scholarly journals Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers

2012 ◽  
Vol 1437 ◽  
Author(s):  
Gunnar B. Malm ◽  
Mohammadreza Kolahdouz ◽  
Fredrik Forsberg ◽  
Niclas Roxhed ◽  
Frank Niklaus
Keyword(s):  
Integrated Circuits ◽  
Silicon Germanium ◽  
High Performance ◽  
Large Scale ◽  
Process Integration ◽  
Low Frequency ◽  
Single Layer ◽  
Sige Layer ◽  
Frequency Noise ◽  
Wide Range

ABSTRACTSemiconductor-based thermistors are very attractive sensor materials for uncooled thermal infrared (IR) bolometers. Very large scale heterogeneous integration of MEMS is an emerging technology that allows the integration of epitaxially grown, high-performance IR bolometer thermistor materials with pre-processed CMOS-based integrated circuits for the sensor read-out. Thermistor materials based on alternating silicon (Si) and silicon-germanium (SiGe) epitaxial layers have been demonstrated and their performance is continuously increasing. Compared to a single layer of silicon or SiGe, the temperature coefficient of resistance (TCR) can be strongly enhanced to about 3 %/K, by using thin alternating layers. In this paper we report on the optimization of alternating Si/SiGe layers by advanced physically based simulations, including quantum mechanical corrections. Our simulation framework provides reliable predictions for a wide range of SiGe layer compositions, including concentration gradients. Finally, our SiGe thermistor layers have been evaluated in terms of low-frequency noise performance, in order to optimize the bolometer detectivity.

Electron microscopy study of reactively sputter-deposited Ti/N films on silicon

1992 ◽  
Vol 50 (2) ◽  
pp. 1362-1363
Author(s):  
V. C. Kannan ◽  
A. K. Singh ◽  
R. B. Irwin ◽  
S. Chittipeddi ◽  
F. D. Nkansah ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Hexagonal Phase ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Process Conditions ◽  
Tin Films ◽  
Wide Range ◽  
Fcc Phase ◽  
Circuits Vlsi

Titanium nitride (TiN) films have historically been used as diffusion barrier between silicon and aluminum, as an adhesion layer for tungsten deposition and as an interconnect material etc. Recently, the role of TiN films as contact barriers in very large scale silicon integrated circuits (VLSI) has been extensively studied. TiN films have resistivities on the order of 20μ Ω-cm which is much lower than that of titanium (nearly 66μ Ω-cm). Deposited TiN films show resistivities which vary from 20 to 100μ Ω-cm depending upon the type of deposition and process conditions. TiNx is known to have a NaCl type crystal structure for a wide range of compositions. Change in color from metallic luster to gold reflects the stabilization of the TiNx (FCC) phase over the close packed Ti(N) hexagonal phase. It was found that TiN (1:1) ideal composition with the FCC (NaCl-type) structure gives the best electrical property.

The Structure and Properties of MoSi2 Thin Film in Mos Process

1980 ◽  
Vol 38 ◽  
pp. 326-327
Author(s):  
C.K. Wu ◽  
P. Chang ◽  
N. Godinho
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
High Performance ◽  
Large Scale ◽  
Process Development ◽  
Structure And Properties ◽  
Metal Silicides ◽  
High Oxidation ◽  
Important Approach ◽  
High Oxidation Resistance

Recently, the use of refractory metal silicides as low resistivity, high temperature and high oxidation resistance gate materials in large scale integrated circuits (LSI) has become an important approach in advanced MOS process development (1). This research is a systematic study on the structure and properties of molybdenum silicide thin film and its applicability to high performance LSI fabrication.

