Latch-Up Induced Slit Voiding in Aluminum Metal Lines

Author(s):  
Chunyu Zhang ◽  
Lakshmi Vedula ◽  
Shekhar Khandekar

Abstract Latch-up induced during High Temperature Operating Life (HTOL) test of a mixed signal device fabricated with 1.0 μm CMOS, double poly, double metal process caused failures due to an open in aluminum metal line. Metal lines revealed wedge voids of about 50% of the line width. Triggering of latch up mechanism during the HTOL test resulted in a several fold increase of current flowing through the ground metal line. This increase in current resulted in the growth of the wedge voids leading to failures due to open metal lines.

2019 ◽  
Vol 960 ◽  
pp. 221-230 ◽  
Author(s):  
Jui Hung Yuan ◽  
Tung Han Chuang

In this study, binary Ag-alloy wires were doped with different Pd concentrations, and each wire was encapsulated in an LED package. The initial optical characteristics were tested, and reliability was tested with the high temperature storage life (HTSL), high temperature operating life (HTOL) and wet high temperature operating life (WHTOL). The luminous efficiency of the Ag-alloy wire LED package was about 2% higher than that of the Au wire package, but the addition of 6% Pd to the Ag-alloy wire decreased the luminous efficiency to close to that of the Au-wire LED package. This was due to the high reflectivity of silver in the blue wavelength region, as compared to the low reflectivity of palladium. After 1,000 hours of HTOL and WHTOL, the results showed that the performance of luminous flux maintenance increased with increasing Pd content, indicating that Ag-alloy wires doped with a sufficient amount of Pd can inhibit degradation due to oxidation reaction and thermal and humidity aging. Therefore, binary Ag-Pd alloy wires produced with specific drawing and annealing processes are suitable for mid-power white light LEDs in lighting applications.


Author(s):  
Pradeep Lall ◽  
Amrit Abrol ◽  
David Locker

MEMS microphones are extensively used in many applications that require reliability, small size, and high sound quality. For harsh environment reliability data MEMS microphones need to be monitored under conditions mimicking their areas of applications. MEMS microphones have an opening/sound port in order to interact with the environment, therefore cannot be sealed completely since the sensing mechanism requires interaction between sound waves and the sensing element. Little to no information exists on reliability data for MEMS microphones under low/high temperature operating life and temperature humidity bias condition. Our work is primarily focused on providing harsh environmental reliability data which can be useful to MEMS designers and engineers. In this paper the test vehicles with MEMS Microphones have been tested under three different harsh environmental conditions: high temperature operating life (HTOL) at 125°C at 3.3V, low temperature storage (LTS) at −35°C and temperature humidity 85°C/85%RH at 3.3V. The main motive of this study is to document the incremental shift and degradation in output parameters namely distortion, frequency response, power supply rejection capability of IC, frequency vs pressure characteristics and analog output voltage of the MEMS microphone. The survivability of MEMS microphone, ADMP401, has been demonstrated as a function of change in the output parameters. Failure analysis has been conducted on the microphone samples to study failure modes and sites using analytical methods such as SEM, EDS and X-ray.


1991 ◽  
Vol 69 (10) ◽  
pp. 6844-6849 ◽  
Author(s):  
D. C. Hall ◽  
N. Holonyak ◽  
D. G. Deppe ◽  
M. J. Ries ◽  
R. J. Matyi ◽  
...  

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