Strain Relief in InxGa1−xAs/GaAs Multiple Layer Systems

1992 ◽  
Vol 263 ◽  
Author(s):  
V. Krishnamoorthy ◽  
Y.W. Lin ◽  
R.M. Park

ABSTRACTIn a recent paper[l] we presented the notion of a “critical composition” of InxGa1−xAs (x=0.18) which when exceeded results in threading dislocation evolution in InxGa1−xAs (x ≥ 0.18) material grown on GaAs. For InxGa1−xAs compositions below x=0.18, threading dislocation evolution occurs in the GaAs substrate material but not in the InxGa1−xAs epitaxial layer material, this phenomenon being attributed to a yield strength mismatch in favor of InxGa1−xAs at the epilayer growth temperature.In this paper we describe recent results concerning an extension of this work to the study of strain relief in multiple layer systems. It was found that large x (x-0.5) InxGa1−xAs/GaAs layers can be grown having extremely low dislocation densities (<104/cm2 ) by step increasing the InxGa1−xAs composition at a series of InxGa1−xAs/InyGa1-yAs heterointerfaces such that a “critical composition difference” is not exceeded at each heterointerface. High resolution x-ray diffraction analysis was used to determine the extent of relaxation in each layer of these multilayer systems. As evidenced by cross-sectional TEM analysis, dislocations propagate only in the underlying material at each heterointerface for suitably selected compositional differences which results in the top InxGa1−xAs layer in such multiple layer schemes having a low dislocation density. It is to be noted that conventional methods for blocking dislocations such as strained layer superlattices and compositionally graded layers were not employed in our multilayer systems.

1993 ◽  
Vol 319 ◽  
Author(s):  
A.R. Powell ◽  
S.S. Iyer ◽  
F.K. Legoues

AbstractIn this growth process a new strain relief mechanism operates, whereby the SiGe epitaxial layer relaxes without the generation of threading dislocations within the SiGe layer. This is achieved by depositing SiGe on an ultrathin Silicon On Insulator, SOl, substrate with a superficial silicon thickness less than the SiGe layer thickness. Initially, the thin Si layer is put under tension due to an equalization of the strain between the Si and SiGe layers. Thereafter, the strain created in the thin Si layer relaxes by plastic deformation. Since the dislocations are formed and glide in the thin Si layer, no threading dislocation is ever introduced into the upper SiGe material, which appeared dislocation free to the limit of the cross sectional Transmission Electron Microscopy (TEM) analysis. We thus have a method for producing very low dislocation, relaxed SiGe films with the additional benefit of an SO substrate. This buffer structure is significantly less than a micrometer in thickness and offers distinct advantages over the thick SiGe buffer layers presently in use.


Author(s):  
Ching Shan Sung ◽  
Hsiu Ting Lee ◽  
Jian Shing Luo

Abstract Transmission electron microscopy (TEM) plays an important role in the structural analysis and characterization of materials for process evaluation and failure analysis in the integrated circuit (IC) industry as device shrinkage continues. It is well known that a high quality TEM sample is one of the keys which enables to facilitate successful TEM analysis. This paper demonstrates a few examples to show the tricks on positioning, protection deposition, sample dicing, and focused ion beam milling of the TEM sample preparation for advanced DRAMs. The micro-structures of the devices and samples architectures were observed by using cross sectional transmission electron microscopy, scanning electron microscopy, and optical microscopy. Following these tricks can help readers to prepare TEM samples with higher quality and efficiency.


2012 ◽  
Vol 1430 ◽  
Author(s):  
Tatsuya Iwata ◽  
Yusuke Nishi ◽  
Tsunenobu Kimoto

ABSTRACTExact locations of conductive filaments formed in NiO-based resistive switching (RS) cells were detected by C-AFM, and their electrical as well as chemical properties were investigated. After a forming process, a part of top electrodes of Pt/NiO/Pt RS cells is deformed. NiO layers are also deformed, and conductive spots, i.e. filaments have been found preferentially along the edges of deformations. Detailed C-AFM investigation has revealed that variation of cell resistances originates from differences in size and shape of filaments, not their resistivity. Furthermore, cross-sectional TEM analysis has demonstrated that filaments determining cell resistance consist of reduced NiO with an inclusion of Pt.


1989 ◽  
Vol 148 ◽  
Author(s):  
Xiaoming Liu ◽  
Henry P. Lee ◽  
Shyh Wang ◽  
Thomas George ◽  
Eicke R. Weber ◽  
...  

ABSTRACTWe report the growth and characterizations of 31μm thick GaAs films grown on (100) InP substrates by MBE employing different buffer layer structures during the initial deposition. The buffer layer structures under study are: 1) GaAs layer grown at low temperature; 2) GaAs layer grown at low temperature plus two sets of In0.08Ga0.92As/GaAs strained layer superlattices (SLS) and 3) a transitional compositionally graded InxGal-xAs layer between the InP substrate and the GaAs film. After the buffer layer deposition, the growth was continued by conventionalMBE to a total thickness of 3μm for all samples. From the 77K photoluminescence (PL) measurement, it was found that the sample with SLS layers has the highest PL intensity and the narrowest PL linewidth. Cross-sectional transmission electron microscopy (TEM) studies showed that the SLS is effective in reducing the propagation of threading dislocations and explains the observed superior optical quality from the PL measurement.


Coatings ◽  
2019 ◽  
Vol 9 (6) ◽  
pp. 363 ◽  
Author(s):  
Ahmad Azizpour ◽  
Rainer Hahn ◽  
Fedor F. Klimashin ◽  
Tomasz Wojcik ◽  
Esmaeil Poursaeidi ◽  
...  

