EQUILIBRIUM VACANCY CONCENTRATION AND THERMODYNAMIC QUANTITIES OF FCC DEFECTIVE ALLOYS AuCuSi AND PtCuSi UNDER PRESSURE AND TEMPERATURE

2021 ◽  
Vol 66 (3) ◽  
pp. 38-51
Author(s):  
Viet Le Hong ◽  
Hoc Nguyen Quang
Keyword(s):  
Experimental Data ◽  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Constant Pressure ◽  
Vacancy Concentration ◽  
Heat Capacities ◽  
Thermodynamic Quantities ◽  
Equilibrium Vacancy ◽  
Equilibrium Vacancy Concentration

We present the analytic expressions of the cohesive energy, the alloy parameters, the equation of state, the mean nearest neighbor distance, the Helmholtz free energy, equilibrium vacancy concentration, and thermodynamic quantities such as the isothermal compressibility, the thermal expansion coefficient, the heat capacities at constant volume and constant pressure for facecentered cubic (FCC) defective ternary substitutional and interstitial alloy ABC derived by the statistical moment method (SMM). The obtained thermodynamic quantities depend on temperature, pressure, the concentration of substitutional atoms, the concentration of interstitial atoms, and equilibrium vacancy concentration. Thermodynamic quantities of FCC defective metal A, FCC defective substitutional alloy AB, and FCC defective interstitial alloy AC are specific cases for thermodynamic quantities of FCC defective ternary substitutional and interstitial alloy ABC. The theoretical results are calculated numerically to alloys AuCuSi and PtCuSi. Our calculated results of thermal expansion coefficient and heat capacities at constant pressure for main metals Au, Pt are in good agreement with experimental data. Our other calculated results for thermodynamic quantities of alloys AuCuSi and PtCuSi at different temperatures, pressure, the concentration of substitutional atoms, and concentrations of interstitial atoms orient and predict new experimental data in the future.

SIZE AND TEMPERATURE EFFECT ON THERMAL EXPANSION COEFFICIENT AND LATTICE PARAMETER OF NANOMATERIALS

2013 ◽  
Vol 27 (25) ◽  
pp. 1350180 ◽  
Author(s):  
RAGHUVESH KUMAR ◽  
GEETA SHARMA ◽  
MUNISH KUMAR
Keyword(s):  
Experimental Data ◽  
Thermal Expansion ◽  
Temperature Dependence ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Size Dependence ◽  
Coefficient Of Thermal Expansion ◽  
Lattice Parameter ◽  
Model Predictions ◽  
Good Agreement

A simple theoretical model is developed to study the effect of size and temperature on the coefficient of thermal expansion and lattice parameter of nanomaterials. We have studied the size dependence of thermal expansion coefficient of Pb , Ag and Zn in different shape viz. spherical, nanowire and nanofilm. A good agreement between theory and available experimental data confirmed the model predictions. We have used these results to study the temperature dependence of lattice parameter for different size and also included the results of bulk materials. The temperature dependence of lattice parameter of Zn nanowire and Ag nanowire are found to present a good agreement with the experimental data. We have also computed the temperature and size dependence of lattice parameter of Se and Pb for different shape viz. spherical, nanowire and nanofilm. The results are discussed in the light of recent research on nanomaterials.

scholarly journals BARIC DEPENDENCE OF LATTICE PROPERTIES FOR DIAMOND

2018 ◽  
Vol 59 (9) ◽  
pp. 57
Author(s):  
Makhach N. Magomedov
Keyword(s):  
Experimental Data ◽  
Thermal Expansion ◽  
Elastic Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Interatomic Potential ◽  
State Equation ◽  
Relative Volume ◽  
Lennard Jones ◽  
Good Agreement

Based on the pairwise interatomic potential of Mi-Lennard-Jones and the Einstein's model of crystal the state equation P(V/V0, T) and the baric dependencies of the lattice properties for diamond were obtained. The calculations were performed along two isotherms: T = 300 and 3000 K and until to P = 10000 kbar (i.e. until to the relative volume V/V0 = 0.5). The baric dependencies for the following properties were obtained: isothermal elastic modulus, isochoric and isobaric heat capacities and thermal expansion coefficient. Good agreement with experimental data was obtained.

