Grain Boundaries in High Thermal Conductivity Aluminum Nitride.
Keyword(s):
ABSTRACTThe benefits of AIN as a substrate material for the electronics packaging industry appear to be limited by the deleterious effects of boundaries in the polycrystalline material. Some observations on different types of boundary in AIN using several complementary techniques are reported.
2004 ◽
Vol 85
(12)
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pp. 3093-3095
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2003 ◽
Vol 256
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pp. 288-291
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1991 ◽
Vol 74
(9)
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pp. 2242-2249
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2012 ◽
Vol 521
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pp. 101-111
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