Spray Cooling for Time Resolved Emission Measurements of ICs

2004 ◽  
Author(s):  
Rama R. Goruganthu ◽  
David Bethke ◽  
Shawn McBride ◽  
Tom Crawford ◽  
Jonathan Frank ◽  
...  
Keyword(s):  
Heat Flux ◽  
Thermal Performance ◽  
Flip Chip ◽  
Cooling System ◽  
Spray Cooling ◽  
Junction Temperature ◽  
Maximum Temperature ◽  
Uniform Heat Flux ◽  
High Heat Flux ◽  
Time Resolved

Abstract Spray cooling is implemented on an engineering tool for Time Resolved Emission measurements using a silicon solid immersion lens to achieve high spatial resolution and for probing high heat flux devices. Thermal performance is characterized using a thermal test vehicle consisting of a 4x3 array of cells each with a heater element and a thermal diode to monitor the temperature within the cell. The flip-chip packaged TTV is operated to achieve uniform heat flux across the die. The temperature distribution across the die is measured on the 4x3 grid of the die for various heat loads up to 180 W with corresponding heat flux of 204 W/cm2. Using water as coolant the maximum temperature differential across the die was about 30 °C while keeping the maximum junction temperature below 95 °C and at a heat flux of 200 W/cm2. Details of the thermal performance of spray cooling system as a function of flow rate, coolant

scholarly journals Optimization of Arrangement of LED on the PCB for High Power LED Module

2019 ◽  
Vol 9 (2) ◽  
pp. 384-387
Keyword(s):  
Heat Flux ◽  
Computer Simulation ◽  
High Temperature ◽  
Thermal Performance ◽  
High Power ◽  
Electrical Power ◽  
Junction Temperature ◽  
Maximum Temperature ◽  
Design Parameters ◽  
High Temperature Condition

LED operating under high-temperature condition badly affects reliability. To reduce junction temperature of LED is crucial. In this paper, luminous intensity and photo conversion efficient with respect to electrical power are discussed. Moreover, three arrangements for LED module are suggested, and design parameters are discussed in terms of the number of LEDs and distance between each LED. In order to evaluate thermal performance of designed the module, computer simulation was conducted. Distance between each LED is selected by 7.6, 9.6, and 13.3mm for 80, 128, and 240 LEDs, respectively and unit heat flux is calculated to be 0.47W/mm2 , 0.29W/mm2 , 0.16W/mm2 for 80, 128, and 240 LEDs, respectively. In this case, Maximum temperature on the PCB was 67.8C, 62.5C, and 57.1C for 80, 128, and 240 LEDs, respectively. The Maximum temperature and unit heat flux was reduced by 15.7% and 66%, respectively, when the number of LEDs are increased by three times. We found that the temperature between LEDs can be reduced if unit heat flux can be reduced.

Application of Al2O3 Nanofluid on Sintered Copper-Powder Vapor Chamber for Electronic Cooling

2013 ◽  
Vol 789 ◽  
pp. 423-428 ◽  
Author(s):  
Nandy Putra ◽  
Wayan Nata Septiadi ◽  
Ranggi Sahmura ◽  
Cahya Tri Anggara
Keyword(s):  
Heat Flux ◽  
Thermal Performance ◽  
Base Fluid ◽  
Cooling System ◽  
High Heat ◽  
Electronic Cooling ◽  
Working Fluid ◽  
High Heat Flux ◽  
Processing Unit ◽  
Vapor Chamber

The development of electronic devices pushes manufacturers to create smaller microchips with higher performance than ever before. Microchip with higher working load produces more heat. This leads to the need of cooling system that able to dissipate high heat flux. Vapor chamber is one of highly effective heat spreading device. Its ability to dissipate high heat flux density in limited space made it potential for electronic cooling application, like Central Processing Unit (CPU) cooling system. The purpose of this paper is to study the application of Al2O3Nanofluid as working fluid for vapor chamber. Vapor chamber performance was measured in real CPU working condition. Al2O3Nanofluid with concentration of 0.1%, 0.3%, 0.5%, 1%, 2% and 3% as working fluid of the vapor chamber were tested and compared with its base fluid, water. Al2O3nanofluid shows better thermal performance than its base fluid due to the interaction of particle enhancing the thermal conductivity. The result showed that the effect of working fluid is significant to the performance of vapor chamber at high heat load, and the application of Al2O3nanofluid as working fluid would enhance thermal performance of vapor chamber, compared to other conventional working fluid being used before.

scholarly journals Method of high heat flux removal by usage of liquid spray cooling