Thermodynamic properties of crystalline KCl

1989 ◽  
Vol 67 (7) ◽  
pp. 664-668 ◽  
Author(s):  
T. H. Kwon
Keyword(s):  
Experimental Data ◽  
Thermal Expansion ◽  
Thermodynamic Properties ◽  
Specific Heat ◽  
Thermal Expansion Coefficient ◽  
Thermodynamic Functions ◽  
Linear Thermal Expansion Coefficient ◽  
Constant Pressure ◽  
Linear Thermal Expansion ◽  
Adiabatic Compressibility

Thermodynamic functions of crystalline KCl have been evaluated using a localized model characterized by a pseudopotential and direct Brillouin zone sums. Numerical results are compared with available experimental data for adiabatic compressibility, the linear thermal expansion coefficient, specific heat at constant volume, and specific heat at constant pressure. Calculated results show excellent agreement with experimentally observed data.

scholarly journals Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Young's Modulus ◽  
Heating Temperature ◽  
Glass Substrates ◽  
Ito Thin Films

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.

scholarly journals Alternative of bone china and porcelain as ceramic hand molds for rubber latex glove films formation via dipping process

2020 ◽  
Vol 59 (1) ◽  
pp. 523-537
Author(s):  
Chaturaphat Tharasana ◽  
Aniruj Wongaunjai ◽  
Puwitoo Sornsanee ◽  
Vichasharn Jitprarop ◽  
Nuchnapa Tangboriboon
Keyword(s):  
Thermal Expansion ◽  
Flexural Strength ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Mold Surface ◽  
Rubber Latex ◽  
Latex Glove ◽  
Bone China ◽  
Synthetic Rubber ◽  
Natural And Synthetic

AbstractIn general, the main compositions of porcelain and bone china composed of 54-65%wt silica (SiO2), 23-34% wt alumina (Al2O3) and 0.2-0.7%wt calcium oxide (CaO) suitable for preparation high quality ceramic products such as soft-hard porcelain products for teeth and bones, bioceramics, IC substrate and magneto-optoelectroceramics. The quality of ceramic hand mold is depended on raw material and its properties (pH, ionic strength, solid-liquid surface tension, particle size distribution, specific surface area, porosity, density, microstructure, weight ratio between solid and water, drying time, and firing temperatures). The suitable firing conditions for porcelain and bone china hand-mold preparation were firing at 1270°C for 10 h which resulted in superior working molds for making latex films from natural and synthetic rubber. The obtained fired porcelain hand molds at 1270°C for 10 h provided good chemical durability (10%NaOH, 5%HCl and 10%wtNaCl), low thermal expansion coefficient (5.8570 × 10−6 (°C−1)), good compressive (179.40 MPa) and good flexural strength (86 MPa). While thermal expansion coefficient, compressive and flexural strength of obtained fired bone china hand molds are equal to 6.9230 × 10−6 (°C−1), 128.40 and 73.70 MPa, respectively, good acid-base-salt resistance, a smooth mold surface, and easy hand mold fabrication. Both obtained porcelain and bone china hand molds are a low production cost, making them suitable for natural and synthetic rubber latex glove formation.

Equilibrium vacancy concentration in an alloy with interstitial impurities

1981 ◽  
Vol 24 (4) ◽  
pp. 338-342
Author(s):  
V. A. Klimenko ◽  
S. I. Masharov ◽  
A. F. Rybalko ◽  
N. M. Rybalko ◽  
N. I. Timofeev
Keyword(s):  
Vacancy Concentration ◽  
Interstitial Impurities ◽  
Equilibrium Vacancy ◽  
Equilibrium Vacancy Concentration

scholarly journals Modeling the effects of loading scenario and thermal expansion coefficient on potential failure of cryo-compressed hydrogen vessels

2020 ◽  
Vol 45 (46) ◽  
pp. 24883-24894 ◽  
Author(s):  
Ba Nghiep Nguyen ◽  
Daniel R. Merkel ◽  
Kenneth I. Johnson ◽  
David W. Gotthold ◽  
Kevin L. Simmons ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Potential Failure
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