Joining of silicon nitride ceramics for high-temperature applications

2000 ◽  
Vol 15 (1) ◽  
pp. 136-141 ◽  
Author(s):  
Rong-Jun Xie ◽  
Mamoru Mitomo ◽  
Li-Ping Huang ◽  
Xi-Ren Fu
Keyword(s):  
High Temperature ◽  
Silicon Nitride ◽  
Grain Boundary ◽  
Bond Strength ◽  
Room Temperature ◽  
Hot Isostatic Pressing ◽  
Joint Zone ◽  
Nitride Ceramics ◽  
High Bond ◽  
High Bond Strength

A refractory silicon nitride joint, which contains β–Si3N4 grains and grain boundary amorphous phase in the joined layer, was developed with the aid of a ceramic adhesive based on the system Si3N4–Y2O3–SiO2–Al2O3. The similarity in chemistry and microstructure between the parent ceramic and the joint zone indicates that the joining mechanism is the same as that involved in the sintering of Si3N4. The resultant joint exhibits a high bond strength of 550 MPa at 25 °C and retains a strength of 332 MPa at 1000 °C. Post-joining hot-isostatic pressing was applied to strengthen the joint, resulting in increased strengths of 668 MPa at room temperature and 464 MPa at 1000 °C.

High-Temperature Properties of Silicon Nitride with Lu-Si-O-N Grain Boundary Phases

2006 ◽  
Vol 317-318 ◽  
pp. 425-428 ◽  
Author(s):  
Yoshinobu Yamamoto ◽  
Toshiyuki Nishimura ◽  
Naoto Hirosaki ◽  
S. Guo ◽  
J. Cao ◽  
...  
Keyword(s):  
Weight Gain ◽  
High Temperature ◽  
Silicon Nitride ◽  
Grain Boundary ◽  
Strain Curve ◽  
Secondary Phase ◽  
Silicon Oxynitride ◽  
Stress Strain Curve ◽  
High Temperature Properties ◽  
Nitride Ceramics

High-temperature properties of silicon nitride ceramics with Lu-silicon-oxynitride grain boundary phases were investigated. Si3N4 powder with 1.2 mol% (SN12) and 4.8 mol% (SN48) of Lu2O3 were gas-pressure hot-pressed at 1950°C for 2 h under 20 MPa in 1 MPa N2. SN12 consisted of elongated β-Si3N4 and a secondary phase, Lu4Si2O7N2, whilst SN48 consisted of elongated β-Si3N4 and Lu4Si2O7N2 + Lu2SiO5. At 1500°C and 1600°C, the stress-strain curve of SN48 was nonlinear, whilst that of SN12 was linear, indicating that SN12 broke as a brittle fracture at these temperatures. SN12 had excellent oxidation resistance and weight gain during the oxidation at 1500°C for 1000 h was 4 g/m2. Creep lifetime of SN12 at 1500°C under tensile stress of 137 MPa exceeded 1678.5 h.

TEM Studies of Grain Boundary Films in Si3N4 Ceramics

1991 ◽  
Vol 49 ◽  
pp. 930-931
Author(s):  
H.-J. Kleebe ◽  
J.S. Vetrano ◽  
J. Bruley ◽  
M. Rühle
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Silicon Nitride ◽  
Hot Isostatic Pressing ◽  
Amorphous Film ◽  
Liquid Phase Sintering ◽  
Second Phase ◽  
High Temperature Mechanical Properties ◽  
Triple Points ◽  
Boundary Films

It is expected that silicon nitride based ceramics will be used as high-temperature structural components. Though much progress has been made in both processing techniques and microstructural control, the mechanical properties required have not yet been achieved. It is thought that the high-temperature mechanical properties of Si3N4 are limited largely by the secondary glassy phases present at triple points. These are due to various oxide additives used to promote liquid-phase sintering. Therefore, many attempts have been performed to crystallize these second phase glassy pockets in order to improve high temperature properties. In addition to the glassy or crystallized second phases at triple points a thin amorphous film exists at two-grain junctions. This thin film is found even in silicon nitride formed by hot isostatic pressing (HIPing) without additives. It has been proposed by Clarke that an amorphous film can exist at two-grain junctions with an equilibrium thickness.

