scholarly journals Special Issue on Intelligent Integrated Systems for Robotics

1994 ◽  
Vol 6 (2) ◽  
pp. 119-119
Author(s):  
Michitaka Kameyama ◽  
Keyword(s):  
Real World ◽  
Integrated Circuit ◽  
Integrated Systems ◽  
Next Generation ◽  
Special Issue ◽  
Robot Systems ◽  
Scale Integration ◽  
Near Future ◽  
Circuit Technology

The new area of ""intelligent integrated systems"" has been proposed to develop one of the generic technologies for next-generation electronics and information systems. Although the interpretation may be different for individual persons, I think the area is the integration of the three concepts as shown in Figure. One is the concept of ""system on silicon"" using the integrated circuit technology. Giga-scale integration will be available in near future, so that we have to develop hardware and software architecture related to ultra highly parallel processing. Another is the concept of intelligence including physical model based computations as well as AI technology. The other is the concept of real-world applications just different from computer-world applications. The signal flow is passed through a real world, so that the performance should be evaluated as the response time or delay time. The examples are robotics, car electronics, home electronics, factory automation and so on. This special issue is planned to demonstrate the above important area, especially dedicated for robotics which is a typical example of the intelligent integrated systems. I believe that the contents of this issue give great impact on' the next-generation robot systems, and it will be a memorial publication. Finally, I would like to express my appreciation to the authors for their efforts and contributions to this special issue and also to the members of the Editorial Board for their useful comments.

Special Issue on Robot Vision - Vision for Action -

2009 ◽  
Vol 21 (6) ◽  
pp. 671-671
Author(s):  
Masanori Idesawa ◽  
◽  
Yasushi Mae ◽  
Junji Oaki ◽  
◽  
...  
Keyword(s):  
Real World ◽  
Visual Servoing ◽  
Robot Vision ◽  
Optical Force ◽  
Human Vision ◽  
Special Issue ◽  
Visual Sensor ◽  
Robot Systems ◽  
Vision For Action

Robot vision is a key technology in robotics and mechatronics for realizing intelligent robot systems that work in the real world. The fact that robot vision algorithms required much time and effort to apply in real-world applications has delayed their dissemination until new forms made possible by recent rapid improvements in computer speed. Now the day is coming when robot vision may surpass human vision in many applications. This special issue presents 13 papers on the latest robot vision achievements and their applications. The first two propose ways of measuring and modeling 3D objects in everyday environments. Four more detail object detection and tracking, including visual servoing. Three propose advances in hand feature extraction and pose calculation, and one treats video coding for visual sensor networks. Two papers discuss robot vision applications based on human visual physiology, and the last clarifies an application in optical force sensors. We thank the authors for their invaluable contributions to this issue and the reviewers for their generous time and effort. Last, we thank the Editorial Board of JRM for making this issue possible.

Special Issue on Intelligent Integrated Systems for Human-Oriented Information Society

2000 ◽  
Vol 12 (5) ◽  
pp. 501-501
Author(s):  
Michitaka Kameyama ◽  
Keyword(s):  
Real World ◽  
Intelligent Transportation System ◽  
Data Transfer ◽  
Image Sensor ◽  
Sensor Data ◽  
Service Robot ◽  
Human Beings ◽  
Special Issue ◽  
Real World Data

Recent advance in the information technology makes our society very convenient from the viewpoint of human-to-human information communication. However, our new living style will require not only human-tohuman communication but also autonomous intelligent applications that support human beings such as an intelligent robot system, an intelligent transportation system, and a security/safe system as shown in Figure. These applications will contribute to human-oriented information society.Intelligent vehicle Home service robot Security The use of special-purpose VLSI processors capable of processing a large amount of real-world data is essential to make such applications realistic. In recent industrial trend, the special-purpose processors are called ""System LSIs"". One of the most important environmental informations in real-world applications is a vision information. The factor common to the applications is to catch an environment information moment by moment and to respond quickly with it. Therefore, it is important to make the response time from inputs to outputs very small. In this case, sensor data transfer bottleneck is not allowed as well as memory-to-PE (Processing Element) data transfer bottleneck. An image sensor signal processing VLSI together with image sensor devices is a key issue in such applications. From the above point of views, this special issue was planned to demonstrate the recent results of this area. Finally, I would like to express my appreciation to the authors for their efforts and contributions to this special issue and also the members of the Editorial Board for their cooperation.

