A Micro-Fluxgate Magnetic Sensor Using Closely Coupled Excitation and Pick-Up Coils

2002 ◽  
Vol 729 ◽  
Author(s):  
Won-Youl Choi ◽  
Kyoung-Won Na ◽  
Sung-Jin Ahn ◽  
Sang-On Choi
Keyword(s):  
Coercive Field ◽  
Seed Layer ◽  
Core Layer ◽  
Sine Wave ◽  
Magnetic Core ◽  
Magnetic Sensor ◽  
Navigation Systems ◽  
Sensing Element ◽  
Chip Size ◽  
Map Data

AbstractThis paper presents a micro-fluxgate magnetic sensor composed of a rectangular-ring shaped magnetic core and solenoid excitation and pick-up coils. In order to improve the sensitivity of sensing element, the excitation and pick-up Cu coils are formed as a closely coupled structure. This unique coil structure allows to excite the magnetic core in an optimal condition with reduced excitation current. The 11 μm thick excitation and pick-up Cu coils were electroplated using Cr (300 Å) / Au (1500 Å) seed layer. The 2.9 μm thick Ni0.8Fe0.2 (permalloy) magnetic core layer was also electroplated with photoresist frame using sputtered Ni0.8Fe0.2 seed layer. The rectangular-ring shaped core was covered by photoresist and wet etching using dilute sulfuric acid. The magnetic core has a DC permeability of ∼1100 and coercive field of 0.1 Oe. The magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. The chip size of the fabricated sensing element is 1.3 × 1.0 mm2. Excellent linear response over the range of –100 μT to +100 μT is obtained with 14 V/T sensitivity at excitation sine wave of 3 VP-P and 150 kHz. This low magnetic field sensing element is very useful for various applications such as: portable navigation systems including north-up and map data scrolling, military research, medical research, and space research.

A Micro Fluxgate Magnetic Sensor Using New Printed Circuit Board Technology

2006 ◽  
Vol 326-328 ◽  
pp. 1487-1490 ◽  
Author(s):  
Won Youl Choi ◽  
Jun Sik Hwang ◽  
Sang On Choi
Keyword(s):  
Low Power ◽  
Printed Circuit Board ◽  
Sine Wave ◽  
Magnetic Core ◽  
Magnetic Sensor ◽  
Circuit Board ◽  
Sensing Element ◽  
Printed Circuit ◽  
Fluxgate Sensor ◽  
Ring Shape

We have developed a micro fluxgate magnetic sensor using new printed circuit board (PCB) technology. The fluxgate sensor consisted of five PCB stack layers including one layer of magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core was made of micro patterned amorphous magnetic ribbon with an extremely high DC permeability of ~100,000, and the core had a rectangular ring shape. Four outer layers as an excitation and pickup coils had a planar solenoid structure. The amorphous magnetic core was easily saturated due to the high permeability, low coercive field, and closed magnetic path for the excitation field. The chip size of the fabricated sensing element was 7.3 × 5.7 mm2. Excellent linear response over the range of –100 μT to +100 μT was obtained with sensitivity of 780 V/T at excitation sine wave of 3 Vp-p and 360 kHz. A very low power consumption of ~8 mW was measured. This low power, small size, and high sensitive fluxgate sensor to measure a low magnetic field is very useful for various applications.

Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

2018 ◽  
Vol 15 (4) ◽  
pp. 141-147 ◽  
Author(s):  
Cheng-Ta Ko ◽  
Henry Yang ◽  
John Lau ◽  
Ming Li ◽  
Margie Li ◽  
...  
Keyword(s):  
Seed Layer ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Heterogeneous Integration ◽  
Assembly Process ◽  
Molding Compound ◽  
Printed Circuit ◽  
Chip Size ◽  
Design Materials ◽  
Dry Film

Abstract The design, materials, process, and fabrication of a heterogeneous integration of four chips by a fan-out panel-level packaging (FOPLP) method are investigated in this study. Emphasis is placed on (1) the application of a dry-film epoxy molding compound for molding the chips and (2) the application of a special assembly process called uni-substrate-integrated package for fabricating the redistribution layers (RDLs) of the FOPLP. The Ajinomoto build-up film is used as the dielectric of the RDLs and is built up by the semiadditive process. Electroless Cu is used to make the seed layer, laser direct imaging is used for opening the photoresist, and printed circuit board (PCB) Cu plating is used for making the conductor wiring of the RDLs. The panel dimensions are 508 × 508 mm. The package dimensions of the FOPLP are 10 × 10 mm. The large chip size and the small chip sizes are, respectively, 5 × 5 mm and 3 × 3 mm. The uniqueness of this study is that all the processes are carried out by using the PCB equipment.

