Reliability of Cu/WN thin Films Deposited on Low Dielectric Constant SiOF ILD

1998 ◽  
Vol 511 ◽  
Author(s):  
Seoghyeong Lee ◽  
Dong Joon Kim ◽  
Sung-Hoon Yang ◽  
Jeongwon Park ◽  
Seil Sohn ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Plasma Treatment ◽  
Silicon Oxide ◽  
Chemical Properties ◽  
Surface Oxidation ◽  
Relative Dielectric Constant ◽  
Low Dielectric ◽  
Sufficient Power ◽  
Metal Interconnects ◽  
Interconnect System

ABSTRACTThe effect of the post plasma treatment on the dielectric properties and reliability of fluorine doped silicon oxide (SiOF) films was studied. Also, the thermal stability of a Cu/WN interconnect system with SiOF intermetal dielectrics was examined by RTA. The surface roughness of SiOF films increased with the increasing plasma treatment power due to ion bombardment effect during the plasma treatment. As the plasma treatment power increased, the dielectric constant increased from 3.16 to 3.43, while the change in the relative dielectric constant of the plasma treated films by the boiling treatment was decreased in magnitude. Furthermore, the chemical properties of the plasma treated SiOF films near the top layer tend to resemble those of thermal oxides by the plasma treatment of sufficient power because of the reduction in the Si-F bonding in the films. In the case of Cu/WN/SiOF/Si multilayer structure, surface oxidation and densification due to the plasma treatment seemed to play an important role in protecting the interdiffusion between SiOF and metal interconnects.

Reliability of Electrodeposited Copper and Ecrcvd Siof Films for Multilevel Metallization

1999 ◽  
Vol 565 ◽  
Author(s):  
Seoghyeong Lee ◽  
Yong-An Kim ◽  
Kyoung-Woo Lee ◽  
Seil Sohn ◽  
Young-Il Kim ◽  
...  
Keyword(s):  
Plasma Treatment ◽  
Multilayer Structure ◽  
Silicon Oxide ◽  
Electron Cyclotron Resonance ◽  
Chemical Vapor ◽  
Vacuum Furnace ◽  
Electrical Stability ◽  
Metal Interconnects ◽  
The Stability ◽  
Interconnect System

AbstractThe effect of a post plasma treatment on the dielectric properties and reliability of fluorine doped silicon oxide (SiOF) films deposited by electron cyclotron resonance chemical vapor deposition (ECRCVD) was studied. Also, the thermal stability of an electrodeposited Cu / sputtered Ta interconnect system with SiOF intermetal dielectrics was examined by annealing in a vacuum furnace. The stability of the dielectric constant of SiOF films was improved by O2 post plasma treatment. Surface modification by the plasma treatment was effective in prevention of water absorption. The Cu/Ta/SiOF/Si system was thermally stable at least up to 500°C for 3h. For the Cu/Ta/SiOF/Si multilayer structure, the plasma treatment seemed to play a big role in suppressing the interdiffusion between SiOF and metal interconnects. By C-V measurement, the electrical stability of the Cu/Ta/SiOF/Si multilayer structure was found to be stable up to 500°C for 2 h.

Effects of He/H2 Plasma Treatment on Properties of SiCOH Films Deposited with the 1,1,1,3,5,7,7,7- Octamethyl-3,5-Bis(Trimethylsiloxy) Tetrasiloxane Precursor

2020 ◽  
Vol 20 (11) ◽  
pp. 6706-6712
Author(s):  
Yoonsoo Park ◽  
Hyuna Lim ◽  
Sungyool Kwon ◽  
Younghyun Kim ◽  
Wonjin Ban ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Plasma Treatment ◽  
Inductively Coupled Plasma ◽  
Chemical Vapor ◽  
Relative Dielectric Constant ◽  
Chemical Compositions ◽  
Cage Structure ◽  
Inductively Coupled ◽  
Low Dielectric ◽  
Semiconductor Chips

