Fabrication of PLZT Film-on-Foil Dielectric Sheets for Embedded Passives

2008 ◽  
Vol 1113 ◽  
Author(s):  
Beihai Ma ◽  
Manoj Narayanan ◽  
U. Balachandran
Keyword(s):  
Printed Circuit Boards ◽  
Dielectric Film ◽  
Breakdown Strength ◽  
Electronic Devices ◽  
Circuit Boards ◽  
Passive Components ◽  
Printed Circuit ◽  
Metal Foils ◽  
Tan Δ ◽  
Loop Measurement

ABSTRACTFerroelectric film-on-foil capacitors hold special promise to replace discrete passive components in the development of electronic devices that require greater performance and smaller size. We have deposited Pb0.92La0.08Zr0.52Ti0.48O3 (PLZT) films on base metal foils to form film-on-foil capacitor sheets that can be embedded into printed circuit boards. The rootmean-square surface roughness was determined to be ≍3 nm for 1.15-μm-thick PLZT films on LaNiO3-buffered Ni foils. The following dielectric properties were measured: relative permittivity of ≍1300 and dielectric loss (tan δ) of ≍0.05, leakage current density of 6.6 × 10−9 A/cm2 at 25°C and 1.4 × 10−8 A/cm2 at 150°C, and mean breakdown strength >2.5 MV/cm. A remnant polarization (Pr) of ≍33 μC/cm2 and coercive field strength (Ec) of ≍50 kV/cm were observed with a maximum voltage of 300 V applied during the P-E loop measurement. The energy storage capability of the dielectric film is ≍45 J/cm3.

Advanced Build-up Materials and Processes for Packages with Fine Line and Space

2014 ◽  
Vol 2014 (1) ◽  
pp. 000444-000447 ◽  
Author(s):  
Yoshio Nishimura ◽  
Hirohisa Narahashi ◽  
Shigeo Nakamura ◽  
Tadahiko Yokota
Keyword(s):  
Printed Circuit Boards ◽  
Coefficient Of Thermal Expansion ◽  
High Reliability ◽  
Electronic Devices ◽  
Circuit Boards ◽  
Additive Process ◽  
Fine Line ◽  
Printed Circuit ◽  
Low Dielectric ◽  
Line Space

Printed circuit boards manufactured by a semi-additive process are widely used for packaging substrates. Along with increasing demands of downsizing electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to be miniaturized with high density of circuit wirings. We report our insulation build-up materials and processes for advanced packages with fine line/space and high reliability. The insulation materials we developed show low coefficient of thermal expansion (CTE), low dielectric loss tangent and good thinner insulation reliability. They can produce fine line and space (FLS) under 10μm pitch by a semi-additive process.

Enhanced heat transport in printed circuit boards via passive components embedding

2017 ◽  
Author(s):  
Jonathan Silvano de Sousa ◽  
Paul Fulmek ◽  
Michael Unger ◽  
Peter Haumer ◽  
Johann Nicolics
Keyword(s):  
Heat Transport ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Passive Components ◽  
Printed Circuit

Development of a versatile analytical protocol for the comprehensive determination of the elemental composition of smartphone compartments on the example of printed circuit boards

2018 ◽  
Vol 10 (31) ◽  
pp. 3864-3871 ◽  
Author(s):  
B. Bookhagen ◽  
W. Obermaier ◽  
C. Opper ◽  
C. Koeberl ◽  
T. Hofmann ◽  
...  
Keyword(s):  
Elemental Composition ◽  
Printed Circuit Boards ◽  
Electronic Devices ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Comprehensive Method ◽  
Analytical Protocol ◽  
Comprehensive Determination

A comprehensive method for the determination of metals in electronic devices was developed and tested on smartphones.

scholarly journals Development of a Physical Separation Route for the Concentration of Base Metals from Old Wasted Printed Circuit Boards

Minerals ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1014
Author(s):  
Pedro Jorge Walburga Keglevich de Buzin ◽  
Weslei Monteiro Ambrós ◽  
Irineu Antônio Schadach de Brum ◽  
Rejane Maria Candiota Tubino ◽  
Carlos Hoffmann Sampaio ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Electronic Devices ◽  
Preliminary Evidence ◽  
Composition Analysis ◽  
Base Metals ◽  
Circuit Boards ◽  
Physical Separation ◽  
Printed Circuit ◽  
Processing Circuit

