scholarly journals Effects of gamma radiation on the layered structure of lithium silicon – niobate.

2021 ◽  
Vol 2021 (10) ◽  
Author(s):  
O.G. Gafurov ◽  
◽  
R.B. Khamrokulov ◽  
U.R. Naimov ◽  
◽  
...  

In this work, it is shown that when an ionizing radiation pulse acts on surfactant-type devices in which a silicon single crystal is deposited with a gap on a piezoelectric substrate made of lithium niobate, the output signal is distorted. It was found that, depending on the type of conductivity of the material deposited on the lithium niobate, a different character of recovery of the device parameters was observed. The effect of ionizing radiation on air-gap devices operating as a memory correlator showed that the previously recorded signals were erased at a dose rate of ≥ 106 rad. To explain these dependencies, a model is used based on the fact that photo carriers excited by ionizing radiation in the depleted layer are captured by traps at the silicon-air interface for devices with an air gap and at the silicon-silicon oxide interface for monolithic structures The presented model, which takes into account traps not at the interface, explains most of the effects that cause a change in the output high frequency (RF) signal.

1999 ◽  
Vol 568 ◽  
Author(s):  
Lahir Shaik Adam ◽  
Mark E. Law ◽  
Omer Dokumaci ◽  
Yaser Haddara ◽  
Cheruvu Murthy ◽  
...  

ABSTRACTNitrogen implantation can be used to control gate oxide thicknesses [1,2]. This study aims at studying the fundamental behavior of nitrogen diffusion in silicon. Nitrogen at sub-amorphizing doses has been implanted as N2+ at 40 keV and 200 keV into Czochralski silicon wafers. Furnace anneals have been performed at a range of temperatures from 650°C through 1050°C. The resulting annealed profiles show anomalous diffusion behavior. For the 40 keV implants, nitrogen diffuses very rapidly and segregates at the silicon/ silicon-oxide interface. Modeling of this behavior is based on the theory that the diffusion is limited by the time to create a mobile nitrogen interstitial.


2018 ◽  
Vol 36 (1) ◽  
pp. 01A116 ◽  
Author(s):  
Evan Oudot ◽  
Mickael Gros-Jean ◽  
Kristell Courouble ◽  
Francois Bertin ◽  
Romain Duru ◽  
...  

1997 ◽  
Vol 36 (Part 1, No. 3B) ◽  
pp. 1622-1626 ◽  
Author(s):  
K. Z. Zhang ◽  
Leah M. Meeuwenberg ◽  
Mark M. Banaszak Holl ◽  
F. R. McFeely

1996 ◽  
Vol 352-354 ◽  
pp. 1033-1037 ◽  
Author(s):  
O.A. Aktsipetrov ◽  
A.A. Fedyanin ◽  
E.D. Mishina ◽  
A.N. Rubtsov ◽  
C.W. van Hasselt ◽  
...  

1993 ◽  
Vol 36 (3) ◽  
pp. 33-36
Author(s):  
C. Werkhoven ◽  
E. Granneman ◽  
E. Lindow ◽  
R. de Blank ◽  
S. Verhavcrbeke ◽  
...  

This paper demonstrates that defect control is greatly improved when using the protected environment of a vertical reactor cluster tool comprising a preclean station. The cluster tool investigated combines the established process stability of vertical reactors with new capabilities as native oxide removal, ultraclean wafer transport, and reactors shielded from enviromental contamination. An adequate combination of clean gas usage and leak tightness makes it possible to apply HF vapor etching effectively in order to control the properties of the silicon-silicon oxide interface. For different precleaning conditions, interface and bulk contamination was measured, the sources identified, and the effect of improvements monitored. To this end, several electrical parameters were determined, including the analysis of Qhd and Ehd. Quantitative TXRF and SIMS techniques were used to correlate the results with metallic and organic contamination.


2003 ◽  
Vol 36 (6) ◽  
pp. 1352-1355 ◽  
Author(s):  
Benoît Bataillou ◽  
Hubert Moriceau ◽  
François Rieutord

It is shown here that the interfacial profile between two bonded wafers can be directly determined using X-ray reflectivity without resorting to standard model-fitting of the data. The phase problem inherent to any structure determination by scattering technique is solved in this case using a known silicon/silicon oxide interface, which acts as a phase reference for the reflected signals.


1997 ◽  
Vol 486 ◽  
Author(s):  
H. Kageshima ◽  
K. Shiraishi

AbstractExperimentally reported interfacial luminescence from silicon nano structures are studied by using a first-principles calculation of a Si(100) quantum slab covered with silicon oxide. When Si-OH bonds were introduced at the silicon/silicon-oxide interface, wave functions at the valence band top and near conduction band bottom localized vertically and laterally near the Si-OH bonds. Such strong localization is the result of the cooperation of the coupling of non-bonding 2p lone pair orbitals on interfacial 0 atoms and the strong dipole of OH. Furthermore, the localization is significant only in silicon nano structures. This localization of the wave functions can be the source for creating localized excitons, which can dramatically enhance the intensity of photoluminescence. Therefore, interfacial Si-OH bonds are a theoretically convincing possible source of reported interfacial luminescence.


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