scholarly journals COMPARISON OF COOLING SCHEMES FOR HIGH HEAT FLUX COMPONENTS COOLING IN FUSION REACTORS

2015 ◽  
Vol 55 (2) ◽  
pp. 86-95 ◽  
Author(s):  
Phani Kumar Domalapally ◽  
Slavomir Entler
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Fusion Reactor ◽  
High Heat ◽  
Heat Fluxes ◽  
Fusion Reactors ◽  
High Heat Flux ◽  
Enhancing Heat Transfer

Some components of the fusion reactor receives high heat fluxes either during the startup and shutdown or during the operation of the machine. This paper analyzes different ways of enhancing heat transfer using helium and water for cooling of these high heat flux components and then conclusions are drawn to decide the best choice of coolant, for usage in near and long term applications.

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

2018 ◽  
Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Flow Boiling ◽  
Laser Diodes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Average Maximum

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.

Heat Transfer and Hydraulic Characteristics of Cooling Water in a Flat Plate Heat Sink for High Heat Flux IGBT

2016 ◽  
Author(s):  
Chang-Nian Chen ◽  
Ji-Tian Han ◽  
Wei-Ping Gong ◽  
Tien-Chien Jen
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flat Plate ◽  
Heat Sink ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Hydraulic Characteristics ◽  
Flow Rates ◽  
Plate Heat

High heat flux is very dangerous for electronic heat transfer, such as IGBT (Insulated Gate Bipolar Transistor) cooling. In order to explore and master the heat transfer and hydraulic characteristics for IGBT cooling, experiments have been carried out to study the situation mentioned above in a flat plate heat sink, which was designed for high heat flux IGBT cooling. The geometrical parameters of the test section are as follows: outline dimension 229 mm × 124 mm × 30 mm; flow channels of 229 mm × 3 mm × 4 mm in total of 20. The experiments performed at atmospheric pressure and with inlet temperatures of 25–35°C, heat fluxes of 3.5–18.9 kW/m2. The influence of temperatures, heat fluxes on IGBT surface temperature and the cooling effect of the liquid cold plate have been investigated under a range of flow rates of 280–2300 kg/m2s. It was found that the heat transfer enhancement was very obvious using this kind of small sized channel for IGBT cooling, which was tens of times of the effect than air cooling or triple of the effect than that in normal sized channels. And the heat transfer enhancement increases with increasing heat fluxes and flow rates, while it decreases with increasing inlet temperatures. Most of the experimental results show good cooling effect as expected. However, it is dangerous for the cooling system under high heat fluxes when the system starts or stops suddenly, when the Respond Time (RT) is less than 5 seconds to cut off heated power. Also, the cooling performance is bad when the heat fluxes increased greatly, which is considered as abnormal situation in operating. The effect on IGBT surface temperature of heat flux is more obvious when the average Nusselt Number is smaller. For hydraulic characteristics observed, it was found that the flow friction increased with flow rates increasing, but the pressure drops of heated flow channels ahead were slightly larger than those back, especially under large flow rates conditions. That is because the temperatures of flow heated in channels ahead are lower than those back, which causes the fluid viscosity to be higher. At last, this paper suggested a series of method for enhancing heat transfer in flat plate heat sink, and also gave some ways to avoid heat transfer dangerous situations for IGBT cooling, which can provide a basis for thermodynamic and hydraulic calculation of flat plate heat sink design and lectotype.

Prediction of Refrigerant Flow Boiling Hysteresis With an Augmented Separated-Flow Model

2016 ◽  
Author(s):  
Jianwei Gao ◽  
Hongxia Li ◽  
Saif Almheiri ◽  
TieJun Zhang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Surface Temperature ◽  
Flow Model ◽  
Flow Boiling ◽  
Separated Flow ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Boiling Hysteresis