2013 ◽  
Vol 34 (3) ◽  
pp. 173-184 ◽  
Author(s):  
Przemysław Smakulski
Keyword(s):  
Heat Flux ◽  
Cooling System ◽  
Spray Cooling ◽  
High Heat ◽  
Critical Parameters ◽  
High Heat Flux ◽  
Cooling Method ◽  
Computer Chips ◽  
Supercritical Parameters ◽  
Laser Diode Arrays

Abstract High heat flux removal are important issue in many perspective applications such as computer chips, laser diode arrays, or boilers working on supercritical parameters. Electronic microchips constructed nowadays are model example of high heat flux removal, where the cooling system have to maintain the temperature below 358 K and take heat flux up to 300 W/cm2. One of the most efficient methods of microchips cooling turns out to be the spray cooling method. Review of installations has been accomplished for removal at high heat flux with liquid sprays. In the article are shown high flux removal characteristic and dependences, boiling critical parameters, as also the numerical method of spray cooling analysis.

Development of Cooling System for a Large Area at High Heat Flux by Using Flow Boiling in Narrow Channels

2009 ◽  
Author(s):  
Shinichi Miura ◽  
Yukihiro Inada ◽  
Yasuhisa Shinmoto ◽  
Haruhiko Ohta
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Rate ◽  
Mass Velocity ◽  
Cooling System ◽  
Volumetric Flow Rate ◽  
High Heat ◽  
High Heat Flux ◽  
Gap Size ◽  
Heated Channel

Advance of an electronic technology has caused the increase of heat generation density for semiconductors densely integrated. Thermal management becomes more important, and a cooling system for high heat flux is required. It is extremely effective to such a demand using flow boiling heat transfer because of its high heat removal ability. To develop the cooling system for a large area at high heat flux, the cold plate structure of narrow channels with auxiliary unheated channel for additional liquid supply was devised and confirmed its validity by experiments. A large surface of 150mm in heated length and 30mm in width with grooves of an apex angle of 90 deg, 0.5mm depth and 1mm in pitch was employed. A structure of narrow rectangular heated channel between parallel plates with an unheated auxiliary channel was employed and the heat transfer characteristics were examined by using water for different combinations of gap sizes and volumetric flow rates. Five different liquid distribution modes were tested and their data were compared. The values of CHF larger than 1.9×106W/m2 for gap size of 2mm under mass velocity based on total volumetric flow rate and on the cross section area of main heated channel 720kg/m2s or 1.7×106W/m2 for gap size of 5mm under 290kg/m2s were obtained under total volumetric flow rate 4.5×10−5m3/s regardless of the liquid distribution modes. Under several conditions, the extensions of dry-patches were observed at the upstream location of the main heated channel resulting burnout not at the downstream but at the upstream. High values of CHF larger than 2×106W/m2 were obtained only for gap size of 2mm. The result indicates that higher mass velocity in the main heated channel is more effective for the increase in CHF. It was clarified that there is optimum flow rate distribution to obtain the highest values of CHF. For gap size of 2mm, high heat transfer coefficient as much as 7.4×104W/m2K were obtained at heat flux 1.5×106W/m2 under mass velocity 720kg/m2s based on total volumetric flow rate and on the cross section area of main heated channel. Also to obtain high heat transfer coefficient, it is more useful to supply the cooling liquid from the auxiliary unheated channel for additional liquid supply in the transverse direction perpendicular to the flow in the main heated channel.

The Steady-State Modeling and Analysis of a Two-Loop Cooling System for High Heat Flux Removal

2009 ◽  
Author(s):  
Rongliang Zhou ◽  
Juan Catano ◽  
Tiejun Zhang ◽  
John T. Wen ◽  
Greg J. Michna ◽  
...  
Keyword(s):  
Heat Flux ◽  
Steady State ◽  
Heat Exchangers ◽  
Cooling System ◽  
High Heat ◽  
System Structure ◽  
High Heat Flux ◽  
Vapor Compression ◽  
Vapor Compression Cycle ◽  
Compression Cycle

