Identification of the Sn96.5Ag3.5 Law Behavior with the Scatter of the Parameters - Study of Aeronautical Application in Power Module

2010 ◽  
Vol 112 ◽  
pp. 83-92
Author(s):  
Alexandre Micol ◽  
Adrien Zéanh ◽  
Olivier Dalverny ◽  
Moussa Karama
Keyword(s):  
Time Series ◽  
Thermal Cycling ◽  
Experimental Test ◽  
Element Model ◽  
Electronic Component ◽  
Power Electronic ◽  
Power Module ◽  
Soldering Process ◽  
Nite Element ◽  
The Law

This work studies the reliability of power electronic component in aeronautical environment to the ageing eect of the thermal cycling. The structure fatigue is sensitive to the process assembly conditions especially of the soldering process. To correclty evaluate the reliability of the power module, the identication of the solder behavior is one of the rst steps. Anand Model is here identied. Experimental test have to be established to evaluate the parameters of the law. A srt study is made to evaluate the indetiability of the law according to the dierent experimantal test. Then, the scatter of the parameters is evaluated in a context of time series. In the end, the scatter of the parameters is included in a nite element model to understand the inuence of this scatter on the evaluation of the number of cycle before failure.

scholarly journals Analysis for Wrinkling Behavior of Girth-Welded Line Pipe

1996 ◽  
Author(s):  
Luiz T. Souza ◽  
David W. Murray
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Finite Element Model ◽  
Internal Pressure ◽  
Experimental Test ◽  
Element Model ◽  
Element Analysis ◽  
Line Pipe ◽  
New Era ◽  
Analytical Tools

The paper presents results for finite element analysis of full-sized girth-welded specimens of line pipe and compares these results with the behavior exhibited by test specimens subjected to constant axial force, internal pressure and monotonically increasing curvatures. Recommendations for the ‘best’ type of analytical finite element model are given. Comparisons between the behavior predicted analytically and the observed behavior of the experimental test specimens are made. The mechanism of wrinkling is explained and the evolution of the deformed configurations for different wrinkling modes is examined. It is concluded that the analytical tools now available are sufficiently reliable to predict the behavior of pipe in a manner that was not previously possible and that this should create a new era for the design and assessment of pipelines if the technology is properly exploited by industry.

scholarly journals Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules

2019 ◽  
Author(s):  
Erick Gutierrez ◽  
Kevin Lin ◽  
Douglas DeVoto ◽  
Patrick McCluskey
Keyword(s):  
Thermal Cycling ◽  
Failure Modes ◽  
Rapid Determination ◽  
Degradation Process ◽  
In Situ Monitoring ◽  
Power Module ◽  
Insulated Gate Bipolar Transistor ◽  
Die Attach ◽  
Power Modules

Abstract Insulated gate bipolar transistor (IGBT) power modules are devices commonly used for high-power applications. Operation and environmental stresses can cause these power modules to progressively degrade over time, potentially leading to catastrophic failure of the device. This degradation process may cause some early performance symptoms related to the state of health of the power module, making it possible to detect reliability degradation of the IGBT module. Testing can be used to accelerate this process, permitting a rapid determination of whether specific declines in device reliability can be characterized. In this study, thermal cycling was conducted on multiple power modules simultaneously in order to assess the effect of thermal cycling on the degradation of the power module. In-situ monitoring of temperature was performed from inside each power module using high temperature thermocouples. Device imaging and characterization were performed along with temperature data analysis, to assess failure modes and mechanisms within the power modules. While the experiment aimed to assess the potential damage effects of thermal cycling on the die attach, results indicated that wire bond degradation was the life-limiting failure mechanism.

Design of a Low Inductance Power Module Based on Low Temperature Co-fired Ceramic

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000032-000038
Author(s):  
Atanu Dutta ◽  
Simon S. Ang
Keyword(s):  
Low Temperature ◽  
Coefficient Of Thermal Expansion ◽  
Semiconductor Devices ◽  
Building Blocks ◽  
Wide Bandgap ◽  
Switching Frequency ◽  
Full Potential ◽  
Power Electronic ◽  
Power Module ◽  
Parasitic Inductance

Abstract Efficient, compact, and reliable power electronic modules are building blocks of modern day power electronic systems. In recent times, wide bandgap semiconductor devices, such as, silicon carbide (SiC) and gallium nitride (GaN), are widely investigated and used in the power electronic modules to realize power dense, highly efficient, and fast switching modules for various applications. For high power applications is it required to parallel and series several devices to achieve high current and high voltage specifications, which results in larger current conducting traces. One of the major obstacles in using these wideband gap power semiconductor devices are the internal module stray inductance that is associated with these current conducting traces. With increasing demand for higher switching frequency, the internal module parasitic inductance must be reduced to as minimum as possible in order to utilize the full potential of the wide bandgap devices. A multi-layer approach of low-temperature co-fired ceramic (LTCC) to package the wide bandgap devices is investigated. The multi-layer design freedom by using LTCC can be utilized to reduce the footprint of the overall power module, electrical interconnects, hence, reducing the package parasitic inductance. LTCC also facilitates high temperature operations and has a coefficient of thermal expansion matching with wide bandgap devices. In this paper, we report on a LTCC based power module design where LTCC is utilized as an isolation layer between the source and the drain of the power devices. A simulation based parasitic inductance analysis and electro-thermal-mechanical study is performed using ANSYS Workbench Tools to investigate the feasibility of this LTCC based design.

