ENHANCEMENT OF HEAT TRANSFER PERFORMANCE IN AN ALUMINUM HEAT SINK USING DIFFERENT NANO-COATINGS

2021 ◽  
Author(s):  
Senthil kumar P ◽  
Dr Suyambazhahan S ◽  
Suresh P R ◽  
Velraj R
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Transfer Performance ◽  
Enhancement Of Heat Transfer

Effects of Al2O3-Water Nanofluid and Angular Orientation on Entropy Generation and Convective Heat Transfer of an Elliptical Micro-Pin-Fin Heat Sink

2014 ◽  
Author(s):  
Husam Rajab ◽  
Da Yin ◽  
Hongbin Ma
Keyword(s):  
Heat Transfer ◽  
Entropy Generation ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Volume Fraction ◽  
Al2o3 Nanoparticles ◽  
Transfer Performance ◽  
Enhancement Of Heat Transfer ◽  
Pin Fin ◽  
Prandtl Numbers

This paper presents an investigation of the effect of nanofluid on the heat transfer performance in an elliptical micro-pin-fin heat sink including the influence of entropy generation and pin orientation. The orientation angle of pins is decreased with the number of pins in the array with a 90 degree angle for the first pin and a 0 degree angle for the last pin. To study the flow and heat transfer behaviors in a micro-pin-fin heat sink, steady Navier-Stokes and energy equations were discretized using a finite volume approach and were solved iteratively. Deionized (DI) water was used as a base coolant fluid while aluminum oxide (Al2O3) nanoparticles were used in the present study with mean diameters of 41.6 nm. The results showed that (1) changing the angular orientation of pins can cause significant enhancement in heat transfer, (2) a significant enhancement of heat transfer can be attained in the system due to the suspension of Al2O3 nanoparticles in the base fluid in comparison with pure water, (3) enhancement of heat transfer is intensified with increasing volume fraction of nanoparticles and Reynolds and Prandtl numbers, (4) increasing volume fraction of nanoparticles, which is responsible for higher heat transfer performance, leads to a higher pressure drop, (5) using nanofluids as coolant can cause lower heat transfer entropy generation due to their high thermal properties, and (6) with increasing volume fraction and Reynolds and Prandtl numbers, overall entropy generation rate decreases.

Boiling/Evaporation Heat Transfer Augmentation Using Subchannels-Inserted Metal Porous Media

2013 ◽  
Author(s):  
Kazuhisa Yuki ◽  
Masahiro Uemura ◽  
Koichi Suzuki ◽  
Ken-ichi Sunamoto
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Devices ◽  
High Heat Flux ◽  
Transfer Performance ◽  
Power Electronic ◽  
Copper Particles ◽  
Evaporation Heat

Two-phase flow loop system using a metal porous heat sink is proposed as a cooling system of the future power electronic devices with a heat load exceeding 300W/cm2. In this paper, as the first step, the heat transfer performance of the porous heat sink is evaluated under high heat flux conditions and the applicability and some engineering issues are discussed. The porous medium, which is fabricated by sintering copper particles, has a functional structure with several sub-channels inside it to enhance phase-change as well as discharge of generated vapor outside the porous medium. This porous heat sink is attached onto a heating chip and removes the heat by evaporating cooling liquid passing through the porous medium against the heat flow. Experiments using 30 kW of heating system show that the heat transfer performance of a copper-particles-sintered porous medium with the sub-channels exceeds 800W/cm2 in both high and low subcooling cases and achieves 300W/cm2 at a wall temperature of 150 °C (Tin = 70 °C) and 130 °C (Tin = 70 °C). These results prove that this porous heat sink is applicable enough for cooling 300 W/cm2 class of power electronic devices.

scholarly journals Enhanced heat transfer characteristics of conjugated air jet impingement on a finned heat sink

2017 ◽  
Vol 21 (1 Part A) ◽  
pp. 279-288 ◽  
Author(s):  
Shuxia Qiu ◽  
Peng Xu ◽  
Liping Geng ◽  
Arun Mujumdar ◽  
Zhouting Jiang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Enhancement ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Cooling System ◽  
Flow Characteristics ◽  
Jet Impingement ◽  
Transfer Performance ◽  
Transfer Enhancement ◽  
Air Jet

Air jet impingement is one of the effective cooling techniques employed in micro-electronic industry. To enhance the heat transfer performance, a cooling system with air jet impingement on a finned heat sink is evaluated via the computational fluid dynamics method. A two-dimensional confined slot air impinging on a finned flat plate is modeled. The numerical model is validated by comparison of the computed Nusselt number distribution on the impingement target with published experimental results. The flow characteristics and heat transfer performance of jet impingement on both of smooth and finned heat sinks are compared. It is observed that jet impingement over finned target plate improves the cooling performance significantly. A dimensionless heat transfer enhancement factor is introduced to quantify the effect of jet flow Reynolds number on the finned surface. The effect of rectangular fin dimensions on impingement heat transfer rate is discussed in order to optimize the cooling system. Also, the computed flow and thermal fields of the air impingement system are examined to explore the physical mechanisms for heat transfer enhancement.

scholarly journals Simulation analysis of heat transfer performance of heat sink with reduced material design

2020 ◽  
Vol 12 (5) ◽  
pp. 168781402092130
Author(s):  
Ya-Chu Chang
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Device ◽  
Local Heating ◽  
Transfer Performance ◽  
Electronic Components ◽  
Thermal Reliability

The field of electronic device applications is becoming more and more extensive. With the development of science and technology and the improvement of the integration of electronic components, local heating is becoming more and more serious. If heat cannot be discharged immediately, it will cause heat to accumulate, causing the temperature of each component to exceed the limit. The reliability of electronic equipment is greatly reduced. Especially in important fields such as military and aerospace, the thermal reliability of electronic components is higher. The research results show that increasing the Reynolds number is helpful to reduce the overall temperature and thermal resistance of the heat sink, but the increase of the Reynolds number and the decrease of the thermal resistance value are gradually flat. The design concept of material reduction has a significant impact on processing and cost. The results of this article show that selecting the appropriate heat sink fins and matching the specific Reynolds number can effectively improve the heat transfer performance of the heat sink.

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