High Quality Hydrogenated Amorphous Silicon Films with Significantly Improved Stability

1998 ◽  
Vol 507 ◽  
Author(s):  
Shuran Sheng ◽  
Xianbo Liao ◽  
Zhixun Ma ◽  
Guozhen Yue ◽  
Yongqian Wang ◽  
...  

ABSTRACTHigh quality hydrogenated amorphous silicon (a-Si:H) films have been prepared by a simple “uninterrupted growth/annealing” plasma enhanced chemical vapor deposition (PECVD) technique, combined with a subtle boron-compensated doping. These a-Si:H films possess a high photosensitivity over 106, and exhibit no degradation in photoconductivity and a low light-induced defect density after prolonged illumination. The central idea is to control the growth conditions adjacent to the critical point of phase transition from amorphous to crystalline state, and yet to locate the Fermi level close to the midgap. Our results show that the improved stability and photosensitivity of a-Si:H films prepared by this method can be mainly attributed to the formation of a more robust network structure and reduction in the precursors density of light-induced metastable defects.

2003 ◽  
Vol 762 ◽  
Author(s):  
Guofu Hou ◽  
Xinhua Geng ◽  
Xiaodan Zhang ◽  
Ying Zhao ◽  
Junming Xue ◽  
...  

AbstractHigh rate deposition of high quality and stable hydrogenated amorphous silicon (a-Si:H) films were performed near the threshold of amorphous to microcrystalline phase transition using a very high frequency plasma enhanced chemical vapor deposition (VHF-PECVD) method. The effect of hydrogen dilution on optic-electronic and structural properties of these films was investigated by Fourier-transform infrared (FTIR) spectroscopy, Raman scattering and constant photocurrent method (CPM). Experiment showed that although the phase transition was much influenced by hydrogen dilution, it also strongly depended on substrate temperature, working pressure and plasma power. With optimized condition high quality and high stable a-Si:H films, which exhibit σph/σd of 4.4×106 and deposition rate of 28.8Å/s, have been obtained.


1999 ◽  
Vol 557 ◽  
Author(s):  
Brent P. Nelson ◽  
Richard S. Crandall ◽  
Eugene Iwaniczko ◽  
A. H. Mahan ◽  
Qi Wang ◽  
...  

AbstractWe grow hydrogenated amorphous silicon (a-Si:H) by Hot-Wire Chemical Vapor Deposition (HWCVD). Our early work with this technique has shown that we can grow a-Si:H that is different from typical a-Si:H materials. Specifically, we demonstrated the ability to grow a-Si:H of exceptional quality with very low hydrogen (H) contents (0.01 to 4 at. %). The deposition chambers in which this early work was done have two limitations: they hold only small-area substrates and they are incompatible with a load-lock. In our efforts to scale up to larger area chambers—that have load-lock compatibility—we encountered difficulty in growing high-quality films that also have a low H content. Substrate temperature has a direct effect on the H content of HWCVD grown a-Si:H. We found that making dramatic changes to the other deposition process parameters—at fixed substrate temperature and filament-to-substrate spacing—did not have much effect on the H content of the resulting films in our new chambers. However, these changes did have profound effects on film quality. We can grow high-quality a-Si:H in the new larger area chambers at 4 at. % H. For example, the lowest known stabilized defect density of a-Si:H is approximately 2 × 1016 cm-3, which we have grown in our new chamber at 18 Å/s. Making changes to our original chamber—making it more like our new reactor—did not increase the hydrogen content at a fixed substrate temperature and filament-to-substrate spacing. We continued to grow high quality films with low H content in spite of these changes. An interesting, and very useful, result of these experiments is that the orientation of the filament with respect to silane flow direction had no influence on film quality or the H content of the films. The condition of the filament is much more important to growing quality films than the geometry of the chamber due to tungsten-silicide formation on the filament.


1996 ◽  
Vol 420 ◽  
Author(s):  
K. Yoshino ◽  
W. Futako ◽  
Y. Wasai ◽  
I. Shimizu

AbstractHigh quality wide gap hydrogenated amorphous silicon has been prepared using the chemical annealing technique. It was possible to prepare materials with band gaps ranging 1.8 to 2.1 eV by varying the preparation parameters. Low defect densities less than (3–8) x 1015 cm-3 could be maintained over the entire band gap range. Improved stability for light soaking was also observed in the wide gap materials.


2020 ◽  
Vol 15 (2) ◽  
pp. 1-4
Author(s):  
Deissy Johanna Feria ◽  
Marcelo Carreño ◽  
Ricardo Rangel ◽  
Ines Pereyra

The production of high quality graphene without the need for catalyst metals as in the case of chemical vapor deposition (CVD) techniques remain a challenge. Silicon carbide is one of the materials with potential to form graphene films on its surface through thermal decomposition when subjected to high temperatures and ultrahigh vacuum. This technique is highly desirable since it enables the elimination of corrosion and transfer steps, which can leave residues in the graphene structure and alter its quality, as well as its electrical proprieties, however it is a costly and time consuming method. In this work, we present the production of graphene trails by direct laser radiation writing at room temperature and atmospheric pressure on hydrogenated amorphous silicon carbide films (SiC-a:H) produced by Plasma Enhanced Chemical Vapor Deposition (PECVD).  Graphene trails of approximately 1cm x 4μm were obtained with patterns designed by computer Aided Design (CAD) software. Variations were made in both scanning speed and laser focal length, identifying a great dependence on the graphene quality with these two parameters. The best results of the Raman Spectroscopy Mappings showed high quality graphene with distance between point defects (LD) of 20nm, crystallite size (La) of 25nm and few layers (2-3). In addition, the electrical measurements from Au/Ti (20nm/100nm) electrodes deposited by electron beam evaporation showed high conductivity, with sheet resistances (Rs) from 0.7kΩ to 1.3 kΩ per square. This technique opens a great possibility of manufacturing devices for applications in electronics, being a fast, efficient and low cost method.


1990 ◽  
Vol 192 ◽  
Author(s):  
Hideki Matsumura ◽  
Masaaki Yamaguchi ◽  
Kazuo Morigaki

ABSTRACTHydrogenated amorphous silicon-germanium (a-SiGe:H) films are prepared by the catalytic chemical vapor deposition (Cat-CVD) method using a SiH4, GeH4 and H4 gas mixture. Properties of the films are investigated by the photo-thermal deflection spectroscopy (PDS) and electron spin resonance (ESR) measurements, in addition to the photo-conductive and structural studies. It is found that the characteristic energy of Urbach tail, ESR spin density and other photo-conductive properties of Cat-CVD a-SiGe:H films with optical band gaps around 1.45 eV are almost equivalent to those of the device quality glow discharge hydrogenated amorphous silicon (a-Si:H).


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