scholarly journals Three-Dimensional Reconstructed Image of Electrical Tree using Serial Sectioning Method and its Fractal Characteristics

1994 ◽  
Vol 114 (1) ◽  
pp. 47-52 ◽  
Author(s):  
Satoru Maruyama ◽  
Shozo Kobayashi ◽  
Katsutoshi Kudo
Keyword(s):  
Three Dimensional ◽  
Reconstructed Image ◽  
Serial Sectioning ◽  
Sectioning Method ◽  
Electrical Tree ◽  
Fractal Characteristics

Three-Dimensional Observation of Internal Defects in a β-Ga2O3 (001) Wafer Using the FIB–SEM Serial Sectioning Method

2020 ◽  
Vol 49 (9) ◽  
pp. 5190-5195
Author(s):  
Kenichi Ogawa ◽  
Naoya Ogawa ◽  
Ryo Kosaka ◽  
Toshiyuki Isshiki ◽  
Yongzhao Yao ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Serial Sectioning ◽  
Internal Defects ◽  
Sectioning Method

Three-dimensional characterization of ODS ferritic steel using by FIB-SEM serial sectioning method

Microscopy ◽  
2014 ◽  
Vol 63 (suppl 1) ◽  
pp. i23.1-i23 ◽  
Author(s):  
T. Endo ◽  
Y. Sugino ◽  
N. Ohono ◽  
S. Ukai ◽  
N. Miyazaki ◽  
...  
Keyword(s):  
Ferritic Steel ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Sectioning Method

scholarly journals Heat treatment effects on three-dimensional morphology of chromium carbide in AISI D2 tool steel studied by serial sectioning method

2018 ◽  
Author(s):  
Seyedeh Mastooreh Seyedi Ghezghapan
Keyword(s):  
Heat Treatment ◽  
Chromium Carbide ◽  
Tool Steel ◽  
Treatment Effects ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Tempering Temperature ◽  
Sectioning Method ◽  
Aisi D2 ◽  
Aisi D2 Tool Steel

We developed a three-dimensional microstructure analysis system based on the manual serial sectioning method to evaluate the heat treatment effects on chromium carbide size and morphology in AISI D2 tool steel. Two heat treatment factors, austenitizing and tempering temperature were investigated. The results show that increasing in austenitizing temperature leads to further carbide precipitation after the tempering process and increasing in the tempering temperature causes precipitate smaller secondary carbides even more than the primary carbides.

Analyzing the Impact of X-Ray Tomography on the Reliability of Integrated Circuits

2015 ◽  
Author(s):  
Halit Dogan ◽  
Md Mahbub Alam ◽  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Domenic Forte ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
3D Imaging ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Promising Technique ◽  
Flash Memories ◽  
X Ray ◽  
3D Information ◽  
The Impact

Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies. We perform a 3D imaging using an advanced X-ray machine on Intel flash memories, Macronix flash memories, Xilinx Spartan 3 and Spartan 6 FPGAs. Electrical functionalities are then tested in a systematic procedure after each round of tomography to estimate the impact of X-ray on Flash erase time, read margin, and program operation, and the frequencies of ring oscillators in the FPGAs. A major finding is that erase times for flash memories of older technology are significantly degraded when exposed to tomography, eventually resulting in failure. However, the flash and Xilinx FPGAs of newer technologies seem less sensitive to tomography, as only minor degradations are observed. Further, we did not identify permanent failures for any chips in the time needed to perform tomography for counterfeit detection (approximately 2 hours).

Combining Serial Sectioning, EBSD Analysis, and Image-Based Finite Element Modeling

MRS Bulletin ◽  
2008 ◽  
Vol 33 (6) ◽  
pp. 597-602 ◽  
Author(s):  
G. Spanos ◽  
D.J. Rowenhorst ◽  
A.C. Lewis ◽  
A.B. Geltmacher
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Electron Backscatter Diffraction ◽  
Three Dimensional ◽  
Research Area ◽  
Polycrystalline Materials ◽  
Serial Sectioning ◽  
3D Fem ◽  
Element Modeling ◽  
The Status

AbstractThis article first provides a brief review of the status of the subfield of three-dimensional (3D) materials analyses that combine serial sectioning, electron backscatter diffraction (EBSD), and finite element modeling (FEM) of materials microstructures, with emphasis on initial investigations and how they led to the current state of this research area. The discussions focus on studies of the mechanical properties of polycrystalline materials where 3D reconstructions of the microstructure—including crystallographic orientation information—are used as input into image-based 3D FEM simulations. The authors' recent work on a β-stabilized Ti alloy is utilized for specific examples to illustrate the capabilities of these experimental and modeling techniques, the challenges and the solutions associated with these methods, and the types of results and analyses that can be obtained by the close integration of experiments and simulations.

scholarly journals Three-Dimensional (3D) Analysis of Inclusions in Structural Alloys with Automated Serial Sectioning

2019 ◽  
Vol 25 (S2) ◽  
pp. 432-433
Author(s):  
Satya Ganti ◽  
Rachel Reed ◽  
William S. Davis ◽  
Veeraraghavan Sundar
Keyword(s):  
Three Dimensional ◽  
3D Analysis ◽  
Serial Sectioning

A technique for the study of floral development

1968 ◽  
Vol 46 (5) ◽  
pp. 720-722 ◽  
Author(s):  
Rolf Sattler
Keyword(s):  
Floral Development ◽  
Developmental Stages ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Direct Study ◽  
Floral Buds ◽  
Dimensional Picture

When floral buds are studied by serial sectioning, the obtained three-dimensional picture of the buds is a reconstruction which involves some theoretical elements. In contrast to this reconstructive method, the described technique permits the direct study of the three-dimensional developmental stages of flowers. Protoderm cells of floral apices and primordial appendages can be demonstrated.

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