Comparison of Electroplated Ni and PVD Ni Coating Layers after Soft Soldering Process

2019 ◽  
Vol 809 ◽  
pp. 367-371
Author(s):  
Jessica Richter ◽  
Benjamin Schellscheidt ◽  
Anna Steenmann ◽  
Thomas Licht
Keyword(s):  
Composite Material ◽  
Phase Formation ◽  
Intermetallic Phase ◽  
Adhesive Layer ◽  
Performance Comparison ◽  
Growth Patterns ◽  
Process Time ◽  
Power Electronic ◽  
Columnar Growth ◽  
Soldering Process

This work is part of a publicly funded project called ReffiMaL (resource efficient material solutions for power electronics), which aims to substitute electroplated Nickel (Ni) as contact material in power electronic modules. The baseplates of these power electronic modules are based on the metal matrix composite material AlSiC, which needs to be coated to become solderable. Today, it is state-of-the-art technology to coat the baseplate with electroplated Ni to form an adhesive layer to the system solder. In this paper we present a performance comparison of physical vapor deposited (PVD) Ni and electroplated Ni. The main advantage of PVD Ni is a significant reduction of layer thickness compared to the electroplating process. Second advantage of PVD Ni is the limitation of the deposition to areas that get soldered, in contrast to a non-selective electroplated coating. When deposited by PVD at room temperature, Ni exhibits columnar growth patterns, whereas electroplated Ni tends to form a laminar layer. The columnar growth leads to an increase in interface area affecting phase formation behavior. To compare both adhesion layers, we investigate the phase formation after soldering with a Sn based soft solder-copper composite material. The baseplates are reflow-soldered at different temperatures and process times. Temperature varied between 270°C and 400°C. The corresponding process time ranged from 10 to 40 minutes. We inspect the samples optically to determine the phase formation. Intermetallic phase (IMP) composition is evaluated using energy dispersive X-ray analysis (EDX). ReffiMaL is funded by the German Federal Ministry of Education and Research (BMBF).

scholarly journals Advanced interpretation of subsidence in Murcia (SE Spain) using A-DInSAR data – modelling and validation

2009 ◽  
Vol 9 (3) ◽  
pp. 647-661 ◽  
Author(s):  
G. Herrera ◽  
J. A. Fernández ◽  
R. Tomás ◽  
G. Cooksley ◽  
J. Mulas
Keyword(s):  
Time Series ◽  
Metropolitan Area ◽  
Prediction Models ◽  
Time History ◽  
Element Model ◽  
Absolute Error ◽  
Sar Interferometry ◽  
Se Spain ◽  
Drought Period ◽  
Aquifer System

Abstract. Subsidence is a natural hazard that affects wide areas in the world causing important economic costs annually. This phenomenon has occurred in the metropolitan area of Murcia City (SE Spain) as a result of groundwater overexploitation. In this work aquifer system subsidence is investigated using an advanced differential SAR interferometry remote sensing technique (A-DInSAR) called Stable Point Network (SPN). The SPN derived displacement results, mainly the velocity displacement maps and the time series of the displacement, reveal that in the period 2004–2008 the rate of subsidence in Murcia metropolitan area doubled with respect to the previous period from 1995 to 2005. The acceleration of the deformation phenomenon is explained by the drought period started in 2006. The comparison of the temporal evolution of the displacements measured with the extensometers and the SPN technique shows an average absolute error of 3.9±3.8 mm. Finally, results from a finite element model developed to simulate the recorded time history subsidence from known water table height changes compares well with the SPN displacement time series estimations. This result demonstrates the potential of A-DInSAR techniques to validate subsidence prediction models as an alternative to using instrumental ground based techniques for validation.

