Defect Reduction in Cd1-xZnxTe Epilayers on GaAs Substrates

1994 ◽  
Vol 299 ◽  
Author(s):  
Saket Chadda ◽  
Kevin Malloy ◽  
John Reno

AbstractCd0.91Zn0.09Te/CdTe multilayers of various period thicknesses were inserted into Cd0.955Zn0.045Te bulk alloys grown on (001) GaAs. The net strain of the multilayer on the underlying Cd0.955Zn0.045Te was designed to be zero. X-ray diffraction full width at half maximum (FWHM) was used as a means to optimize the period thickness of the multilayer. Transmission electron microscopy of the optimum period thickness samples demonstrated four orders of magnitude decrease in the threading dislocation density. Mechanism of bending by equi-strained multilayers is discussed.

1993 ◽  
Vol 302 ◽  
Author(s):  
Saket Chadda ◽  
Kevin Malloy ◽  
John Reno

ABSTRACTCd0.91Zn0.09Te/CdTe multilayers of various period thicknesses were inserted into Cd0.955Zn0.045Te bulk alloys grown on (001) GaAs. The net strain of the multilayer on the underlying Cd0.955Zn0.045Te was designed to be zero. X-ray diffraction full width at half maximum (FWHM) was used as a means to optimize the period thickness of the multilayer. Transmission electron microscopy of the optimum period thickness samples demonstrated four orders of magnitude decrease in the threading dislocation density. Mechanism of bending by equi-strained multilayers is discussed.


2017 ◽  
Vol 26 (12) ◽  
pp. 127309 ◽  
Author(s):  
Yuan-Hao Miao ◽  
Hui-Yong Hu ◽  
Xin Li ◽  
Jian-Jun Song ◽  
Rong-Xi Xuan ◽  
...  

1987 ◽  
Vol 91 ◽  
Author(s):  
S. M. Vernon ◽  
S. J. Pearton ◽  
J. M. Gibson ◽  
R. Caruso ◽  
C. R. Abernathy ◽  
...  

ABSTRACTGaAs layers were grown directly on misoriented (2° off (100)→[011]) Si substrates by Metalorganic Chemical Vapor Deposition. The threading dislocation density at the surface of 4 μm thick layers was typically 108cm−2, as determined by both preferential etching and transmission electron microscopy. Rapid thermal annealing (900°C, 10s) improved the crystalline quality of the GaAs near the heterointerface while allowing no detectable Si diffusion into this layer. Two deep electron traps were observed in the undoped GaAs, but were present at a low concentration (∼ 1013 cm−3 ). The (400) x-ray diffraction peak width from the GaAs was significantly reduced with increasing GaAs layer thickness, indicating improved material quality. This is supported by Si implant activation data, which shows higher net donor activity in thicker layers.


1995 ◽  
Vol 399 ◽  
Author(s):  
P. Fons ◽  
S. Niki ◽  
A. Yamada ◽  
A. Okada ◽  
D.J. Tweet

ABSTRACTA series of CuInSe2 thin films of varying thicknesses were grown on both GaAs(001) substrates and nominally lattice-matched In0.29Ga0.71As (001) linearly graded buffers by MBE at 450°C. Transmission electron microscopy and high resolution x-ray diffraction measurements revealed the presence of a second phase with chalcopyrite symmetry strained to the CuInSe2 thin film in-plane lattice constant for CuInSe2 films grown on GaAs substrates. Further examination confirmed that the second phase possessed chalcopyrite symmetry. No second phase was observed in films grown on nearly lattice-matched In0.29Ga0.71As (001) linearly graded buffers. Secondary ion mass spectrometry confirmed the presence of interdiffusion from of Ga from the substrate into the CuInSe2layer. It is speculated that this diffusion is related to the state of stress due to heteroepitaxial misfit.


2006 ◽  
Vol 527-529 ◽  
pp. 1505-1508
Author(s):  
Ümit Özgür ◽  
Y. Fu ◽  
Cole W. Litton ◽  
Y.T. Moon ◽  
F. Yun ◽  
...  

Improved structural quality and radiative efficiency were observed in GaN thin films grown by metalorganic chemical vapor deposition on in situ-formed SiN and TiN porous network templates. The room temperature carrier decay time of 1.86 ns measured for a TiN network sample is slightly longer than that for a 200 μm-thick high quality freestanding GaN (1.73 ns). The linewidth of the asymmetric X-Ray diffraction (XRD) (1012) peak decreases considerably with the use of SiN and TiN layers, indicating the reduction in threading dislocation density. However, no direct correlation is yet found between the decay times and the XRD linewidths, suggesting that point defect and impurity related nonradiative centers are the main parameters affecting the lifetime.