scholarly journals Giga-Scale Integration System-On-A-Chip Design: Challenges and Noteworthy Solutions

2020 ◽  
Vol 8 (6) ◽  
pp. 741-746
Keyword(s):  
Integrated Circuit ◽  
High Performance ◽  
Chip Design ◽  
Future Challenges ◽  
System On A Chip ◽  
And Performance ◽  
Exponential Rates ◽  
Scale Integration ◽  
Bus Architecture ◽  
Circuit Technology

In all respects of the last five decades, integrated circuit technology has advanced at exponential rates in both productivity and performance. Giga-Scale Integration (GSI) System-On-A-Chip (SoC) designs have become one of the main drivers of the integrated circuit technology in recent years. The objective of this work is to understand the challenges of Giga-scale SoC integration in nanometer technologies, and identify promising conveniences for innovation. Physical designs are crucial for SoC integration and in our work we identify them with details. In future the couplings and interactions among system components will increase as we put more of the system on a silicon die. Therefore the system designers will face challenges in several areas and we describe these future challenges briefly. Developing a design driver for GSI SoC design is important. With the help of this design driver we provide the design methodology, which ensures the high performance of the design. We present two noteworthy solutions which overcome the challenges of GSI SoC design. One is reuse and integration and another is efficient bus architecture. We also provide the challenges for verification of GSI SoC and methods to overcome these challenges.

scholarly journals Special Issue on VLSI Computing for Real-World Intelligent Systems

2005 ◽  
Vol 17 (4) ◽  
pp. 371-371
Author(s):  
Masanori Hariyama ◽  
Keyword(s):  
Real World ◽  
Visual Information ◽  
Intelligent Systems ◽  
High Speed ◽  
Data Transfer ◽  
Service Robots ◽  
Low Latency ◽  
Special Issue ◽  
Information Image

Recently, intelligent systems are desired to support human in real world such as advanced safe vehicles, home service robots, wearable computing devices, and intelligent home security systems. Such intelligent systems require extremely high computational power that exceeds that of state-of-the-art microprocessors. They also require <ul><li>Low power consumption</li><li>Low latency from input to output</li><li>Compactness</li></ul> Special-purpose processors called ""system LSIs"" play an essential role in meeting these requirements. This special issue focuses on the latest advances in system LSIs for real-world intelligent systems. One of their most important tasks is sensing environmental information such as visual information. Image and angle sensors, for example, are implemented in system LSIs. Image processing is the most time-consuming in real-world intelligent systems due to the extremely large amount of data. To overcome this problem, novel parallel architectures are presented. Electrical wires between processing modules must be minimized to make intelligent systems compact. High-speed serial data transfer is one most effective way to minimize the electrical wires. An architecture that handles processing order based on task priorities is a key to low latency. Processing of human interfaces such as face detection and speech recognition are also important factors in making intelligent systems user-friendly. I thank the authors of the articles in this issue for their effort and contributions, and the members of the Editorial Board for their cooperation.

Si/SiGe and III-V Integrated Circuit Technology for Next Generation High-Speed Systems: Comparisons and Tradeoffs

1998 ◽  
Vol 535 ◽  
Author(s):  
Lawrence E. Larson
Keyword(s):  
Integrated Circuit ◽  
High Speed ◽  
Next Generation ◽  
Circuit Technology

AbstractThis paper will summarize the technology tradeoffs that are involved in the implementation of high-speed integrated circuit technology for communications applications. The advantages of Si/SiGe and III-V technology with respect to CMOS and Si bipolar technologies are discussed.

An Approach to Reading Machine Design

1978 ◽  
Vol 20 (3) ◽  
pp. 287-293 ◽  
Author(s):  
Jonathan Allen
Keyword(s):  
Integrated Circuit ◽  
Large Scale ◽  
Read Aloud ◽  
Machine Design ◽  
Current Status ◽  
Text To Speech ◽  
Short Term ◽  
Large Scale Integration ◽  
Scale Integration ◽  
Circuit Technology

Within two years, both the required algorithmic competence and the necessary integrated circuit technology will have been developed to a point where practical personal reading machines for the blind will be possible. In this paper, the linguistic and phonetic principles needed to convert optically recognized text to speech are discussed, and it is shown how they mirror the human cognitive ability to read aloud. A perspective on the current status and rate of progress of large scale integration technology is then used to show that economical implementations of even complex text-to-speech algorithms can be realized in the short-term future. Finally, a view of important human factors problems requiring attention is given.