Phase Relationship Studies of Silicon Nitride System—A Key to Materials Design

1992 ◽  
Vol 287 ◽  
Author(s):  
T.S. Yen ◽  
W.Y. Sun
Keyword(s):  
Elevated Temperature ◽  
Silicon Nitride ◽  
Grain Boundary ◽  
Phase Behavior ◽  
Phase Diagrams ◽  
Room Temperature ◽  
Phase Relationship ◽  
Materials Design ◽  
Basic Approach ◽  
System A

ABSTRACTAdditions and revisions to several of the most important phase diagrams and phase behavior diagrams in the silicon nitride field are reviewed in this work, with emphasis on the Y-Si-A1-O-N system. This information is further used to make observations on the promising silicon nitride systems containing either highly refractory grain boundary phases or compatible matrix phases of desirable properties. Examples are provided to illustrate the advantage of such a basic approach to materials design. Hardness, toughness, strength at room temperature and elevated temperature and even sinterability can all be improved by adopting such an approach.

Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature

2005 ◽  
Author(s):  
J. Wei ◽  
S. S. Deng ◽  
C. M. Tan
Keyword(s):  
Low Temperature ◽  
Bond Strength ◽  
Wafer Bonding ◽  
Intermediate Layer ◽  
Bonding Temperature ◽  
Sol Gel ◽  
Bond Quality ◽  
Bubble Generation ◽  
High Bond ◽  
High Bond Strength

Silicon-to-silicon wafer bonding by sol-gel intermediate layer has been performed using acid-catalyzed tetraethylthosilicate-ethanol-water sol solution. High bond strength near to the fracture strength of bulk silicon is obtained at low temperature, for example 100°C. However, The bond efficiency and bond strength of this intermediate layer bonding sharply decrease when the bonding temperature increases to elevated temperature, such as 300 °C. The degradation of bond quality is found to be related to the decomposition of residual organic species at elevated bonding temperature. The bubble generation and the mechanism of the high bond strength at low temperature are exploited.

ChemInform Abstract: Dopant Distribution in Grain-Boundary Films in Calcia-Doped Silicon Nitride Ceramics.

ChemInform ◽  
2010 ◽  
Vol 30 (13) ◽  
pp. no-no
Author(s):  
Hui Gu ◽  
Xiaoqing Pan ◽  
Rowland M. Cannon ◽  
Manfred Ruehle
Keyword(s):  
Silicon Nitride ◽  
Grain Boundary ◽  
Dopant Distribution ◽  
Nitride Ceramics ◽  
Doped Silicon ◽  
Boundary Films

Fracture Mechanics of Y2O3 Ceramics at High Temperatures

2014 ◽  
Vol 89 ◽  
pp. 88-93
Author(s):  
Marek Boniecki ◽  
Zdzislaw Librant ◽  
Władysław Wesołowski ◽  
Magdalena Gizowska ◽  
Marcin Osuchowski ◽  
...  
Keyword(s):  
Fracture Toughness ◽  
Grain Size ◽  
High Temperature ◽  
Fracture Mechanics ◽  
High Purity ◽  
Room Temperature ◽  
Bending Strength ◽  
Hot Isostatic Pressing ◽  
Temperature Changes ◽  
Four Point Bending

Fracture toughness KIc and four-point bending strength σc at high temperature (up to 1500 °C) of Y2O3 ceramics of various grain size were measured. The ceramics were prepared by pressureless air sintering and next hot isostatic pressing of high purity (99.99%) Y2O3 powder. Relative density of about 99 % was achieved. Photos of microstructures revealed small pores distributed mainly inside grains. For smallest grain size (2 - 9 μm) ceramics KIc and σc are almost constant from 20 ° to 1200 °C and next they decrease. For biggest grain size (about 44 μm) they increase up to 800 °C and next they keep constant up to 1200 °C. The micrographs analyses of fracture surfaces indicated that transgranular mode of fracture at room temperature changes to almost intergranular at higher temperatures.

Bonding of Polyethylene to Metals and Rubber with Hydrogenated Polybutadiene

1962 ◽  
Vol 35 (4) ◽  
pp. 1060-1062
Author(s):  
A. I. Yakubchik ◽  
S. Ya Grilikhes ◽  
B. I. Tikhomirov ◽  
V. S. Purlova
Keyword(s):  
Bond Strength ◽  
Adhesive Composition ◽  
High Bond ◽  
High Bond Strength ◽  
Hydrogenated Polybutadiene

Abstract The adhesive composition based on hydrogenated unbranched 1,4-polybutadiene gives a high bond strength between polyethylene and brass, and brass-plated metal, and rubber.

