Analysis and Design of a 1200 V All-SiC Planar Interconnection Power Module for Next Generation More Electrical Aircraft Power Electronic Building Blocks

Abstract Efficient, compact, and reliable power electronic modules are building blocks of modern day power electronic systems. In recent times, wide bandgap semiconductor devices, such as, silicon carbide (SiC) and gallium nitride (GaN), are widely investigated and used in the power electronic modules to realize power dense, highly efficient, and fast switching modules for various applications. For high power applications is it required to parallel and series several devices to achieve high current and high voltage specifications, which results in larger current conducting traces. One of the major obstacles in using these wideband gap power semiconductor devices are the internal module stray inductance that is associated with these current conducting traces. With increasing demand for higher switching frequency, the internal module parasitic inductance must be reduced to as minimum as possible in order to utilize the full potential of the wide bandgap devices. A multi-layer approach of low-temperature co-fired ceramic (LTCC) to package the wide bandgap devices is investigated. The multi-layer design freedom by using LTCC can be utilized to reduce the footprint of the overall power module, electrical interconnects, hence, reducing the package parasitic inductance. LTCC also facilitates high temperature operations and has a coefficient of thermal expansion matching with wide bandgap devices. In this paper, we report on a LTCC based power module design where LTCC is utilized as an isolation layer between the source and the drain of the power devices. A simulation based parasitic inductance analysis and electro-thermal-mechanical study is performed using ANSYS Workbench Tools to investigate the feasibility of this LTCC based design.

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Identification of the Sn96.5Ag3.5 Law Behavior with the Scatter of the Parameters - Study of Aeronautical Application in Power Module

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.112.83 ◽

2010 ◽

Vol 112 ◽

pp. 83-92

Author(s):

Alexandre Micol ◽

Adrien Zéanh ◽

Olivier Dalverny ◽

Moussa Karama

Keyword(s):

Time Series ◽

Thermal Cycling ◽

Experimental Test ◽

Element Model ◽

Electronic Component ◽

Power Electronic ◽

Power Module ◽

Soldering Process ◽

Nite Element ◽

The Law

This work studies the reliability of power electronic component in aeronautical environment to the ageing eect of the thermal cycling. The structure fatigue is sensitive to the process assembly conditions especially of the soldering process. To correclty evaluate the reliability of the power module, the identication of the solder behavior is one of the rst steps. Anand Model is here identied. Experimental test have to be established to evaluate the parameters of the law. A srt study is made to evaluate the indetiability of the law according to the dierent experimantal test. Then, the scatter of the parameters is evaluated in a context of time series. In the end, the scatter of the parameters is included in a nite element model to understand the inuence of this scatter on the evaluation of the number of cycle before failure.

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Recent Progress in the Synthesis and Characterization of Diarylethene-based MOFs

Acta Crystallographica Section A Foundations and Advances ◽

10.1107/s2053273314087762 ◽

2014 ◽

Vol 70 (a1) ◽

pp. C1223-C1223

Author(s):

Jason Benedict ◽

Ian Walton ◽

Dan Patel ◽

Jordan Cox

Keyword(s):

Chemical Properties ◽

Building Blocks ◽

Synthesis And Characterization ◽

Next Generation ◽

Design Synthesis ◽

Thermally Induced ◽

Potential Applications ◽

External Stimuli ◽

Physical And Chemical

Metal-organic Frameworks (MOFs) remain an extremely active area of research given the wide variety of potential applications and the enormous diversity of structures that can be created from their constituent building blocks. While MOFs are typically employed as passive materials, next-generation materials will exhibit structural and/or electronic changes in response to applied external stimuli including light, charge, and pH. Herein we present recent results in which advanced photochromic diarylethenes are combined with MOFs through covalent and non-covalent methods to create photo-responsive permanently porous crystalline materials. This presentation will describe the design, synthesis, and characterization of next-generation photo-switchable diarylethene based ligands which are subsequently used to photo-responsive MOFs. These UBMOF crystals are, by design, isostructural with previously reported non-photoresponsive frameworks which enables a systematic comparison of their physical and chemical properties. While the photoswitching of the isolated ligand in solution is fully reversible, the cycloreversion reaction is suppressed in the UBMOF single crystalline phase. Spectroscopic evidence for thermally induced cycloreversion will be presented, as well as a detailed analysis addressing the limits of X-ray diffraction techniques applied to these systems.

