Interfacial reactions between solid Ni and liquid Sn-Zn alloys
2015 ◽
Vol 51
(2)
◽
pp. 179-184
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Keyword(s):
The limitation of the harmful lead-containing solders used in the electronics and other industry applications change lead with another metals. Interfacial reactions between Sn-Zn alloys and Ni substrate after annealing at 400 and 450?C were studied. Three intermetallic compounds Ni3Sn4, T1, ?-Ni5Zn21 and liquid Sn were observed in the Ni/Sn-Zn diffusion couples. Scanning electron microscope was used for the investigation of the microstructure. The microhardness measurement of the intermetallic layers was also performed.
1995 ◽
Vol 32
(4)
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pp. 330-336
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2011 ◽
Vol 399-401
◽
pp. 1457-1460
2021 ◽
Vol 1035
◽
pp. 1078-1088
2016 ◽
Vol 52
(1)
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pp. 113-118
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1973 ◽
Vol 31
◽
pp. 210-211
1969 ◽
Vol 27
◽
pp. 20-21
1971 ◽
Vol 29
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pp. 26-27
1970 ◽
Vol 28
◽
pp. 386-387
1973 ◽
Vol 31
◽
pp. 44-45
1973 ◽
Vol 31
◽
pp. 302-303