NiFe/INSULATOR/Cu COMPOSITE WIRES AND THEIR GIANT MAGNETO-IMPEDANCE EFFECTS

2010 ◽  
Vol 17 (03) ◽  
pp. 369-373 ◽  
Author(s):  
N. NING ◽  
J. FAN ◽  
J. WU ◽  
H. CHIRIAC ◽  
X. P. LI
Keyword(s):  
Seed Layer ◽  
Copper Wire ◽  
Magnetic Layer ◽  
High Sensitivity ◽  
Composite Wire ◽  
Sensing Element ◽  
Promising Candidate ◽  
Insulator Layer ◽  
Giant Magneto Impedance ◽  
Composite Wires

In this work, two types of electrodeposited Ni–Fe /insulator/ Cu composite wires, namely Ni–Fe /seed layer/glass coated copper wire (Composite Wire A), and Ni–Fe /seed layer/sputtered SiO2/Cu (Composite Wire B), have been fabricated and their giant magneto-impedance effects have been investigated. With different implementations of the insulator layer, the magneto-impedance effect of Composite Wire A, whose insulator layer is cast from the melt Pyrex, is significantly higher than that of Composite Wire B with an insulator of sputtered SiO 2 layer. The profile of the insulator layer, as well as the thickness of magnetic layer and the diameter of the conductive core, greatly influences the interaction between the magnetic layer of Ni–Fe and the copper core, as shown in their giant magneto-impedance (GMI) effects. The maximum MI ratios obtained from Composite Wires A and B are 226% at 800 kHz when H ext = 0.87 Oe , and 95% at 1 MHz when H ext = 0 Oe , respectively. The Composite Wire A is a promising candidate for the sensing element of high sensitivity sensors to very weak magnetic field. For Composite Wire B, further improvement on its GMI effect and sensing performance requires optimization of its geometric parameters and the deposition conditions.

scholarly journals The Effect of Arrive Angle of External Magnetic Field on The Shape of Hysteresis Curve Permalloy Ni80Fe20 By Simulation

2021 ◽  
Vol 4 (2) ◽  
pp. 102
Author(s):  
Merinda Lestari ◽  
Widia Nursiyanto ◽  
Agung Tjahjo Nugroho
Keyword(s):  
Magnetic Field ◽  
External Magnetic Field ◽  
Finite Difference ◽  
Coercive Field ◽  
Incident Angle ◽  
Magnetic Sensor ◽  
Magnetic Sensors ◽  
Hysteresis Curve ◽  
Angle Of Incidence ◽  
Angle Variation

Magnetic sensor is a type of sensor that utilizes changes in resistance caused by changes in the magnetic field H or B. One of the suitable magnetic materials to be used as a study material for making magnetic sensors is permalloy Ni80Fe20. The reading error of the magnetic sensor of the Ni80Fe20 permalloy material affects hysteresis curve of the material and requires correction of the angle of incidence of the external magnetic field in order to provide accurate results on the storage media. In this our current research using Finite Difference OOMMF, we investigated the effect of the angle of incidence of the external magnetic field (H) on the hysteresis curve was carried out on an application based on. The research was conducted by reviewing the parameter literature of the Ni80Fe20 permalloy material and then compiling it in a script and simulating it on an application based on Finite Difference OOMMF. The data obtained from the simulation are normalized magnetization (m), external magnetic field H and coercivity field (Hc) which have been influenced by the angle of incidence. The results of the hysteresis curve at a size of 5 nm with a variation of the angle of incidence 0o are indicated by the value of the external magnetic field H of 10000 mT to -10000 mT with a coercive field Hc of 5000 mT to -5000 mT. The normalized magnetization value m is 1 to -1. The variation of the angle of incidence of 30o produces a coercive field Hc of -108.3 mT to 108.3 mT and a normalized magnetization of 0.86 to -0.86. The 45o incident angle variation produces a coercive field Hc -88.4 mT to 88.4 mT and a normalized magnetization of -0.7 to 0.7

Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

2018 ◽  
Vol 2018 (1) ◽  
pp. 000057-000063 ◽  
Author(s):  
Cheng-Ta Ko ◽  
Henry Yang ◽  
John Lau ◽  
Ming Li ◽  
Margie Li ◽  
...  
Keyword(s):  
Seed Layer ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Heterogeneous Integration ◽  
Additive Process ◽  
Molding Compound ◽  
Printed Circuit ◽  
Chip Size ◽  
Design Materials ◽  
Dry Film