Low Frequency Vibration Isolation Through an Active-on-Active Approach: Coupling Effects

2009 ◽  
Vol 131 (6) ◽  
Author(s):  
Qiao Sun ◽  
Robert A. Wolkow ◽  
Mark Salomons
Keyword(s):  
Vibration Isolation ◽  
Low Frequency ◽  
Noise Cancellation ◽  
Frequency Noise ◽  
Active Stage ◽  
Coupling Effects ◽  
Active Approach ◽  
Low Frequency Vibration ◽  
Wide Range ◽  
Coupling Characteristics

The extreme sensitivity of a scanning probe microscope demands an exceptional noise cancellation device that could effectively cut off a wide range of vibration noise. Existing commercial devices, although excellent in canceling high frequency noise, commonly leave low frequency vibration unattenuated. We design an add-on active stage that can function together with a standalone existing active stage. The objective is to provide a higher level of noise cancellation by lowering the overall system cut-off frequency. This study is concerned with the theoretical aspects of the coupling characteristics involved in stacking independently designed stages together to form a two-stage isolator. Whether an add-on stage would pose a stability threat to the existing stage needs to be addressed. In addition, we explore the use of coupling effects to optimize the performance of the overall system.

scholarly journals Process Design Kit and Design Automation for Flexible Hybrid Electronics

2019 ◽  
Vol 16 (3) ◽  
pp. 117-123
Author(s):  
Tsung-Ching Huang ◽  
Ting Lei ◽  
Leilai Shao ◽  
Sridhar Sivapurapu ◽  
Madhavan Swaminathan ◽  
...  
Keyword(s):  
Process Design ◽  
Design Automation ◽  
High Performance ◽  
Large Scale ◽  
Low Cost ◽  
Thin Film Transistor ◽  
Solution Process ◽  
Oxide Semiconductor ◽  
Wearable Electronics ◽  
Wide Range

Abstract High-performance low-cost flexible hybrid electronics (FHE) are desirable for applications such as internet of things and wearable electronics. Carbon nanotube (CNT) thin-film transistor (TFT) is a promising candidate for high-performance FHE because of its high carrier mobility, superior mechanical flexibility, and material compatibility with low-cost printing and solution processes. Flexible sensors and peripheral CNT-TFT circuits, such as decoders, drivers, and sense amplifiers, can be printed and hybrid-integrated with thinned (<50 μm) silicon chips on soft, thin, and flexible substrates for a wide range of applications, from flexible displays to wearable medical devices. Here, we report (1) a process design kit (PDK) to enable FHE design automation for large-scale FHE circuits and (2) solution process-proven intellectual property blocks for TFT circuits design, including Pseudo-Complementary Metal-Oxide-Semiconductor (Pseudo-CMOS) flexible digital logic and analog amplifiers. The FHE-PDK is fully compatible with popular silicon design tools for design and simulation of hybrid-integrated flexible circuits.

scholarly journals Plate-Type Acoustic Metamaterials: Experimental Evaluation of a Modular Large-Scale Design for Low-Frequency Noise Control

Acoustics ◽  
2019 ◽  
Vol 1 (2) ◽  
pp. 354-368 ◽  
Author(s):  
Linus Ang ◽  
Yong Koh ◽  
Heow Lee
Keyword(s):  
Large Scale ◽  
Noise Control ◽  
Traffic Noise ◽  
Low Frequency ◽  
Industrial Applications ◽  
Frequency Noise ◽  
Acoustic Metamaterials ◽  
Scale Design ◽  
Stress Uniformity ◽  
Plate Type

For industrial applications, the scalability of a finalised design is an important factor to consider. The scaling process of typical membrane-type acoustic metamaterials may pose manufacturing challenges such as stress uniformity of the membrane and spatial consistency of the platelet. These challenges could be addressed by plate-type acoustic metamaterials with an internal tonraum resonator. By adopting the concept of modularity in a large-scale design (or meta-panel), the acoustical performance of different specimen configurations could be scaled and modularly combined. This study justifies the viability of two meta-panel configurations for low-frequency (80–500 Hz) noise control. The meta-panels were shown to be superior to two commercially available noise barriers at 80–500 Hz. This superiority was substantiated when the sound transmission class (STC) and the outdoor-indoor transmission class (OITC) were compared. The meta-panels were also shown to provide an average noise reduction of 22.7–27.4 dB at 80–400 Hz when evaluated in different noise environments—traffic noise, aircraft flyby noise, and construction noise. Consequently, the meta-panel may be further developed and optimised to obtain a design that is lightweight and yet has good acoustical performance at below 500 Hz, which is the frequency content of most problematic noises.