Thermal management is essential to compact devices particularly for high heat flux removal applications. As a popular thermal technology, refrigeration cooling is able to provide relatively high heat flux removal capability and uniform device surface temperature. In a refrigeration cycle, the performance of evaporator is extremely important to the overall cooling efficiency. In a well-designed evaporator, effective flow boiling heat transfer can be achieved whereas the critical heat flux (CHF) or dryout condition must be avoided. Otherwise the device surface temperature would rise significantly and cause device burnout due to the poor heat transfer performance of film boiling. In order to evaluate the influence of varying imposed heat fluxes, saturated flow boiling in the evaporator is systematically studied. The complete refrigerant flow boiling hysteresis between the imposed heat flux and the exit wall superheat is characterized. Upon the occurrence of CHF at the evaporator wall exit, the wall heat flux redistributes due to the axial wall heat conduction, which drives the dryout point to propagate upstream in the evaporator. As a result, a significant amount of thermal energy is stored in the evaporator wall. While the heat flux starts decreasing, the dryout point moves downstream and closer to the exit. The stored heat in the wall dissipates slowly and leads to the delay in rewetting or quenching, which is the key to understand and predict the flow boiling hysteresis. In order to reveal the transient heat releasing mechanism, an augmented separated-flow model is developed to predict the moving rewetting point and minimum heat flux at the evaporator exit, and the model predictions are further validated by experimental data from a refrigeration cooling testbed.

scholarly journals Spray Cooling On Enhanced Surfaces: a Review of the Progress and Mechanisms

2021 ◽  
Author(s):  
Rui-Na Xu ◽  
Gaoyuan Wang ◽  
Peixue Jiang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Gas Flow ◽  
Rapid Development ◽  
Spray Cooling ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Next Generation ◽  
Structured Surfaces

Abstract The rapid development of electronics, energy and propulsion systems has led us to the point where their performances are limited by cooling capacities. Heat fluxes of 10~100, even over 1,000 W/cm2 need to be dissipated with minimum coolant flow rate in next-generation power electronics. Spray cooling is a high heat flux, uniform and efficient cooling technique proven effective in various applications. However, its cooling capacity and efficiency need to be further improved to meet next-generation ultrahigh-power applications. Engineering of surface properties and structures can fundamentally affect the liquid-wall interactions, thus becoming the most promising way to enhance spray cooling. However, the unclear mechanisms of surface-enhanced spray cooling cause lack of guiding principles for surface design. Here, progress in spray cooling on surfaces with structures of different scales are reviewed and their performances evaluated and compared. Spray cooling can achieve critical heat flux (CHF) above 945 W/cm2 and heat transfer coefficient (HTC) up to 57 W/cm2K on structured surfaces for pressurized nozzle and CHF and HTC up to 1250 W/cm2 and 250 W/cm2K, respectively, on a smooth surface with the assistance of secondary gas flow. CHF enhancement of 110% was achieved on hybrid micro- and nanostructured surfaces. A clear map of enhancement mechanisms is proposed after analysis. Some future concerns are also proposed. This work helps the understanding and design of engineered surfaces in spray cooling and provides insights for interdisciplinary applications of heat transfer and advanced engineering materials.

scholarly journals High heat flux flow boiling of refrigerant R236fa in parallel microchannels

2019 ◽  
Vol 196 ◽  
pp. 00062
Author(s):  
Vladimir Kuznetsov ◽  
Alisher Shamirzaev ◽  
Alexander Mordovskoy
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Flux Flow ◽  
Microchannel Heat Exchanger ◽  
Parallel Microchannels

This paper presents the results of an experimental study of the heat transfer during flow boiling of refrigerant R236fa in a horizontal microchannel heat sink. The experiments were performed using closed loop that re-circulates coolant. Microchannel heat exchanger that contains two microchannels with 2x0.4 mm cross-section was used as the test section. The dependence of average heat flux on wall superheat and critical heat flux were measured in the range of mass fluxes from 600 to 1600 kg/m2s and in the range of heat fluxes from 5 to 120 W/cm2. For heat flux greater than 60 W/cm2, nucleate boiling suppression has significant effect on the flow boiling heat transfer, and this leads to decrease of the heat transfer coefficient with heat flux grows.