Integrated Circuit Technology for Next Generation Point-of-Care Spectroscopy Applications

2017 ◽  
Vol 55 (10) ◽  
pp. 143-151 ◽  
Author(s):  
Jonas Handwerker ◽  
Benedikt Schlecker ◽  
Maurits Ortmanns ◽  
Jens Anders
Keyword(s):  
Integrated Circuit ◽  
Point Of Care ◽  
Next Generation ◽  
Circuit Technology

scholarly journals Special Issue on Integration of Intelligence for Robotics in VLSI Chips

1996 ◽  
Vol 8 (6) ◽  
pp. 491-491
Author(s):  
Michitaka Kameyama ◽  
Keyword(s):  
Real World ◽  
High Speed ◽  
General Purpose ◽  
The Other ◽  
Computational Power ◽  
Special Issue ◽  
Processing Technologies ◽  
Vlsi Technology ◽  
Automation Systems

Intelligence is one of the most important subjects in information and electronics systems. In many applications such as multi media systems, home electronics systems, factory automation systems, security systems and aerospace systems, advanced intelligent processing technologies are more required to be developed as shown in Figure. There are two approaches to increase intelligence, although they are closely related each other and may not be separable. One is an algorithm-based approach to directly increase intelligence quality. The other is a computational-power-based approach to directly increase processing performance. Even if a single operation is very simple, its repeated operations often make the processing intelligent. The problem is how to increase the computational power. It is obvious that software acceleration using general-purpose microprocessors has some limitation. Therefore, special acceleration using newly developed chips is one of the most important solutions. In particular, real-world applications need to achieve very quick response for dynamically changing real-world environment. Therefore, special-purpose processors and special-purpose accelerators or engines, are essential to make the above applications realistic. Another words, ""to realize high speed processing intelligence"" On the other hand, solid-state circuits technology enabling single-chip systems have rapid advancement resulting in dramatic improvements in both performance and cost oer function. In fact, one-giga-bit DRAMs, ten SPECint95 microprocessors containing ten million transistors are being developed by recent VLSI technology. It is no more a dream to develop practical special processors using the recent VLSI technology. Moreover, new architecture and new concept circuits have been actively studied for the next-generation integration technology. From the above point of view, this special issue was planned to demonstrate the above important area. Especially, intelligent robot is a typical class of applications, soits intelligence technology makes also any other application promising. Finally, I would like to express my application to the authors for their efforts and contributions to this special issue and also the members of the Editorial Board for their useful comments.

Preparation of TEM samples by focused ion beams

1995 ◽  
Vol 53 ◽  
pp. 518-519
Author(s):  
John F. Walker ◽  
J C Reiner ◽  
C Solenthaler
Keyword(s):  
Integrated Circuit ◽  
Polycrystalline Silicon ◽  
Field Effect Transistor ◽  
High Spatial Resolution ◽  
Ion Beam ◽  
Ion Beams ◽  
Focused Ion Beams ◽  
Precise Location ◽  
Effect Transistor ◽  
Circuit Technology

The high spatial resolution available from TEM can be used with great advantage in the field of microelectronics to identify problems associated with the continually shrinking geometries of integrated circuit technology. In many cases the location of the problem can be the most problematic element of sample preparation. Focused ion beams (FIB) have previously been used to prepare TEM specimens, but not including using the ion beam imaging capabilities to locate a buried feature of interest. Here we describe how a defect has been located using the ability of a FIB to both mill a section and to search for a defect whose precise location is unknown. The defect is known from electrical leakage measurements to be a break in the gate oxide of a field effect transistor. The gate is a square of polycrystalline silicon, approximately 1μm×1μm, on a silicon dioxide barrier which is about 17nm thick. The break in the oxide can occur anywhere within that square and is expected to be less than 100nm in diameter.

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