Thermal Resistance Analysis and Simulation of IGBT Module with High Power Density

2013 ◽  
Vol 303-306 ◽  
pp. 1902-1907 ◽  
Author(s):  
Yi Bo Wu ◽  
Guo You Liu ◽  
Ning Hua Xu ◽  
Ze Chun Dou
Keyword(s):  
Thermal Resistance ◽  
Power Density ◽  
High Power ◽  
Resistance Management ◽  
Equivalent Circuit Model ◽  
Element Model ◽  
Equivalent Model ◽  
High Power Density ◽  
Power Module ◽  
Igbt Module

As the IGBT power modules have promising potentials in the application of the field of traction or new energy, the higher power density and higher current rating of the IGBT module become more and more attractive. Thermal resistance is one of the most important characteristics in the application of power semiconductor module. A new 1500A/3300V IGBT module in traction application is developed successfully by Zhuzhou CSR Times Electric Co., Ltd (Lincoln). Thermal resistance management of this IGBT module with high power density is performed in this paper. Based on thermal nodes network, an equivalent circuit model for thermal resistance of power module is highlighted from which the steady state thermal resistance can be optimized by theoretical analysis. Furthermore, thermal numerical simulation of 1500A/3300V IGBT module is accomplished by means of finite element model (FEM). Finally, the thermal equivalent model of the IGBT module is verified by simulation results.

Pb-Free Process Development for a High End Storage Area Network Application

2007 ◽  
Author(s):  
Sunil Gopakumar ◽  
Francois Billaut ◽  
Eric Fremd ◽  
Manthos Economou
Keyword(s):  
Thermal Cycling ◽  
Cycling Performance ◽  
Lead Free ◽  
Process Window ◽  
Successful Implementation ◽  
Soldering Process ◽  
Wave Soldering ◽  
Free Process ◽  
Plated Through Hole ◽  
The Impact

Lead free solders are being increasingly used in the electronic industry. While most of the electronic products, in terms of volume, are already built lead free, sectors of the industry including high end servers, networking and telecommunications are covered by “lead in solder” exemptions. It is unknown at this point how long these exemptions will last. In addition, many components such as memories have started appearing only in the Pb-free version. As a result, the industry has been pushed to either adopt a mixed assembly process or to transition early to a full Pb-free process. Even though numerous papers have outlined the successful implementation of a Pb-free process, few of them have actually looked at complex high-end multilayer boards in its entirety. This paper focuses on the issues involved in developing an acceptable Pb-free process window for thick, multilayer boards for SMT, Wave soldering, Rework and Press-fit operations. A laminate capable of withstanding Pb-free soldering temperatures was used to construct a 125-mil thick multilayer board with 18 layers which included 8 ground and 10 signal planes. This experiment utilized two popular Pb-free finishes commonly used in the industry: Immersion Silver and high temperature Organic Solderability Preservative (OSP). The widespread SAC 305 alloy with a composition of Sn3.0Ag0.5Cu was used for both SMT and wave soldering. Three sets of assemblies were built: Pb-free, Mixed and Sn/Pb. The mixed assembly mostly used Pb-free components with Sn/Pb solder paste. The impact of increased soldering temperatures on the board, components and reliability of the product were also studied as a part of this research endeavor. Board level reliability tests were conducted by subjecting the boards from 0°C to 100°C Air-to-Air thermal cycling as well as mechanical shock and vibration tests. A suite of reliability and destructive physical analysis (DPA) tests were carried out to establish the quality of the soldering using the eutectic Sn/Pb assembly as the baseline. The study compared the cycling performance of the three sets of assemblies and also looked at the potential impacts of moving to mixed assemblies. Results indicated a reduced process window for Pb-free, especially for the Pb-free wave soldering process due to reduced wetting of the plated through hole barrels as compared to Sn/Pb wave soldering process. The thermal cycling performance of the three sets of assemblies was found to be equivalent after 6000 cycles.

scholarly journals Determining Simulation Parameters of Prototype Door Hinge for Correlation between Simulation and Experimental Results in United Nations Economic Commission for Europe Regulation No: 11 Tests

Designs ◽  
2019 ◽  
Vol 3 (1) ◽  
pp. 17
Author(s):  
Onur Erol ◽  
Hande Güler Özgül
Keyword(s):  
Friction Coefficient ◽  
United Nations ◽  
Experimental Test ◽  
Optimal Parameter ◽  
Element Model ◽  
United Nations Economic Commission ◽  
Geometry Model ◽  
Economic Commission ◽  
Door Hinge ◽  
Simulation Parameters

In this study, the simulation parameters of the door hinge were investigated in the Z direction to have a correlation between the experimental test and simulation. Tests and simulations were conducted according to the United Nations Economic Commission for Europe Regulation No: 11. The simulation parameters, which are the friction coefficient of contacts, the effect of bush material assignment and effect of production imperfections, were examined respectively by utilizing the implicit solver of Ansys Mechanical Workbench 18 and the force-displacement curves were compared with experimental test results in order to decide the optimal settings of parameters. In a conclusion friction coefficient 0.2, non-linear bush material and realistic geometry model were considered as the optimal parameter settings for correlated Finite Element Model of the hinge.

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