Low-dielectric-constant SiCOH films fabricated using plasma enhanced chemical vapor deposition (PECVD) are widely used as inter-metallic dielectric (IMD) layers in interconnects of semiconductor chips. In this work, SiCOH films were deposited with 1,1,1,3,5,7,7,7-octamethyl-3,5-bis(trimethylsiloxy)tetrasiloxane (OMBTSTS), and plasma treatment was performed by an inductively coupled plasma (ICP) system with mixture of He and H2. The values of relative dielectric constant (k) of the as-deposited SiCOH films ranged from 2.64 to 4.19. The He/H2 plasma treatment led to a reduction of the k values of the SiCOH films from 2.64–4.19 to 2.07–3.94. To investigate the impacts of the He/H2 plasma treatment on the SiCOH films, the chemical compositions and structures of the as-deposited and treated the SiCOH films were compared by Fourier transform infrared spectroscopy. The experimental results indicate that the k value of the SiCOH films was decreased, there was a proportional increase in pore-related Si–O–Si structure, which is commonly called the cage structure with lager angle than 144°, after He/H2 plasma treatment. The He/H2 plasma treatment was considered to have reduced the k value by forming pores that could be represented by the cage structure. On the other hand, the leakage current density of the SiCOH films was slightly degraded by He/H2 plasma treatment, however, this was tolerable for IMD application. Concludingly the He/H2 plasma treated SiCOH film has the lowest relative dielectric constant (k~2.08) when the most highly hydrocarbon removal and cage structure formation increased.

Structire, Properties, and Process Characteristics of Low-K Materials Prepared by PECVD

1999 ◽  
Vol 565 ◽  
Author(s):  
Y. Shimogaki ◽  
S. W. Lim ◽  
E. G. Loh ◽  
Y. Nakano ◽  
K. Tada ◽  
...  
Keyword(s):  
Growth Rate ◽  
Dielectric Constant ◽  
Gas Flow ◽  
Structural Changes ◽  
Silicon Oxide ◽  
Reactive Species ◽  
Low Dielectric Constant ◽  
Low Dielectric ◽  
Step Coverage ◽  
Low K

AbstractLow dielectric constant F-doped silicon oxide films (SiO:F) can be prepared by adding fluorine source, like as CF4 to the conventional PECVD processes. We could obtain SiO:F films with dielectric constant as low as 2.6 from the reaction mixture of SiH4/N2 O/CF4. The structural changes of the oxides were sensitively detected by Raman spectroscopy. The three-fold ring and network structure of the silicon oxides were selectively decreased by adding fluorine into the film. These structural changes contribute to the decrease ionic polarization of the film, but it was not the major factor for the low dielectric constant. The addition of fluorine was very effective to eliminate the Si-OH in the film and the disappearance of the Si-OH was the key factor to obtain low dielectric constant. A kinetic analysis of the process was also performed to investigate the reaction mechanism. We focused on the effect of gas flow rate, i.e. the residence time of the precursors in the reactor, on growth rate and step coverage of SiO:F films. It revealed that there exists two species to form SiO:F films. One is the reactive species which contributes to increase the growth rate and the other one is the less reactive species which contributes to have uniform step coverage. The same approach was made on the PECVD process to produce low-k C:F films from C2F4, and we found ionic species is the main precursor to form C:F films.

Infrared spectroscopy study of low-dielectric-constant fluorine-incorporated and carbon-incorporated silicon oxide films

2001 ◽  
Vol 90 (7) ◽  
pp. 3367-3370 ◽  
Author(s):  
Yoon-Hae Kim ◽  
Moo Sung Hwang ◽  
Hyeong Joon Kim ◽  
Jin Yong Kim ◽  
Young Lee
Keyword(s):  
Dielectric Constant ◽  
Infrared Spectroscopy ◽  
Silicon Oxide ◽  
Oxide Films ◽  
Low Dielectric Constant ◽  
Spectroscopy Study ◽  
Low Dielectric

Effects of Postdeposition in situ Heat Treatment on the Properties of Low Dielectric Constant Plasma Polymer Films Deposited Using Decahydronaphthalene and Tetraethyl Orthosilicate as the Precursors