Abstract The design, materials, process, and fabrication of a heterogeneous integration of 4 chips by a FOPLP (fanout panel-level packaging) method are investigated in this study. Emphasis is placed on (a) the application of a dry-film EMC (epoxy molding compound) for molding the chips, and (b) the application of a special assembly process called Uni-SIP (uni-substrate-integrated-package) for fabricating the RDLs (redistribution layers) of the FOPLP. The ABF (Ajinomoto build-up film) is used as the dielectric of the RDLs and is built up by the SAP (semi-additive process). The electroless Cu is used to make the seed layer, the LDI (laser direct imaging) is used for opening the photoresist, and the PCB (printed circuit board) Cu plating is used for making the conductor wiring of the RDLs. The panel dimensions are 508mm × 508mm. The package dimensions of the FOPLP are 10mm × 10mm. The large chip size and the small chip sizes are, respectively 5mm × 5mm and 3mm × 3mm.

Inductance Investigation of Screen-Printed Radio Frequency Identification Antennas

2015 ◽  
Vol 748 ◽  
pp. 81-84 ◽  
Author(s):  
Ya Ling Li ◽  
Fu Yan Zhao ◽  
Lu Hai Li
Keyword(s):  
Radio Frequency Identification ◽  
Low Cost ◽  
Flexible Substrate ◽  
Core Layer ◽  
Magnetic Core ◽  
Printed Antenna ◽  
Printed Antennas ◽  
Testing Frequency ◽  
Frequency Identification ◽  
Rfid Antennas

Printed antennas fabricated using conductive ink printed on flexible substrate is low-cost and environmental friendly. The inductance and the quality factor are two important parameters for designing RFID antenna and were studied for the printed RFID antennas. The results show that the inductance is not only determined by the size of the designed RFID antenna but also related to the resistance of the printed antenna coils. The inductance increases with the increasing testing frequency, while the Q value decreases with the increasing testing frequency. The soft magnetic ink prepared with γ-Fe2O3 was used to enhance the inductance of the printed antennas with printing technology. The inductance of the printed antenna with the magnetic core layer is increased by 5.7% at 13.56 MHz.

scholarly journals Low-Temperature Properties of the Magnetic Sensor with Amorphous Wire

Sensors ◽  
2020 ◽  
Vol 20 (23) ◽  
pp. 6986
Author(s):  
Dongfeng He ◽  
Kensei Umemori ◽  
Ryuichi Ueki ◽  
Takeshi Dohmae ◽  
Takafumi Okada ◽  
...  
Keyword(s):  
Low Temperature ◽  
Liquid Helium ◽  
Room Temperature ◽  
Magnetic Sensor ◽  
Liquid Helium Temperature ◽  
Coaxial Cable ◽  
Amorphous Wire ◽  
Helium Temperature ◽  
Sensing Element ◽  
The One

We found that a magnetic sensor made of a coil wound around a 5 f0.1 mm (Fe0.06Co0.94)72.5Si2.5B15 (FeCoSiB) amorphous wire could operate in a wide temperature range from room temperature to liquid helium temperature (4.2 K). The low-temperature sensing element of the sensor was connected to the room-temperature driving circuit by only one coaxial cable with a diameter of 1 mm. The one-cable design of the magnetic sensor reduced the heat transferring through the cable to the liquid helium. To develop a magnetic sensing system capable of operating at liquid helium temperature, we evaluated the low-temperature properties of the FeCoSiB magnetic sensor.

scholarly journals Low-Loss Polymer-Based Ring Resonator for Resonant Integrated Optical Gyroscopes

2014 ◽  
Vol 2014 ◽  
pp. 1-6 ◽  
Author(s):  
Guang Qian ◽  
Jie Tang ◽  
Xiao-Yang Zhang ◽  
Ruo-Zhou Li ◽  
Yu Lu ◽  
...  
Keyword(s):  
Ring Resonator ◽  
Propagation Loss ◽  
Geometrical Parameters ◽  
Navigation Systems ◽  
Sensing Element ◽  
Low Loss ◽  
Optical Gyroscope ◽  
Medium Resolution ◽  
Integrated Optical ◽  
Waveguide Ring

Waveguide ring resonator is the sensing element of resonant integrated optical gyroscope (RIOG). This paper reports a polymer-based ring resonator with a low propagation loss of about 0.476 dB/cm for RIOG. The geometrical parameters of the waveguide and the coupler of the resonator were optimally designed. We also discussed the optical properties and gyroscope performance of the polymer resonator which shows a high quality factor of about 105. The polymer-based RIOG exhibits a limited sensitivity of less than 20 deg/h for the low and medium resolution navigation systems.

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