Silicon Die Bonding using a Photostructurable Adhesive Material

2020 ◽  
Author(s):  
Kai Hollstein ◽  
Kirsten Weide-Zaage
Keyword(s):  
Adhesive Material ◽  
Die Bonding

Analysis of Two Electrical Failures Caused by Die Attach of Exposed Pad Package

2014 ◽  
Author(s):  
Jinglong Li ◽  
Motohiko Masuda ◽  
Yi Che ◽  
Miao Wu
Keyword(s):  
Bonding Process ◽  
Die Attach ◽  
Die Bonding ◽  
Generic Analysis

Abstract Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by die attach are not so simple. And it is not proper to analyze by a generic analysis flow. The analysis of two failures caused by die attach are presented in this paper.

Design of a wheeled wall climbing robot based on the performance of bio-inspired dry adhesive material

Robotica ◽  
2021 ◽  
pp. 1-14
Author(s):  
Hongkai Li ◽  
Xianfei Sun ◽  
Zishuo Chen ◽  
Lei Zhang ◽  
Hongchao Wang ◽  
...  
Keyword(s):  
Flat Surface ◽  
Thrust Force ◽  
Adhesion Force ◽  
Structure Design ◽  
Design Parameters ◽  
Climbing Robot ◽  
Adhesive Material ◽  
Ducted Fan ◽  
The Stability ◽  
Belt System

Abstract Inspired by gecko’s adhesive feet, a wheeled wall climbing robot is designed in this paper with the synchronized gears and belt system acting as the wheels by considering both motion efficiency and adhesive capability. Adhesion of wheels is obtained by the bio-inspired adhesive material wrapping on the outer surface of wheels. A ducted fan mounted on the back of the robot supplies thrust force for the adhesive material to generate normal and shear adhesion force whilemoving on vertical surfaces. Experimental verification of robot climbing on vertical flat surface was carried out. The stability and the effect of structure design parameters were analyzed.

Die Bonding Issues on Silicon Carbide Diodes

2006 ◽  
Vol 527-529 ◽  
pp. 875-878 ◽  
Author(s):  
Seung Yong Lee ◽  
Jang Sub Lee ◽  
Tae Hong Kim ◽  
Sung Yong Choi ◽  
Hak Jong Kim ◽  
...  
Keyword(s):  
Shear Test ◽  
Vertical Structure ◽  
Optical Microscope ◽  
Device Fabrication ◽  
Cleaning Process ◽  
X Ray ◽  
The Third ◽  
Bottom Side ◽  
Die Bonding

We report on the die bonding processes and how the surface roughness and metallization schemes affect the processes of die bonding in 4H-SiC device fabrication using a soldering test and die shear test (DST) with differently prepared 4H-SiC samples. The first set of samples (FZ#1 and FZ#2) was capped with sequentially evaporated Ti and Au on an annealed Ni layer. The second set of samples (FZ#3 and FZ#4) and the third set of samples (FZ#5 and FZ#6) were prepared by 4μm-thick Au electroplating on an annealed Ni layer and an un-annealed Ni layer, respectively. The quality of the soldering, such as the solder coverage, void, and adhesion, was characterized by optical microscope, X-ray microprobe, and DST. We found that the samples (FZ#4 and FZ#6) deposited by Au electroplating on C-face (bottom-side) 4H-SiC provided a satisfactory result for the tests of solder coverage, void, and DST and also realized the cleaning process prior to the electroplating and soldering was the most crucial in the die packaging processes of vertical structure devices. The void fraction measured by X-ray microprobe for the samples, FZ#4 and FZ#6 was 2.2% (average for 5 samples) and 0.8% (average for 3 samples), respectively.

Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density

2014 ◽  
Vol 43 (12) ◽  
pp. 4510-4514 ◽  
Author(s):  
V. Caccuri ◽  
X. Milhet ◽  
P. Gadaud ◽  
D. Bertheau ◽  
M. Gerland
Keyword(s):  
Mechanical Properties ◽  
New Material ◽  
Die Bonding ◽  
Sintered Ag

scholarly journals Marginal Integrity of Partial Ceramic Crowns Within Dentin With Different Luting Techniques and Materials

2008 ◽  
Vol 33 (5) ◽  
pp. 516-525 ◽  
Author(s):  
F. Schenke ◽  
K-A. Hiller ◽  
G. Schmalz ◽  
M. Federlin
Keyword(s):  
Clinical Relevance ◽  
The Self ◽  
The Other ◽  
Adhesive Material ◽  
Marginal Integrity ◽  
Resin Coating ◽  
Partial Ceramic Crowns ◽  
Relyx Unicem ◽  
Composite Interface ◽  
Ceramic Crowns

Clinical Relevance Resin coating improves the marginal seal of partial ceramic crowns to dentin compared to conventional luting, especially at the dentin/composite interface. However, the self-adhesive material RelyX Unicem shows significantly better marginal integrity than the other materials tested.

The Influence of Agglomerators on Powdering of Chloroprene Rubber PCR-244

2015 ◽  
Vol 1119 ◽  
pp. 334-337
Author(s):  
Xu Ling Wei ◽  
Yu Li Wei ◽  
Guang Bi Gong ◽  
Tao Liang ◽  
Wen Jing Cai ◽  
...  
Keyword(s):  
Sodium Chloride ◽  
Potassium Chloride ◽  
Magnesium Sulfate ◽  
Calcium Chloride ◽  
Aluminum Chloride ◽  
Adhesive Material ◽  
Monovalent Salt ◽  
Chloroprene Rubber ◽  
Direct Condensation

Powdered polychloroprene rubber (PCR-244) was prepared by the direct condensation, and the influence of agglomerator kinds and dosages on powdering of PCR-244 were investigated, including trivalent salt (aluminum chloride), divalent salt (magnesium sulfate, calcium chloride) and monovalent salt (sodium chloride, potassium chloride). The result showed that powder chloroprene rubber could be used as adhesive material that calcium chloride was used as agglomerator.

scholarly journals Broadband III-V on silicon hybrid superluminescent LEDs by quantum well intermixing and multiple die bonding

2014 ◽  
Author(s):  
A. De Groote ◽  
J. D. Peters ◽  
M. L. Davenport ◽  
M. J. R. Heck ◽  
R. Baets ◽  
...  
Keyword(s):  
Quantum Well ◽  
Quantum Well Intermixing ◽  
Die Bonding
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