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Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Journal of Electronic Packaging ◽

10.1115/1.4052400 ◽

2021 ◽

Vol 143 (4) ◽

Author(s):

Aniket Ajay Lad ◽

Kai A. James ◽

William P. King ◽

Nenad Miljkovic

Keyword(s):

Design Optimization ◽

Power Density ◽

Building Blocks ◽

Optimization Methods ◽

Population Based ◽

Global Optimum ◽

Heat Sinks ◽

Geometrical Parameters ◽

Power Module ◽

Reduced Order

Abstract The recent growth in electronics power density has created a significant need for effective thermal management solutions. Liquid-cooled heat sinks or cold plates are typically used to achieve high volumetric power density cooling. A natural tradeoff exists between the thermal and hydraulic performance of a cold plate, creating an opportunity for design optimization. Current design optimization methods rely on computationally expensive and time consuming computational fluid dynamics (CFD) simulations. Here, we develop a rapid design optimization tool for liquid cooled heat sinks based on reduced-order models for the thermal-hydraulic behavior. Flow layout is expressed as a combination of simple building blocks on a divided coarse grid. The flow layout and geometrical parameters are incorporated to optimize designs that can effectively address heterogeneous cooling requirements within electronics packages. We demonstrate that the use of population-based searches for optimal layout selection, while not ensuring a global optimum solution, can provide optimal or near-optimal results for most of the test cases studied. The approach is shown to generate optimal designs within a timescale of 60–120 s. A case study based on cooling of a commercial silicon carbide (SiC) electronics power module is used to demonstrate the application of the developed tool and is shown to improve the performance as compared to an aggressive state-of-the-art single-phase liquid cooling solution by reducing the SiC junction-to-coolant thermal resistance by 25% for the same pressure drop.

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Analysis and design of an overcurrent protection scheme based on parasitic inductance of SiC MOSFET power module

2018 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec.2018.8341415 ◽

2018 ◽

Cited By ~ 6

Author(s):

Keyao Sun ◽

Jun Wang ◽

Rolando Burgos ◽

Dushan Boroyevich ◽

Yonghan Kang ◽

...

Keyword(s):

Power Module ◽

Parasitic Inductance ◽

Analysis And Design ◽

Protection Scheme ◽

Overcurrent Protection

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Posable Tensegrity-Constrained Inflatable Kinematic Graphical Analysis

ASME 2020 Conference on Smart Materials, Adaptive Structures and Intelligent Systems ◽

10.1115/smasis2020-2385 ◽

2020 ◽

Author(s):

Adeline Wihardja ◽

Kunj Patel ◽

Laura Giner Munoz ◽

Ellen Kim ◽

Jonathan Luntz ◽

...

Keyword(s):

Kinematic Analysis ◽

Shape Change ◽

Low Cost ◽

Building Blocks ◽

Pressure Control ◽

Graphical Analysis ◽

Three Dimensions ◽

Analysis And Design ◽

Novel Technology ◽

Instantaneous Center

Abstract Inflatable devices have been used in various applications due to their low cost, light weight, simplicity, and ability to compactly stow yet deploy to large sizes with complex shape. Recently, soft robotics has added active shape change to inflatables’ otherwise static functionality. However, the required complex multi-chamber structures and active pressure control sacrifice many inherent advantages including simplicity and stowability. Many applications require only passive shape change (posability), where users manipulate a device manually, and the device simply holds its new posed shape. This paper explores a new approach using internal string-like tensile elements to provide posability while maintaining stowability and other inherent advantages of inflatables, leveraging concepts in the field of tensegrity mechanisms. Tensegrity constrained inflatables provide posable motion by allowing internal tensile strings to thread through loops as the shape is changed, where friction between the strings and loops retain the new pose. Graphical instantaneous center kinematic analysis techniques for traditional linkage systems are extended to include threaded tensegrity mechanisms, enabling analysis and design of complex posable tensegrity structures. A simple example prototype implementing bending with 1 DOF, demonstrates posable behavior, quantified in terms of the force required to change pose at different angles and pressures. The resulting bistable behavior is explained using the IC kinematic analysis. The kinematic techniques are also applied to the design of one degree of freedom functional building blocks which combine to create tensegrity configurations providing 2 DOF posability in two and three dimensions which are demonstrated through multiple hardware prototypes. The novel technology and design methods presented in this paper provide a foundation for the development of a class of new user-interactive inflatable devices with posable functionality and deploy and stow capability.

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