Steady-state modeling and analysis of a two-loop cooling system for high heat flux removal applications are studied. The system structure proposed consists of a primary pumped loop and a vapor compression cycle (VCC) as the secondary loop to which the pumped loop rejects heat. The pumped loop consists of evaporator, condenser, pump, and bladder liquid accumulator. The pumped loop evaporator has direct contact with the heat generating device and CHF must be higher than the imposed heat fluxes to prevent device burnout. The bladder liquid accumulator adjusts the pumped loop pressure level and, hence, the subcooling of the refrigerant to avoid pump cavitation and to achieve high critical heat flux (CHF) in the pumped loop evaporator. The vapor compression cycle of the two-loop cooling system consists of evaporator, liquid accumulator, compressor, condenser and electronic expansion valve. It is coupled with the pumped loop through a fluid-to-fluid heat exchanger that serves as both the vapor compression cycle evaporator and the pumped loop condenser. The liquid accumulator of the vapor compression cycle regulates the cycle active refrigerant charge and provides saturated vapor to the compressor at steady state. The heat exchangers are modeled with the mass, momentum, and energy balance equations. Due to the projected incorporation of microchannels in the pumped loop to enhance the heat transfer in heat sinks, the momentum equation, rarely seen in previous refrigeration system modeling efforts, is included to capture the expected significant microchannel pressure drop witnessed in previous experimental investigations. Electronic expansion valve, compressor, pump, and liquid accumulators are modeled as static components due to their much faster dynamics compared with heat exchangers. The steady-state model can be used for static system design that includes determining the total refrigerant charge in the vapor compression cycle and the pumped loop to accommodate the varying heat load, sizing of various components, and parametric studies to optimize the operating conditions for a given heat load. The effect of pumped loop pressure level, heat exchangers geometries, pumped loop refrigerant selection, and placement of the pump (upstream or downstream of the evaporator) are studied. The two-loop cooling system structure shows both improved coefficient of performance (COP) and CHF overthe single loop vapor compression cycle investigated earlier by authors for high heat flux removal.

A gas-atomized spray cooling system integrated with an ejector loop: Ejector modeling and thermal performance analysis

2019 ◽  
Vol 180 ◽  
pp. 106-118 ◽  
Author(s):  
Ji-Xiang Wang ◽  
Yun-Ze Li ◽  
Jia-Xin Li ◽  
Chao Li ◽  
Yi Zhang ◽  
...  
Keyword(s):  
Performance Analysis ◽  
Thermal Performance ◽  
Cooling System ◽  
Spray Cooling

Model Predictive Control of a Pumped Two-Phase Cooling System With Microchannel Heat Exchangers

2018 ◽  
Author(s):  
Oyuna Angatkina ◽  
Andrew Alleyne
Keyword(s):  
Heat Flux ◽  
Model Predictive Control ◽  
Predictive Control ◽  
Heat Exchangers ◽  
Cooling System ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase ◽  
Cooling Systems ◽  
Two Phase Cooling

Two-phase cooling systems provide a viable technology for high–heat flux rejection in electronic systems. They provide high cooling capacity and uniform surface temperature. However, a major restriction of their application is the critical heat flux condition (CHF). This work presents model predictive control (MPC) design for CHF avoidance in two-phase pump driven cooling systems. The system under study includes multiple microchannel heat exchangers in series. The MPC controller performance is compared to the performance of a baseline PI controller. Simulation results show that while both controllers are able to maintain the two-phase cooling system below CHF, MPC has significant reduction in power consumption compared to the baseline controller.

Ex-Vessel Loss of Coolant Accident Analysis of ITER Divertor Cooling System Using Modified RELAP/SCADAPSIM/Mod 4.0

2017 ◽  
Vol 3 (4) ◽  
Author(s):  
S. P. Saraswat ◽  
P. Munshi ◽  
A. Khanna ◽  
C. Allison
Keyword(s):  
Heat Flux ◽  
Cooling System ◽  
Heat Removal ◽  
Hydraulic Modeling ◽  
Carbon Fiber Composites ◽  
High Heat Flux ◽  
Vacuum Vessel ◽  
Loss Of Coolant Accident ◽  
Loss Of Coolant ◽  
Accident Scenarios

The initial design of ITER incorporated the use of carbon fiber composites in high heat flux regions and tungsten was used for low heat flux regions. The current design includes tungsten for both these regions. The present work includes thermal hydraulic modeling and analysis of ex-vessel loss of coolant accident (LOCA) for the divertor (DIV) cooling system. The purpose of this study is to show that the new concept of full tungsten divertor is able to withstand in the accident scenarios. The code used in this study is RELAP/SCADAPSIM/MOD 4.0. A parametric study is also carried out with different in-vessel break sizes and ex-vessel break locations. The analysis discusses a number of safety concerns that may result from the accident scenarios. These concerns include vacuum vessel (VV) pressurization, divertor temperature profile, passive decay heat removal capability of structure, and pressurization of tokamak cooling water system. The results show that the pressures and temperatures are kept below design limits prescribed by ITER organization.

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