A Thermodynamic Approach to Selecting Alternative Gate Dielectrics

MRS Bulletin ◽  
2002 ◽  
Vol 27 (3) ◽  
pp. 198-204 ◽  
Author(s):  
Darrell G. Schlom ◽  
Jeffrey H. Haeni

AbstractAs a first step in the identification of suitable alternative gate dielectrics for metal oxide semiconductor field-effect transistors (MOSFETs), we have used tabulated thermodynamic data to comprehensively assess the thermodynamic stability of binary oxides and nitrides in contact with silicon at temperatures from 300 K to 1600 K. Sufficient data exist to conclude that the vast majority of binary oxides and nitrides are thermodynamically unstable in contact with silicon. The dielectrics that remain are candidate materials for alternative gate dielectrics. Of these remaining candidates, the oxides have a significantly higher dielectric constant (ĸ) than the nitrides. We then extend this thermodynamic approach to multicomponent oxides comprising the candidate binary oxides. The result is a relatively small number of silicon-compatible gate dielectric materials with ĸ values substantially greater than that of SiO2 and optical bandgaps ≥ eV.

2012 ◽  
Vol 463-464 ◽  
pp. 1341-1345 ◽  
Author(s):  
Chong Liu ◽  
Xiao Li Fan

This essay aims to introduce development of gate dielectrics. In present-day society, Si-based MOS has met its physical limitation. Scientists are trying to find a better material to reduce the thickness and dimension of MOS devices. While substrate materials are required to have a higher mobility, gate dielectrics are expected to have high k, low Dit and low leakage current. I conclude dielectrics in both Si-based and Ge-based MOS devices and several measures to improve the properties of these gate dielectric materials. I also introduce studies on process in our group and some achievements we have got. Significantly, this essay points out the special interest in rare-earth oxides functioning as gate dielectrics in recent years and summarizes the advantages and problems should be resolved in future.


VLSI Design ◽  
2001 ◽  
Vol 13 (1-4) ◽  
pp. 135-143 ◽  
Author(s):  
Alexander A. Demkov ◽  
Xiaodong Zhang ◽  
Heather Loechelt

We describe a theoretical methodology for screening potential gate dielectric materials. A recently proposed method for constructing realistic structural models of the Si-dielectric interface is used to generate the Si-SiO2-Si and Si-SiON-SiO2-Si model metal-oxide-semiconductor (MOS) structures. We discuss methods to estimate the valence band discontinuity at the corresponding interface. We use Landauer's ballistic transport approach to investigate the low bias leakage through these ultrathin dielectric layers.


1999 ◽  
Vol 573 ◽  
Author(s):  
B. Gila ◽  
K N. Lee ◽  
J Laroche ◽  
F Ren ◽  
S. M. Donovan ◽  
...  

ABSTRACTReproducible fabrication of high performance metal oxide semiconductor field effect transistors (MOSFETs) from compound semiconductors will require both good interfacial electrical characteristics and good thermal stability. While dielectrics such as SiO2, AIN, and GdGaOx have demonstrated low to moderate interface state densities, questions remain about their thermal stability and reliability, particularly for use in high power or high temperature widebandgap devices. In this paper we will compare the utility of two potential gate dielectric materials: GdOx and GaOx. GdOx has been found to produce layers with excellent surface morphologies as evidenced by surface roughness of less than I nm. Stoichiometric films can be easily obtained over a range of deposition conditions, though deposition temperatures of 500°C appear to offer the optimum interfacial electrical quality. By contrast GaOx films are quite rough, polycrystalline and show poor thermal stability. Further they exhibit a range of stoichiometries depending upon deposition temperature, Ga flux and oxygen flux. This paper will describe the relationship between deposition conditions and film characteristics for both materials, and will present electrical characterization of capacitors fabricated from GdOx on Si.


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