In this study, the effects of the microstructural properties on the deformation and damage mechanism of CrN/TiN multilayer coatings deposited on Custom 450 steel using the unbalanced reactive magnetron sputtering PVD process were studied. All coatings were fabricated with an overall thickness of 1.5 µm, but different bilayer periods (Λ). Structural and mechanical properties of coatings were investigated by XRD analysis and nanoindentation experiment, respectively. Indentation tests at three loads of 100, 300, and 450 mN were performed on the coatings’ surface and then, cross-sections of fractured imprints were analyzed with SEM and TEM. Measuring the length of the cracks induced by indentation loads and analyzing the load-displacement curves, apparent fracture energy values of multilayer coatings were calculated. We observed that multilayer systems with bilayer periods of 4.5–15 nm possess superlattice structure, which also results in higher values for Young’s modulus and hardness as well as higher fracture energy. Comparison of cross-sectional SEM and TEM observations showed that coatings with smaller bilayer periods tend to deform by shear sliding mechanism due to the existence of the long-grown columns, while short dispersed grains—growing in the coatings with a larger bilayer period—led to deformation via local grain boundary sliding and grain rotation.


1999 ◽  
Vol 5 (S2) ◽  
pp. 776-777
Author(s):  
S.J. Lloyd ◽  
J.E. Pitchford ◽  
J.M. Molina-Aldareguia ◽  
Z.H. Barber ◽  
M.G. Blamire ◽  
...  

Nanoindentation allows the hardness of thin coatings and synthetic multilayer structures to be measured, since indentation depths can be as little as a few 10s of nm. In combination with the cross-sectional transmission electron microscopy (TEM) analysis described here it is possible to observe the deformation structure under an indent, and potentially to understand deformation mechanisms on a nm scale in a wide variety of materials. Synthetic multilayers are a particularly interesting system to investigate. Variations in hardness with the multilayer compositional repeat distance (A) have been reported for several systems. The highest hardnesses, which are in excess of what a simple “rule of mixtures” would predict, occur in nitride multilayers at A ∼5nm. Here we present some preliminary results showing the deformation structure in both a monolithic NbN film and a TiN/NbN multilayer in which both components have the rQck salt structure with lattice parameters 0.424nm (TiN) and 0.439nm (NbN).


1996 ◽  
Vol 441 ◽  
Author(s):  
N. Sukidi ◽  
N. Dietz ◽  
U. Rossow ◽  
K. J. Bachmann

AbstractIn this contribution we report on the real-time monitoring of low temperature growth of epitaxial GaxIn1-xP/GaP heterostructures on Si(100) by pulse chemical beam epitaxy, using tertiary butylphosphine (TBP), triethylgallium (TEG), and trimethylindium (TMI) as source materials. Both step-graded and continuously graded heterostructures have been investigated. The composition of the GaxIn1-xP epilayers has been analyzed by various techniques including X-ray diffraction, Rutherford backscattering, Auger, and Raman spectroscopy. Good correlation has been found between X-ray diffraction, RBS, and Vegard's law compositional analysis. We used Ppolarized Reflectance Spectroscopy (PRS) and Laser Light Scattering (LLS) to monitor the growth rate and surface morphology during growth. The information gained by these techniques has been utilized in the improvement of the surface preconditioning as well as to optimize the initial heteroepitaxial nucleation and overgrowth process. We studied the optical response to the compositional changes in the surface reaction layer (SRL) during the exposure of the surface to either sequential or synchronous pulses of TEG and TMI. The cross sectional TEM analysis indicates that the synchronous exposure results in an abrupt GaxIn1-xP/GaP interface while the sequential exposure does not which may suggest a compositionally graded interlayer formation. For heteroepitaxial GaxIn1-xP films on Si, a buffer layer of GaP is found to be necessary for optimum uniformity of the GaxIn1-xP layer. The selective growth of GaxIn1-xP on Si(001) is accessed.


1987 ◽  
Vol 91 ◽  
Author(s):  
Zuzanna Liliental-Weber ◽  
E.R. Weber ◽  
J. Washburn ◽  
T.Y. Liu ◽  
H. Kroemer

ABSTRACTGallium arsenide films grown on (211)Si by molecular-beam epitaxy have been investigated using transmission electron microscopy. The main defects observed in the alloy were of misfit dislocations, stacking faults, and microtwin lamellas. Silicon surface preparation was found to play an important role on the density of defects formed at the Si/GaAs interface.Two different types of strained-layer superlattices, InGaAs/InGaP and InGaAs/GaAs, were applied either directly to the Si substrate, to a graded layer (GaP-InGaP), or to a GaAs buffer layer to stop the defect propagation into the GaAs films. Applying InGaAs/GaAs instead of InGaAs/InGaP was found to be more effective in blocking defect propagation. In all cases of strained-layer superlattices investigated, dislocation propagation was stopped primarily at the top interface between the superlattice package and GaAs. Graded layers and unstrained AlGaAs/GaAs superlattices did not significantly block dislocations propagating from the interface with Si. Growing of a 50 nm GaAs buffer layer at 505°C followed by 10 strained-layer superlattices of InGaAs/GaAs (5 nm each) resulted in the lowest dislocation density in the GaAs layer (∼;5×l07/cm2) among the structures investigated. This value is comparable to the recently reported density of dislocations in the GaAs layers grown on (100)Si substrates [8]. Applying three sets of the same strained layersdecreased the density of dislocations an additional ∼2/3 times.


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