Pool Boiling Heat Transfer and Bubble Dynamics Over Plain and Enhanced Microchannels

2010 ◽  
Author(s):  
Dwight Cooke ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Bubble Dynamics ◽  
Pool Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
High Heat Flux ◽  
Heat Of Evaporation ◽  
Cooling Ability

Pool boiling is of interest in high heat flux applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is not adequate to match the cooling ability provided by enhanced microchannels operating under single-phase conditions. The objective of this work is to evaluate the pool boiling performance of structured surface features etched on a silicon chip. The performance is normalized with respect to a plain chip. This investigation also focuses on the bubble dynamics on plain and structured microchannel surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism. This work is expected to lead to improved enhancement features for extending the pool boiling option to meet the high heat flux removal demands in electronic cooling applications.

scholarly journals Heat-Absorbing Capacity of High-Heat-Flux Components in Nuclear Fusion Reactors

Energies ◽  
2019 ◽  
Vol 12 (19) ◽  
pp. 3771
Author(s):  
Lee ◽  
Kim ◽  
Moon ◽  
Lim ◽  
Cho
Keyword(s):  
Heat Flux ◽  
High Temperature ◽  
Fusion Reactor ◽  
Nuclear Fusion ◽  
High Heat ◽  
Thermal Design ◽  
Design Criteria ◽  
Fusion Reactors ◽  
High Heat Flux ◽  
Nuclear Fusion Reactor

Nuclear fusion energy is a solution to the substitution of fossil fuels and the global energy deficit. However, among the several problems encountered for realizing a nuclear fusion reactor, the divertor presents difficulties due to the tremendous heat flux (~10 MW/m2) from high-temperature plasma. Also, neutrons produce additional heat (~17.5 MW/m3) from collisions with the materials’ atoms. This may lead to unexpected effects such as thermal failure. Thus, a comprehensive investigation on the divertor module is needed to determine the heat-absorbing capacity of the divertor module so to maintain the effect of incident heat flux. In this study, using an analytical approach and a simulation, the quantitative effect of heat generation on the thermophysical behavior, such as temperature and thermal stress, was analyzed while maintaining the incident heat flux. Then, a correlated equation was derived from the thermal design criteria, namely, the maximum thimble temperature and the safety factor at the vulnerable point. Finally, on the basis of the thermal design criteria, the heat-absorbing capacity of a nuclear fusion reactor in operating conditions was determined. This study contributes to the understanding of the divertor’s effects in nuclear fusion reactors for high-heat-flux and high-temperature applications.

High Heat Flux With Small Scale Monodisperse Sprays

2012 ◽  
Vol 134 (12) ◽  
Author(s):  
Sergio Escobar-Vargas ◽  
Jorge E. Gonzalez ◽  
Drazen Fabris ◽  
Ratnesh Sharma ◽  
Cullen Bash
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Film Thickness ◽  
Liquid Film ◽  
Heat Dissipation ◽  
High Heat ◽  
Heat Fluxes ◽  
Liquid Film Thickness ◽  
Small Scale ◽  
High Heat Flux

This work is aimed at cooling small surfaces (1.3 mm × 2 mm and 3 mm × 5 mm) using spray from thermal ink jet (TIJ) atomizers. Particular interests in this work include obtaining heat fluxes near the critical heat flux (CHF), understanding the correlation between the heat dissipation efficiency (η) and the liquid film thickness (δ) through experimental data, and understanding the primary mode of heat transfer on spray cooling at different liquid film thickness. Current experimental results indicate that high heat fluxes (∼4 × 107 W/m2) are obtained for controlled conditions of cooling mass flow rate, higher efficiencies are achieved at smaller liquid film thickness (δ ≈ 5 μm → η ≈ 0.9), and the heat transfer by conduction through the film becomes dominant as δ decreases.

Pool Boiling Heat Transfer and Bubble Dynamics Over Plain and Enhanced Microchannels

2011 ◽  
Vol 133 (5) ◽  
Author(s):  
Dwight Cooke ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
Bubble Dynamics ◽  
Pool Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Silicon Chips ◽  
Heat Of Evaporation

Pool boiling is of interest in high heat flux applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is not adequate to match the cooling ability provided by enhanced microchannels operating under single-phase conditions. The objective of this work is to evaluate the pool boiling performance of structured surface features etched on a silicon chip. The performance is normalized with respect to a plain chip. This investigation also focuses on the bubble dynamics on plain and structured microchannel surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism. It was determined that surface modifications to silicon chips can improve the heat transfer coefficient by a factor up to 3.4 times the performance of a plain chip. Surfaces with microchannels have shown to be efficient for boiling heat transfer by allowing liquid to flow through the open channels and wet the heat transfer surface while vapor is generated. This work is expected to lead to improved enhancement features for extending the pool boiling option to meet the high heat flux removal demands in electronic cooling applications.

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