scholarly journals MONOCRYSTALLINE SILICON CARBIDE WAFERS PROCESSING

2015 ◽  
Vol 25 (4) ◽  
pp. 037-050
Author(s):  
S. V. Ivenin ◽  
2015 ◽  
Vol 37 (1) ◽  
pp. 48-56 ◽  
Author(s):  
Yu. D. Filatov ◽  
A. G. Vetrov ◽  
V. I. Sidorko ◽  
O. Yu. Filatov ◽  
S. V. Kovalev ◽  
...  

CIRP Annals ◽  
2013 ◽  
Vol 62 (1) ◽  
pp. 55-58 ◽  
Author(s):  
Hiroaki Tanaka ◽  
Shoichi Shimada

2013 ◽  
Vol 35 (5) ◽  
pp. 303-308 ◽  
Author(s):  
Yu. D. Filatov ◽  
A. G. Vetrov ◽  
V. I. Sidorko ◽  
A. Yu. Filatov ◽  
S. V. Kovalev

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Benoit Hamelin ◽  
Jeremy Yang ◽  
Anosh Daruwalla ◽  
Haoran Wen ◽  
Farrokh Ayazi

AbstractMicromechanical resonators with ultra-low energy dissipation are essential for a wide range of applications, such as navigation in GPS-denied environments. Routinely implemented in silicon (Si), their energy dissipation often reaches the quantum limits of Si, which can be surpassed by using materials with lower intrinsic loss. This paper explores dissipation limits in 4H monocrystalline silicon carbide-on-insulator (4H-SiCOI) mechanical resonators fabricated at wafer-level, and reports on ultra-high quality-factors (Q) in gyroscopic-mode disk resonators. The SiC disk resonators are anchored upon an acoustically-engineered Si substrate containing a phononic crystal which suppresses anchor loss and promises QANCHOR near 1 Billion by design. Operating deep in the adiabatic regime, the bulk acoustic wave (BAW) modes of solid SiC disks are mostly free of bulk thermoelastic damping. Capacitively-transduced SiC BAW disk resonators consistently display gyroscopic m = 3 modes with Q-factors above 2 Million (M) at 6.29 MHz, limited by surface TED due to microscale roughness along the disk sidewalls. The surface TED limit is revealed by optical measurements on a SiC disk, with nanoscale smooth sidewalls, exhibiting Q = 18 M at 5.3 MHz, corresponding to f · Q = 9 · 1013 Hz, a 5-fold improvement over the Akhiezer limit of Si. Our results pave the path for integrated SiC resonators and resonant gyroscopes with Q-factors beyond the reach of Si.


Author(s):  
Qing Liu ◽  
Nian Duan ◽  
Yiqing Yu ◽  
Hui Huang ◽  
Xipeng Xu

An investigation was conducted to explore the mechanisms of the scratching of monocrystalline silicon carbide with a single diamond grit. The scratching was repeated on a silicon carbide workpiece to generate different wear shapes of the diamond grit. The forces were recorded during each scratching and the wear of the diamond grit together with the silicon carbide morphologies was monitored at a fixed interval. Based on the different diamond wear shapes determined through scratching experiments, a smoothed particle hydrodynamics method was used to simulate the scratching process. In addition to the items monitored in the experiments, the simulation was also used to analyze the change of subsurface damages on silicon carbide and to predict the mechanisms of diamond damage. It is shown that double-edged abrasive grits might lead to a better silicon carbide surface quality in scratching. The simulation results indicate that the maximum equivalent stress distribution might be used to predict the damage of the diamond grits during scratching. The findings of this article will be of benefit to the optimal selection of machining parameters and the optimal design of diamond tools for abrasive machining of monocrystalline silicon carbide.


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