Analysis of integrated circuit failure modes and failure mechanisms derived from high temperature operating life tests

1973 ◽  
Vol 12 (6) ◽  
pp. 495
Author(s):  
Pradeep Lall ◽  
Amrit Abrol ◽  
David Locker

MEMS microphones are extensively used in many applications that require reliability, small size, and high sound quality. For harsh environment reliability data MEMS microphones need to be monitored under conditions mimicking their areas of applications. MEMS microphones have an opening/sound port in order to interact with the environment, therefore cannot be sealed completely since the sensing mechanism requires interaction between sound waves and the sensing element. Little to no information exists on reliability data for MEMS microphones under low/high temperature operating life and temperature humidity bias condition. Our work is primarily focused on providing harsh environmental reliability data which can be useful to MEMS designers and engineers. In this paper the test vehicles with MEMS Microphones have been tested under three different harsh environmental conditions: high temperature operating life (HTOL) at 125°C at 3.3V, low temperature storage (LTS) at −35°C and temperature humidity 85°C/85%RH at 3.3V. The main motive of this study is to document the incremental shift and degradation in output parameters namely distortion, frequency response, power supply rejection capability of IC, frequency vs pressure characteristics and analog output voltage of the MEMS microphone. The survivability of MEMS microphone, ADMP401, has been demonstrated as a function of change in the output parameters. Failure analysis has been conducted on the microphone samples to study failure modes and sites using analytical methods such as SEM, EDS and X-ray.


Author(s):  
Chunyu Zhang ◽  
Lakshmi Vedula ◽  
Shekhar Khandekar

Abstract Latch-up induced during High Temperature Operating Life (HTOL) test of a mixed signal device fabricated with 1.0 μm CMOS, double poly, double metal process caused failures due to an open in aluminum metal line. Metal lines revealed wedge voids of about 50% of the line width. Triggering of latch up mechanism during the HTOL test resulted in a several fold increase of current flowing through the ground metal line. This increase in current resulted in the growth of the wedge voids leading to failures due to open metal lines.


2019 ◽  
Vol 960 ◽  
pp. 221-230 ◽  
Author(s):  
Jui Hung Yuan ◽  
Tung Han Chuang

In this study, binary Ag-alloy wires were doped with different Pd concentrations, and each wire was encapsulated in an LED package. The initial optical characteristics were tested, and reliability was tested with the high temperature storage life (HTSL), high temperature operating life (HTOL) and wet high temperature operating life (WHTOL). The luminous efficiency of the Ag-alloy wire LED package was about 2% higher than that of the Au wire package, but the addition of 6% Pd to the Ag-alloy wire decreased the luminous efficiency to close to that of the Au-wire LED package. This was due to the high reflectivity of silver in the blue wavelength region, as compared to the low reflectivity of palladium. After 1,000 hours of HTOL and WHTOL, the results showed that the performance of luminous flux maintenance increased with increasing Pd content, indicating that Ag-alloy wires doped with a sufficient amount of Pd can inhibit degradation due to oxidation reaction and thermal and humidity aging. Therefore, binary Ag-Pd alloy wires produced with specific drawing and annealing processes are suitable for mid-power white light LEDs in lighting applications.


MRS Advances ◽  
2016 ◽  
Vol 1 (35) ◽  
pp. 2427-2437
Author(s):  
Loucas Tsakalakos ◽  
Uttara A. Dani ◽  
Boon K. Lee ◽  
Susanne M. Lee ◽  
Sudeep Mandal ◽  
...  

ABSTRACTFiber optic temperature sensors are used in a variety of harsh environment applications. We have explored use of such temperature sensors in commercial gas turbines to measure the temperature at various regions of interest within the turbine system. More specifically, fiber optic temperature rakes were designed and installed on a commercial gas turbine under full load conditions. This work will focus on failure mechanisms observed at multiple length scales that impact the performance of high temperature optical fiber sensors. It was found that Au-coated silica fibers, which are a standard in the industry, undergo various failure modes when subjected to combinations of high temperature and high vibration. More specifically, the Au coating became soft/ductile as the temperature is increased. We also observed that the Au coating was not well bonded to the silica fiber, as expected since there were no adhesion layers present. These effects led to significant damage of the fiber optic under high vibrations. We also found that vibrations from the gas turbine coupled into fundamental modes of the fiber optic probe assembly, which were analyzed by detailed dynamic mechanical analysis. This led to the fiber impacting the internal wall of the probe assembly, which caused further damage and failure of the fiber and the Au coating. The silica fibers returned from the field also exhibited significant twisting throughout most of their length. This suggests the fibers reached temperatures above their strain point (about 1000 C for pure silica glass), which is explained by either a) the strain point had been significantly reduced by the presence of the Ge dopant, or b) the temperature was higher than expected in the gas turbine exhaust region. It was also hypothesized that complex anelastic effects may play a role under the high temperature, high vibration environment experienced by the probes. Detailed structural analysis of the fiber optic temperature sensors by scanning electron microscopy, ToF-SIMS, and X-ray microscopy will be presented to corroborate the above simulations and proposed damage mechanisms. Finally, we note that the fiber Bragg gratings (FBG) present within the temperature probes provided promising temperature data, and were in fact not damaged/erased by the high temperature environment.


Author(s):  
S. Khadpe ◽  
R. Faryniak

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.


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