Evaluation of Plastic Workability Limit of Magnesium Alloy by Cavitations in High Temperature Uni and Biaxial Test

2012 ◽  
Vol 735 ◽  
pp. 67-72
Author(s):  
Kunio Funami ◽  
Daisuke Yamashita ◽  
Kohji Suzuki ◽  
Masafumi Noda
Keyword(s):  
Fine Structure ◽  
High Temperature ◽  
Magnesium Alloy ◽  
Grain Boundary ◽  
Room Temperature ◽  
Grain Boundary Sliding ◽  
Az31 Magnesium Alloy ◽  
Temperature Deformation ◽  
Alloy Plate ◽  
Boundary Sliding

Abstract. This study examined the critical plastic formability limit of a fine-structure AZ31 magnesium alloy plate under warm and high temperature based on the strength of a magnesium alloy that has cavities at room temperature. The cyclic hot free-forging process as pre-form working following rolling at a light reduction ratio fabricated a fine-structure AZ31 magnesium alloy plate. The appearance of the cavities was examined in detail together with changes in the structure and preparation methods before further damage at high temperatures with increasing uni-and biaxial plastic deformation. The allowable deformation limit in the super plasticity process can be estimated from the strength of the deformed material and forming limit diagram (FLD) at room temperature. During high-temperature deformation, cavities are produced by stress concentrations at grain boundary triple points and striation bands due to grain boundary sliding. The cavitations growth behavior is dependent upon deformation conditions, and a high percentage of large cavities occupy the sample surface as a large amount of grain boundary sliding is present, i.e., as uniform elongation grows larger, the cavity size also increases. In a case where 200% uniaxial strain was applied to a fine-grained structure material at a temperature of 623K under a strain rate of 10-4s-1, the tensile strength at room temperature decreased about 13%, and elongation was 10% less, compared with that of a material to which no load was applied due to the influence of cavities. In a case of biaxial deformation, the values were 28% lower. It is possible to draw a FLD based on the cavity incidence fraction .

scholarly journals Numerical Analysis for the Progressive Failure of Binary-Medium Interface under Shearing

2018 ◽  
Vol 2018 ◽  
pp. 1-11 ◽  
Author(s):  
Rihong Cao ◽  
Wenyu Tang ◽  
Hang Lin ◽  
Xiang Fan
Keyword(s):  
Shear Strength ◽  
Bond Strength ◽  
Normal Stress ◽  
Strength Ratio ◽  
Normal Stresses ◽  
Stress Increase ◽  
Tensile Cracks ◽  
Medium Interface ◽  
High Bond ◽  
High Bond Strength

Binary-medium specimens were fabricated using the particle flow code, and the shear strength, dilatancy, and failure behavior of the binary-medium specimens with different bond strength ratios (0.25, 0.5, 0.75, and 1.0) under different normal stresses were studied. Numerical results show that the bond strength ratio and normal stresses considerably influence the shear strengths of binary-medium interface. Shear strength increases as the bond strength ratio and normal stress increase. The dilation of interfaces with high bond strength ratios is more evident than those of interfaces with lower bond strength ratios, and the curves for the high bond strength ratio exhibit remarkable fluctuations during the residual stage. At increased normal stress and bond strength ratio, the peak dilation angle shows decreasing and increasing trends successively. In this study, the specimens exhibited three kinds of failure modes. In mode II, the sawtooth experienced shear failure, but some tensile cracks appeared on the interface of the binary-medium. In mode III, no sawtooth was cut off, indicating tensile failure on the interface. At a low bond strength ratio, damage or failure is mostly concentrated in the upper part of the model. Failure parts gradually transfer to the lower part of the model when the bond strength ratio and normal stress increase. Furthermore, evident tensile cracks occur on the interface. When the bond strength ratio reaches 1.0, the failure mode of the specimen gradually transforms from sheared-off failure to chip-off failure. The number of microcracks in the specimens indicates that the lower the bond strength ratio, the more severe the damage on the specimens.

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