Photoluminescence from Coherently Strained Si1−xGex Alloys

1990 ◽  
Vol 198 ◽  
Author(s):  
N.L. Rowell ◽  
J.-P. Noël ◽  
D.C. Houghton ◽  
D.D. Perovic

ABSTRACTAn intense, broad photoluminescence PL peak, with an internal quantum efficiency as high as 31%, has been observed from a variety of structures containing Si1−xGex strained layers on Si(100) substrates; i.e. Si1−xGex thick random alloy layers, single quantum wells (SQW) and multiple quantum wells (MQW) with layers thick enough so that zone folding effects were not relevant. This peak, which shifted consistently and predictably with Ge concentration( 0.06 < × < 0.53), had its high energy edge near the established band gap for strained SiGe. PL excitation spectroscopy indicated that no phonons were involved in the process causing the SiGe PL peak. Samples deposited at ~ 400 °C exhibited low PL intensity, whereas annealing at ~ 600 °C enhanced the intensity by as much as two orders of magnitude. This anneal treatment was found to remove grown-in defect complexes without creating a significant density of misfit dislocations. The PL peak energy at 4.2 K varied from 620 to 990 meV for Ge fractions x from 0.53 to 0.06. When the samples were forced to relax, e.g. by higher temperature annealing, the luminescence of this peak either shifted to near the relaxed bandgap or was quenched by deep, dislocation related states. Prior to such relaxation, the efficient PL was due to exciton accumulation in the strained Si1−xGex layers of single and multiple quantum wells, where the bandgap was locally reduced. It is suggested that the recombination of electrons and holes occuring within a high-density electron hole condensate (EHC) can cause the observed spectrum.

1990 ◽  
Vol 198 ◽  
Author(s):  
D.C. Houghton ◽  
N.L. Rowell

ABSTRACTThe thermal constraints for device processing imposed by strain relaxation have been determined for a wide range of Si-Ge strained heterostructures. Misfit dislocation densities and glide velocities in uncapped Sil-xGex alloy layers, Sil-xGex single and multiple quantum wells have been measured using defect etching and TEM for a range of anneal temperatures (450°C-1000°C) and anneal times (5s-2000s). The decay of an intense photoluminescence peak (∼ 10% internal quantum efficiency ) from buried Si1-xGex strained layers has been correlated with the generation of misfit dislocations in adjacent Sil-xGex /Si interfaces. The misfit dislocation nucleation rate and glide velocity for all geometries and alloy compositions (0<x<0.25) were found to be thermally activated processes with activation energies of (2.5±0.2)eV and (2.3-0.65x)eV, respectively. The time-temperature regime available for thermal processing is mapped out as a function of dislocation density using a new kinetic model.


1995 ◽  
Vol 379 ◽  
Author(s):  
K. Rammohan ◽  
D.H. Rich ◽  
A. Larsson

ABSTRACTThe temperature dependence of the cathodoluminescence (CL) originating from In0.21Ga0.79As/GaAs multiple quantum wells has been studied between 86 and 250 K. The CL intensity exhibits an Arrenhius-type dependence on temperature (T), characterized by two different activation energies. The spatial variations in activation energy caused by the presence of interfacial misfit dislocations is examined. The CL intensity dependence on temperature for T ≲ 150 K is controlled by thermally activated nonradiative recombination. For T ≳ 150 K the decrease in CL intensity is largely influenced by thermal re-emission of carriers out of the quantum wells.


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