2002 ◽  
Vol 17 (6) ◽  
pp. 1371-1375 ◽  
Author(s):  
Jaeyoung Yang ◽  
Cheonman Shim ◽  
Donggeun Jung
Keyword(s):  
Heat Treatment ◽  
Dielectric Constant ◽  
Polymer Films ◽  
Chemical Vapor ◽  
Relative Dielectric Constant ◽  
Tetraethyl Orthosilicate ◽  
Plasma Polymer ◽  
Low Dielectric ◽  
Heat Treated

We investigated effects of postdeposition heat treatment (HT) on the properties of plasma polymer films deposited by plasma-enhanced chemical vapor deposition using a mixture of decahydronaphthalene and tetraethyl orthosilicate as the precursors, which were referred to as plasma-polymerized decahydronaphthalene:tetraethyl orthosilicate (PPDHN:TEOS) films. HTs at 350, 450, and 500 °C decreased the relative dielectric constant k of the PPDHN:TEOS films from 3.16, the k value of the as-deposited film, to 2.82, 2.72, and 3.02, respectively. The change of k value as a function of HT temperature was correlated with the change of Fourier transform infrared absorption peaks of O–H, C = O, and Si-related groups. As the HT temperature increased, the thermal stability of the PPDHN:TEOS film increased. PPDHN:TEOS films, as-deposited or heat treated, showed leakage current density in the order of 10−7 A/cm2 at 1 MV/cm.

Evaluation of Lpcvd Boron Nitride as a Low Dielectric Constant Material

1996 ◽  
Vol 427 ◽  
Author(s):  
R. A. Levy ◽  
M. Narayan ◽  
M. Z. Karim ◽  
S. T. Hsu
Keyword(s):  
Dielectric Constant ◽  
Boron Nitride ◽  
Flow Rate ◽  
Chemical Properties ◽  
Low Dielectric Constant ◽  
Processing Conditions ◽  
Low Dielectric ◽  
Rate Ratios ◽  
And Chemical Properties ◽  
Deposition Conditions

AbstractThis study characterizes low pressure chemically vapor deposited B-N-C-H as a low dielectric constant material for interlevel dielectric applications. These films are synthesized over a temperature range of 400 to 600 °C and various flow rate ratios using triethylamine borane complex (TEAB) and NH3 as precursors. The dielectric constant of these films exhibit values which varied in the range of 2.6 to 3.5 depending on processing conditions. Low dielectric constant values are achieved at film compositions which approached stoichiometry and have minimal carbon content. The variations in the structural, optical, mechanical, and chemical properties of these films as a function of deposition conditions are also discussed.

Effect of Post Plasma Treatment on Reliability and Dielectric Properties of SiOF Films Deposited by ECRCVD With SiF4 and O2

1997 ◽  
Vol 476 ◽  
Author(s):  
Seoghyeong Lee ◽  
Jae-Yoon Yoo ◽  
Kyunghui Oh ◽  
Jong-Wan Park
Keyword(s):  
Dielectric Properties ◽  
Plasma Treatment ◽  
Silicon Oxide ◽  
Treatment Time ◽  
Relative Dielectric Constant ◽  
Breakdown Field ◽  
Plasma Treatment Time ◽  
Breakdown Field Strength ◽  
Thermal Stability Of

AbstractThe effect of post plasma treatment on dielectric properties and reliability of fluorine doped silicon oxide (SiOF) films were investigated by measuring their C-V and I-V characteristics, XPS, AFM, and AES. The post plasma treatment of SiOF films was carried out in-situ at 300 °C in the deposition chamber. In this research, when the post plasma treatment time increased, we obtained the following results: (1) The etch rate of SiOF films decreased from 80Å/sec to 10Å/sec. (2) Surface roughness of the plasma treated SiOF films was increased due to the ion bombardment effect of the plasma. (3) The refractive index and relative dielectric constant increased from 1.391 to 1.461 and 3.14 to 3.9, respectively, due to the changes of surface chemistry by the post plasma treatment. (4) The leakage current density of SiOF films prepared by ECRCVD using SiF4 and O2 was less than 1 × 10−9A/cm2. (5) The breakdown field strength increased from 3.5 MV/cm to 8 MV/cm. (6) The thermal stability of the Cu/TiN/SiOF/Si system remained stable up to 600 °C.

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