Ion Beam Assisted Texture Evolution during Thin Film Deposition of Metal Nitrides

2000 ◽  
Vol 647 ◽  
Author(s):  
Bernd Stritzker ◽  
Jürgen W. Gerlach ◽  
Stephan Six ◽  
Bernd Rauschenbach

AbstractIon beam assisted deposition, i.e., the bombardment of thin films with a beam of energetic particles has become a highly developed tool for the preparation of thin films. This technique provides thin films and coatings with modified microstructure and properties. In this paper examples are presented for the modifying of the structure: in-situ modification of texture during ion beam assisted film growth and ion beam enhanced epitaxy.The biaxial alignment of titanium nitride films prepared on Si(111) by nitrogen ion beam assisted deposition at room temperature was studied. The bombardment perpendicular to the surface of the substrate causes an {001} alignment of crystallites. A 55° ion beam incidence angle produces both a {111} orientation relative to the surface and a {100} orientation relative to the ion beam. This results in a totally fixed orientation of the crystallites. The texture evolution is explained by the existence of open channeling directions.Epitaxial, hexagonal gallium nitride films were grown on c-plane sapphire by low-energy nitrogen ion beam assisted deposition (≤ 25 eV). The ion energy was chosen to be less than the corrected bulk displacement energy to avoid the formation of ion-induced point defects in the bulk. The results show that GaN films with a nearly perfect {0002} texture are formed which have superior crystalline quality than films grown without ion irradiation. The mosaicity and the defect density are reduced.By applying an assisting ion beam during pulsed laser deposition of aluminum nitride on the c-plane of sapphire, epitaxial, hexagonal films could be produced. The results prove the beneficial influence of the ion beam on the crystalline quality of the films. An optimum ion energy of 500 eV was found where the medium tilt as well as the medium twist of the crystallites was minimal.

1991 ◽  
Vol 235 ◽  
Author(s):  
Daniel J. Kester ◽  
Russell Messier

ABSTRACTBoron nitride thin films were grown using ion beam assisted deposition. Boron metal was evaporated, and the depositing film was bombarded by nitrogen and argon ions. The films were characterized using Fourier transform infrared spectroscopy, electron diffraction, transmission electron microscopy, and Rutherford backscattering. The thin films were found to be cubic boron nitride, consisting of 100–200 Å crystallites with a small amount of an amorphous secondary phase. The best conditions for depositing cubic boron nitride were found to be a substrate temperature of 400°C, bombardment by a 50:50 mixture of argon and nitrogen with a bombarding ion energy of 500 eV and a ratio of bombarding ions to depositing boron atoms of from 1.0 to 1.5 ions per atom.


2001 ◽  
Vol 695 ◽  
Author(s):  
Shuichi Miyabe ◽  
Masami Aono ◽  
Nobuaki Kitazawa ◽  
Yoshihisa Watanabe

ABSTRACTAluminum nitride (AlN) thin films with columnar and granular structures were prepared by ion-beam assisted deposition method by changing nitrogen ion beam energy, and the effects of the film microstructure and film thickness on their microhardness were studied by using a nano-indentation system with the maximum force of 3 mN. For the columnar structure film of 600 nm in thickness, the microhardness is found to be approximately 24 GPa when the normalized penetration depth to the film thickness is about 0.1. For the granular structure film of 700 nm in thickness, the microhardness is found to be approximately 14 GPa. These results reveal that the microhardness of the AlN films strongly depends on the film microstructure, which can be controlled by regulating the nitrogen ion beam energy.


1992 ◽  
Vol 7 (2) ◽  
pp. 374-378 ◽  
Author(s):  
J-G. Choi ◽  
D. Choi ◽  
L.T. Thompson

A series of molybdenum nitride films were synthesized by implanting energetic nitrogen ions into molybdenum thin films. The resulting films were characterized using x-ray diffraction to determine the effects of nitrogen ion dose (4 × 1016−4 × 1017 N+/cm2), accelerating voltage (50–200 kV), and target temperature (∼298–773 K) on their structural properties. The order of structural transformation with increased incorporation of nitrogen ions into the Mo film can be summarized as follows: Mo → γ−Mo2N → δ−MoN. Nitrogen incorporation was increased by either increasing the dose or decreasing the ion energy. At elevated target temperatures the metastable B1–MoN phase was also produced. In most cases the Mo nitride crystallites formed with the planes of highest atomic density parallel to the substrate surface. At high ion energies preferential orientation developed so that the more open crystallographic directions aligned with the ion beam direction. We tentatively attributed this behavior to ion channeling effects.


2007 ◽  
Vol 539-543 ◽  
pp. 3151-3156
Author(s):  
S.T. Davies

The growth of TiNi thin films by ion beam sputter deposition using a Kaufmann type ion source is described. Argon ions are used to sputter separate Ti and Ni targets to deposit nearequiatomic TiNi thin films. Typically, ion energies and current densities of 1500 eV and 1 mA cm-2 respectively are used, with an argon overpressure of around 0.05 mtorr, to achieve deposition rates of order 1 μm hr-1. The thermophysical properties of the deposited films were investigated by thermal imaging. Patterning of TiNi films and foils with micrometre resolution using KrF excimer laser ablation at 248 nm wavelength, with beam fluence up to 2.5 J cm-2, 15 ns pulse duration and pulse rates up to 100 Hz has also been investigated.


2002 ◽  
Vol 750 ◽  
Author(s):  
Hanchen Huang ◽  
H. L. Wei ◽  
H. Y. Liang ◽  
C. H. Woo ◽  
X. X. Zhang

ABSTRACTIn this paper, we present a preliminary study of texture development during copper thin film deposition. Using direct current (DC) magnetron sputtering technique, we deposit copper films on a SiO2/Si(111) substrate. A thin layer of copper of <111> texture first develops, and another thin layer of <110> ensues. As deposition continues, a third layer of copper of <111> texture forms on the top, leading to a copper thin film of alternating <111> and <110> textures. The multiple layers of copper thin films of alternating textures form during continuous deposition without changing deposition conditions. The film morphology is characterized with scanning electron microscopy (SEM) and atomic force microscopy (AFM), and the texture with X-ray diffraction (XRD). Based on anisotropic elastic analyses and molecular dynamics simulations, we propose a model of texture evolution during the formation of multilayers, attributing the texture evolution to the competition of surface and strain energies.


2000 ◽  
Vol 647 ◽  
Author(s):  
Shuichi Miyabe ◽  
Toshiyuki Okawa ◽  
Nobuaki Kitazawa ◽  
Yoshihisa Watanabe ◽  
Yoshikazu Nakamura

AbstractAluminum nitride (AlN) thin films were prepared by ion-beam assisted deposition method, and the influence of the nitrogen ion beam energy on their microstructure and mechanical properties was studied by changing the ion beam energy from 0.1 to 1.5 keV. Films prepared with a low-energy ion beam show a columnar structure, while films prepared with a high-energy ion beam show a granular structure. The film hardness is found to decrease with increasing nitrogen ion beam energy. It is also found that the film hardness does not change drastically after annealing in nitrogen atmosphere at 500 °C, yielding the residual stress relaxation. It is proposed that the film hardness is dependent on the film microstructure, which can be controlled with the nitrogen ion beam energy, rather than the residual stress in the films.


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