Hybridization effect on Electrical Conductivity and Thermal Behavior of Epoxy/Carbon Nanotubes and Biosynthesized Silver Nanoparticles Composites

Abstract An attempt was made in this work to decorated carbon nanotubes(CNTs) in a polymer matrix using biosynthesized silver nanoparticles (GAgNPs) using Cashew leaves as a reduction agent. The new hybrid epoxy-CNTs+ GAgNPs composites were produced by modified solution-stir-cast method. The microstructure, thermal properties, strength, and electrical conductivity of the produced composites were determined. The electrical conductivity of the epoxy polymer has been enhanced from 5.6x10-13S/cm to 4.80x10-3S/cm for epoxy-0.5%CNTs and 9.1x10-3S/cm epoxy-0.5%CNTs-0.5%GAgNPs. GAgNPs was effective used to improve the strength of conducting epoxy-CNTs for electronic devices. The addition of CNTs and GAgNPs to epoxy increases the glass transition temperature. It was established that GAgNPs can be promising materials to enhanced thermal conductivity, strength, electrical conductivity of epoxy-CNTs and recover the potential reduction for electronic devices application.

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Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Journal of Electronic Packaging ◽

10.1115/1.4049240 ◽

2020 ◽

Author(s):

Jerzy Szalapak ◽

Konrad Kielbasinski ◽

Lucja Dybowska-Sarapuk ◽

Jakub Krzeminski ◽

Marian Teodorczyk ◽

...

Keyword(s):

Thermal Conductivity ◽

Carbon Nanotubes ◽

Silver Nanoparticles ◽

Carbon Nanoparticles ◽

Electronic Devices ◽

Thermal And Electrical Properties ◽

The Military ◽

The Impact ◽

High Temperature Electronic ◽

Lower Electrical Resistivity

Abstract 90% of High Temperature Electronic devices operate in temperatures in range from 150 to 300ºC and for such temperature needs, technologies typical for the military range might be adapted. To make it possible, new joining techniques are developed, one of which is use of pastes with silver nanoparticles sintered with Low Temperature Joining Technique. Silver sintered joints have three times higher thermal conductivity and five times lower electrical resistivity than typical solders, while being able to operate in temperatures reaching 350ºC. In current paper, the authors show the impact of additions of carbon nanoparticles on joints prepared in LTJT technology. The authors prove, that an addition of few percent of graphene nanoplatelets or carbon nanotubes improves joints mechanical, thermal and electrical properties, while ensuring proper rheology of pastes.

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Influence of filler hybridization on thermomechanical properties of hemp/silver epoxy composite

Polymers and Polymer Composites ◽

10.1177/0967391120978112 ◽

2020 ◽

pp. 096739112097811

Author(s):

Munjula Siva Kumar ◽

Santosh Kumar ◽

Krushna Gouda ◽

Sumit Bhowmik

Keyword(s):

Thermal Conductivity ◽

Silver Nanoparticles ◽

Epoxy Polymer ◽

Hybrid Composites ◽

Conductive Filler ◽

Weight Fraction ◽

Mechanical Analysis ◽

Thermomechanical Properties ◽

Material Behavior ◽

Good Crystallinity

The polymer composite material’s thermomechanical properties with fiber as reinforcement material have been widely studied in the last few decades. However, these fiber-based polymer composites exhibit problems such as fiber orientation, delamination, fiber defect along the length and bonding are the matter of serious concern in order to improve the thermomechanical properties and obtain isotropic material behavior. In the present investigation filler-based composite material is developed using natural hemp and high thermal conductive silver nanoparticles (SNP) and combination of dual fillers in neat epoxy polymer to investigate the synergetic influence. Among various organic natural fillers hemp filler depicts good crystallinity characteristics, so selected as a biocompatible filler along with SNP conductive filler. For enhancing their thermal conductivity and mechanical properties, hybridization of hemp filler along with silver nanoparticles are conducted. The composites samples are prepared with three different combinations such as sole SNP, sole hemp and hybrid (SNP and hemp) are prepared to understand their solo and hybrid combination. From results it is examined that, chemical treated hemp filler has to maximized its relative properties and showed, 40% weight % of silver nanoparticles composites have highest thermal conductivity 1.00 W/mK followed with hemp filler 0.55 W/mK and hybrid 0.76 W/mK composites at 7.5% of weight fraction and 47.5% of weight fraction respectively. The highest tensile strength is obtained for SNP composite 32.03 MPa and highest young’s modulus is obtained for hybrid composites. Dynamic mechanical analysis is conducted to find their respective storage modulus and glass transition temperature and that, the recorded maximum for SNP composites with 3.23 GPa and 90°C respectively. Scanning electron microscopy examinations clearly illustrated that formation of thermal conductivity chain is significant with nano and micro fillers incorporation.

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Microstructure, electrical conductivity, and wear behavior of aluminum-carbon nanotubes and biosynthesized silver nanoparticles composites

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-021-07151-x ◽

2021 ◽

Author(s):

Clifford Ugochukwu Nwoji ◽

Victor Sunday Aigbodion ◽

John Akpan John

Keyword(s):

Carbon Nanotubes ◽

Electrical Conductivity ◽

Silver Nanoparticles ◽

Wear Behavior

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Constructing Three-dimensional Nano-crystalline Diamond Network within Polymer Composites for Enhanced Thermal Conductivity

Nanoscale ◽

10.1039/d1nr05481c ◽

2021 ◽

Author(s):

Shaoyang Xiong ◽

Yue Qin ◽

Linhong Li ◽

Guoyong Yang ◽

Maohua Li ◽

...

Keyword(s):

Thermal Conductivity ◽

Polymer Composites ◽

Thermal Performance ◽

Thermal Transport ◽

High Performance ◽

Rapid Development ◽

Electronic Devices ◽

Three Dimensional ◽

Nano Crystalline ◽

Enhanced Thermal Conductivity

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...

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