques are of great importance in fabricating MEMS devices, and especially for sealing microfluidic MEMS devices that require encapsulation of a liquid. Although fusion, thermocompression, anodic and eutectic bonding have been successfully used in fabricating MEMS devices, they require temperatures higher than the boiling point of commonly used fluids in MEMS devices such as water, alcohols and ammonia. Although adhesives and glues have been successfully used in this application, they may contaminate the fluid in the MEMS device or the fluid may prevent suitable bonding. Indium (In) possesses the unusual property of being cold weldable. At room temperature, two sufficiently clean In surfaces can be cold welded by bringing them into contact with sufficient force. The bonding technique developed here consists of coating and patterning one Si wafer with 500A Ti, 300A Ni and 1 μm In through electron beam evaporation. A second wafer is metallized and patterned with a 500A Ti and 1 μm Cu by electron beam evaporation and then electroplated with 10 μm of In. Before the In coated sections are brought into contact, the In surfaces are chemically cleaned to remove indium-oxide. Then the sections are brought into contact and held under sufficient pressure to cold weld the sections together. Using this technique, MEMS water-filled and mercury-filled microheatpipes were successfully fabricated and tested. Additionally, this microfabrication technique is useful for fabricating other types of MEMS devices that are limited to low-temperature microfabrication processes.

scholarly journals Optimization of Binder for Improving Strength and Shatter Index of Briquettes for BOF Dust using Design of Experiments

2019 ◽  
Vol 9 (1) ◽  
pp. 6282-6287
Keyword(s):  
Low Temperature ◽  
Design Of Experiments ◽  
Room Temperature ◽  
Waste Utilization ◽  
Taguchi Technique ◽  
Plant Waste ◽  
Minimum Number ◽  
Cold Bonding ◽  
Bonding Technique ◽  
Selection Of

Effectiveness of Recycling of steel plant waste is very much dependent on agglomeration technique. Sintering, pelletization and briquetting are some of the techniques which are frequently used for waste utilization. Aim of this study is to prepare composite briquettes by cold bonding technique, by which phsico-chemical changesoccurred at room temperature or low temperature. Two binders are mixed in proportion to achieve the required properties specifically strength and shatter index. The design of experiments is used to find the proper combination of binders to get the optimum value of properties. Experimental work for the same is carried out in such a way that minimum number of experiment can give output as desired. For this ‘Design of Experiment’ methodology is applied to select the runs of experiment. After the selection of orthogonal array and experiment combinations, Taguchi technique is used with two variable (starch and molasses) and three levels (2.5%, 5% and 7.5% of each) i.e. L9 Array to analyze the results. Minitab15 software is used. Conclusion and comments are based on the same.

scholarly journals Synthesis of silver/copper nanoparticles and their metalmetal bonding property

2013 ◽  
Vol 49 (1) ◽  
pp. 65-70 ◽  
Author(s):  
Y. Kobayashi ◽  
T. Shirochi ◽  
Y. Yasuda ◽  
T. Morita
Keyword(s):  
Aqueous Solution ◽  
Citric Acid ◽  
Room Temperature ◽  
Particle Sizes ◽  
Cu Nanoparticles ◽  
Metal Bonding ◽  
Dispersing Agent ◽  
Bonding Property ◽  
Metal Metal ◽  
Bonding Technique

The present paper describes a metal-metal bonding technique using Cu nanoparticles containing Ag nanoparticles (Ag/Cu nanoparticles). The Ag/Cu nanoparticles with particle sizes of 30-85 nm and crystal sizes of 9.3 nm for Cu and 8.1 nm for Ag were produced by reducing 5.0x10-3 M Ag+ (AgClO4) and 5.0x10-3 M Cu2+ (Cu(NO3)2) simultaneously with 1.0 M hydrazine in aqueous solution containing 1.0 g/L poly(vinylpyrrolidone) as dispersing agent and 5?10-3 M citric acid as stabilizer at room temperature. Discs of metallic Cu or metallic Ag were successfully bonded under annealing at 400?C and pressurizing at 1.2 MPa for 5 min in H2 gas with help of the Ag/Cu particles. The shear strengths required for separating the bonded discs were as large as 19.7 for the Cu discs and 16.0 MPa for the Ag discs.

Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS

2000 ◽  
Vol 79 (3) ◽  
pp. 237-244 ◽  
Author(s):  
H Nakanishi ◽  
T Nishimoto ◽  
R Nakamura ◽  
A Yotsumoto ◽  
T Yoshida ◽  
...  
Keyword(s):  
Hydrofluoric Acid ◽  
Room Temperature ◽  
Bonding Technique
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