scholarly journals Performance Evaluation of Modularity Based Community Detection Algorithms in Large Scale Networks

2014 ◽  
Vol 2014 ◽  
pp. 1-15 ◽  
Author(s):  
Vinícius da Fonseca Vieira ◽  
Carolina Ribeiro Xavier ◽  
Nelson Francisco Favilla Ebecken ◽  
Alexandre Gonçalves Evsukoff
Keyword(s):  
Spectral Method ◽  
Community Detection ◽  
High Performance ◽  
Large Scale ◽  
Fine Tuning ◽  
Detection Algorithms ◽  
Research Areas ◽  
Structure Detection ◽  
Wide Range ◽  
Large Scale Networks

Community structure detection is one of the major research areas of network science and it is particularly useful for large real networks applications. This work presents a deep study of the most discussed algorithms for community detection based on modularity measure: Newman’s spectral method using a fine-tuning stage and the method of Clauset, Newman, and Moore (CNM) with its variants. The computational complexity of the algorithms is analysed for the development of a high performance code to accelerate the execution of these algorithms without compromising the quality of the results, according to the modularity measure. The implemented code allows the generation of partitions with modularity values consistent with the literature and it overcomes 1 million nodes with Newman’s spectral method. The code was applied to a wide range of real networks and the performances of the algorithms are evaluated.

Analysis of low-frequency noise in boron-doped polycrystalline silicon–germanium resistors

2002 ◽  
Vol 81 (14) ◽  
pp. 2578-2580 ◽  
Author(s):  
Kun-Ming Chen ◽  
Guo-Wei Huang ◽  
D. Y. Chiu ◽  
Hsiang-Jen Huang ◽  
Chun-Yen Chang
Keyword(s):  
Silicon Germanium ◽  
Polycrystalline Silicon ◽  
Low Frequency ◽  
Frequency Noise ◽  
Low Frequency Noise ◽  
Boron Doped

scholarly journals High-Sensitivity Flexible Pressure Sensor-Based 3D CNTs Sponge for Human–Computer Interaction

Polymers ◽  
2021 ◽  
Vol 13 (20) ◽  
pp. 3465
Author(s):  
Jianli Cui ◽  
Xueli Nan ◽  
Guirong Shao ◽  
Huixia Sun
Keyword(s):  
Pressure Sensor ◽  
High Performance ◽  
Large Scale ◽  
Low Cost ◽  
Pressure Sensors ◽  
Chemical Vapor ◽  
High Sensitivity ◽  
Wearable Electronics ◽  
Wide Range ◽  
Flexible Pressure Sensors

Researchers are showing an increasing interest in high-performance flexible pressure sensors owing to their potential uses in wearable electronics, bionic skin, and human–machine interactions, etc. However, the vast majority of these flexible pressure sensors require extensive nano-architectural design, which both complicates their manufacturing and is time-consuming. Thus, a low-cost technology which can be applied on a large scale is highly desirable for the manufacture of flexible pressure-sensitive materials that have a high sensitivity over a wide range of pressures. This work is based on the use of a three-dimensional elastic porous carbon nanotubes (CNTs) sponge as the conductive layer to fabricate a novel flexible piezoresistive sensor. The synthesis of a CNTs sponge was achieved by chemical vapor deposition, the basic underlying principle governing the sensing behavior of the CNTs sponge-based pressure sensor and was illustrated by employing in situ scanning electron microscopy. The CNTs sponge-based sensor has a quick response time of ~105 ms, a high sensitivity extending across a broad pressure range (less than 10 kPa for 809 kPa−1) and possesses an outstanding permanence over 4,000 cycles. Furthermore, a 16-pixel wireless sensor system was designed and a series of applications have been demonstrated. Its potential applications in the visualizing pressure distribution and an example of human–machine communication were also demonstrated.

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