2014 ◽  
Vol 2014 ◽  
pp. 1-8 ◽  
Author(s):  
Yu-An Chen ◽  
Cheng-Huang Kuo ◽  
Li-Chuan Chang ◽  
Ji-Pu Wu

GaN epitaxial layers with embedded air voids grown on patterned SiO2AlN/sapphire templates were proposed. Using interruption-free epitaxial lateral overgrowth technology, we realized uninterrupted growth and controlled the shape of embedded air voids. These layers showed improved crystal quality using X-ray diffraction and measurement of etching pits density. Compared with conventional undoped-GaN film, the full width at half-maximum of the GaN (0 0 2) and (1 0 2) peaks decreased from 485 arcsec to 376 arcsec and from 600 arcsec to 322 arcsec, respectively. Transmission electron microscopy results showed that the coalesced GaN growth led to bending threading dislocation. We also proposed a growth model based on results of scanning electron microscopy.


MRS Advances ◽  
2018 ◽  
Vol 3 (18) ◽  
pp. 931-936
Author(s):  
F. B. Abas ◽  
R. Fujita ◽  
S. Mouri ◽  
T. Araki ◽  
Y. Nanishi

ABSTRACTThe objective of this study was to investigate the relationship between the thickness of N radical irradiated InN template with crystallographic quality and electrical properties of InN film grown with the previously proposed method, in situ surface modification by radical beam irradiation. In this study, three InN samples were grown with this method on different thickness of irradiated templates. The crystallographic quality of InN films was analyzed by X-ray diffraction and the electrical properties were studied by Hall effect measurement. InN grown on 100 nm thick irradiated template shows lower full-width at half-maximum of X-ray rocking curves and lower carrier concentration compared to InN grown on 200 nm and 450 nm thick irradiated templates. Transmission electron microscopy revealed that threading dislocation density in the InN film decreased by an order of magnitude to ∼4.6×109cm-2. These results suggest that this method is possible for reduction of threading dislocation density in InN and the thickness of irradiated template should be minimized for higher crystallographic quality and electrical properties of the entire InN film.


1998 ◽  
Vol 535 ◽  
Author(s):  
P. J. Taylor ◽  
W.A. Jesser ◽  
G. Simonis ◽  
W. Chang ◽  
M. Lara-Taysing ◽  
...  

AbstractThe growth of reduced dislocation density GaAs/Si is performed by a novel two-step technique where the first epitaxy step takes place at 75° C and the second is performed at 580° C. The initial deposition is single crystal, continuous, and planar such that there is no contribution to the dislocation density from Volmer-Weber island coalescence and no trapping of dislocations in pinholes. Using this new growth technique, a reduced dislocation density the order of 106/cm2 was obtained. The improved crystallinity is indicated by the more narrow x-ray full-width-at-half-maximum (FWHM) value of 110 arcseconds. GaAs p-i-n diodes were grown on the reduced dislocation density GaAs/Si and it was found that the resistivity of the intrinsic region for the heteroepitaxial diodes was similar to homoepitaxial ones for small mesa sizes.


2018 ◽  
Vol 27 (01n02) ◽  
pp. 1840010
Author(s):  
F. A. Althowibi ◽  
J. E. Ayers

We applied the mosaic crystal model to calculate the dynamical x-ray rocking curves for a coherently-strained GaAs/In0.3Ga0.7As/GaAs single quantum well grown epitaxially on a GaAs (001) substrate for a number of reflection profiles, including 004, 113, 224, 044 and 444 reflections. We show that it is possible to estimate the threading dislocation density in the quantum well, and therefore detect the pseudomorphic-metamorphic transition, using the widths or normalized intensities of the primary quantum well Bragg peak, or using the widths of the Pendellösung fringes associated with the quantum well structure.


1987 ◽  
Vol 65 (8) ◽  
pp. 868-871 ◽  
Author(s):  
S. Eicher ◽  
R. A. Bruce

The formation of WSix phases from multiple thin layers of W and Si was investigated. Tungsten and silicon thin films of ~5 nm thickness were deposited sequentially onto GaAs substrates by dc magnetron sputtering from elemental targets. The total film thickness was ~300 nm. The W and Si layer thickness, and thus the overall composition of the films, was controlled by adjusting the power applied to the two sputtering targets. The films examined in this work had nominal compositions in the range WSi2–WSi0.48.The multilayered structure was subjected to rapid thermal annealing at 900 °C. The extent of the reaction, the grain size, and the crystal structure of the silicides were determined using transmission electron microscopy and X-ray diffraction. For WSix films with [Formula: see text], the silicides had the βW structure and were relatively large grained, ~450 nm, while for x > 0.52, the film contained the W5Si3 phase and consisted of grains ~45 nm in diameter.Schottky contacts were of good quality for [Formula: see text], with a barrier height (ϕ) of 0.7 V and an ideality factor (n) of 1.15. Schottky contacts with higher silicon concentrations were poor.The WSix (x = 0.52) Schottky contact has been successfully incorporated into a self-aligned gate field-effect transistor.


Sign in / Sign up

Export Citation Format

Share Document