Wastes from old electronic devices represent a significant part of the electronic scrap generated in developing countries, being commonly sold by collectors as low-value material to recycling hubs abroad. Upgrading the quality of this waste type could drive the revenue of recyclers, and thus, boost the recycling market. On this basis, this study investigated the possibility of concentrating metals from old wasted printed circuit boards through a physical separation-based route. Preparation of samples comprised fragmentation, size classification, density, and magnetic separation steps, followed by chemical and macro composition analysis. Cu, Al, Fe, and Sn constituted the major metals encountered in the scraps, including some peak concentrations of Zn, Sb, Pb, Ba, and Mn. Four distinct concentrate products could be obtained after suitable processing: (a) a light fraction composed of plastics and resins; (b) an aluminum concentrate; (c) a magnetic material concentrate, containing mainly iron; (d) a final concentrate containing more than 50% in mass of copper and enriched with nonferrous metals. Preliminary evidence showed that further processes, like the separation of copper wires through drumming, can potentially improve the effectiveness of the proposed processing circuit and should guide future works.

scholarly journals Extraction of Selected Metals from Waste Printed Circuit Boards by Bioleaching Acidophilic Bacteria

2021 ◽  
Vol 1 (1) ◽  
Author(s):  
Anna HOŁDA ◽  
Aldona KRAWCZYKOWSKA
Keyword(s):  
Metal Content ◽  
Printed Circuit Boards ◽  
Electronic Devices ◽  
Economic Benefits ◽  
Technological Innovations ◽  
Secondary Source ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Acidophilic Bacteria ◽  
Waste Printed Circuit Boards

Technological innovations and increased demand for electronic devices resulted in production of more and more waste with highmetal content. Worldwide, 50 million tons of WEEE (Waste from Electrical and Electronic Equipment) are generated each year. Giventhe metal content present in electrical waste (e-waste), it is considered to be an urban mine and, if properly treated, can serve as analternative secondary source of metals. Waste printed circuit boards (WPCBs) that constitute approx. 3-5% of WEEE by weight areof particular importance. They contain, on average, 30-40% of metals by weight, with higher purity than in minerals. With environmental and economic benefits in mind, increasing attention is being paid to the development of processes to recover metals and othervaluable materials from WPCBs. The research presented in the article aimed at assessing the usefulness of the biotechnological methodfor leaching of selected metals from e-waste. The results indicate that it is possible to mobilize metals from WPCBs using microorganisms such as Acidithiobacillus ferroxidans bacteria 

Three Dimensional Packaging of Bare IC Into Printed Circuit Boards for SIP

2003 ◽  
Author(s):  
Erik Jung ◽  
Dirk Wojakowski ◽  
Alexander Neumann ◽  
Rolf Aschenbrenner ◽  
Herbert Reichl
Keyword(s):  
Thermal Management ◽  
Printed Circuit Boards ◽  
Electrical Contact ◽  
Autonomous Systems ◽  
Three Dimensional ◽  
Circuit Boards ◽  
Passive Components ◽  
Electronic Products ◽  
Printed Circuit ◽  
Manufacturing Methods

The demand to miniaturize products especially for mobile applications and autonomous systems is continuing to drive the evolution of electronic products and manufacturing methods. To further the miniaturization of future products the integration of functions on miniaturized subsystems, i.e. System-in-Package (SiP) is a promising approach. Here, use of recent manufacturing methods allows to merge the SiP concept with a volumetric integration of IC’s. Up to now, most of the systems make use of single- or double-sided populated system carriers. A new challenge is to incorporate not only passive components, but as well active circuitry (IC’s) and the necessary thermal management. Ultra thin chips (i.e. silicon dies thinned down to <50μm total thickness) lend themselves to reach these goals. Chips with that thickness can be embedded in the dielectric layers of modern laminate PCB’s. Micro via technology allows to contact the embedded chip to the outer faces of the system circuitry. The aspects of embedding and making the electrical contact as well as the thermal management are highlighted. Results on FEM simulations and technical achievements are presented.

scholarly journals PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices

2013 ◽  
Vol 135 (11) ◽  
Author(s):  
Yoav Sterman ◽  
Erik D. Demaine ◽  
Neri Oxman
Keyword(s):  
Printed Circuit Boards ◽  
Electronic Materials ◽  
Electronic Devices ◽  
Circuit Boards ◽  
Light Emitting ◽  
Printed Circuit ◽  
3D Objects ◽  
Evaluation Strategies ◽  
Embedded Electronics ◽  
User Guidance

Origami is traditionally implemented in paper, which is a passive material. This research explores the use of material with embedded electronics such as printed circuit boards (PCB) as the medium for origami folding to create an interactive folding experience and to generate foldable objects with added functionalities. PCBs are produced as 2D shapes. By folding PCB arrays, it is possible to create 3D objects that contain electronic functions. Conductivity, output devices (such as light emitting diodes) and microcontroller computation can create an interactive folding experience, for user guidance and verification of the folding. We call this approach and methodology PCB origami. The work presented in this paper describes two unique interaction and fabrication techniques for creating and folding electronic materials. We demonstrate prototypes and present verification/evaluation strategies for guiding the user through the folding process.

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