Failure Modes Associated with Plastic Packages and Copper Bond Wires

2015 ◽  
Author(s):  
Kevin Berger ◽  
Sultan Ali Lilani
Keyword(s):  
Failure Modes ◽  
Paper Briefly ◽  
Plastic Part ◽  
Acoustic Microscope ◽  
Intended Application ◽  
X Ray ◽  
Plastic Packages ◽  
Microscope Images ◽  
Bond Wires ◽  
Bond Wire

Abstract The Aerospace and Defense (A&D) markets are starting to use plastic packages more significantly for Space and Military ruggedized applications. But plastic packages are also inherently less reliable than ceramic devices for A&D applications. The key to the successful use of plastic devices in A&D application is to qualify the devices for the intended application using industry accepted plastic encapsulated microcircuit (PEM) qualification techniques. This paper briefly recaps the test techniques known to be effective in assessing plastic part reliability. But more importantly, it presents actual PEM qualification data gathered over the last 15 years involving over 400 individual PEM Qual lots. The paper also shows the failures modes associated with plastic packages and Cu bond wires. SEM, X-Ray, and Acoustic Microscope images were obtained for the failure modes associated with plastic packages and Cu bond wire.

A Technique for Reliably Preparing Full-Length Metallographic Cross-Sections of Integrated Circuit Bond Wires

2006 ◽  
Author(s):  
Carl Nail
Keyword(s):  
Integrated Circuits ◽  
High Precision ◽  
Cross Sections ◽  
Integrated Circuit ◽  
Radiographic Analysis ◽  
Good Resolution ◽  
Metallographic Preparation ◽  
Bond Wires ◽  
Darkfield Imaging ◽  
Bond Wire

Abstract To overcome the obstacles in preparing high-precision cross-sections of 'blind' bond wires in integrated circuits, this article proposes a different technique that generates reliable, repeatable cross-sections of bond wires across most or all of their lengths, allowing unencumbered and relatively artifact-free analysis of a given bond wire. The basic method for cross-sectioning a 'blind' bond wire involves radiographic analysis of the sample and metallographic preparation of the sample to the plane of interest. This is followed by tracking the exact location of the plane on the original radiograph using a stereomicroscope and finally darkfield imaging in which the wire is clearly visible with good resolution.

Separation and Validation of Bond-Wire and Solder Layer Failure Modes in IGBT Modules

2022 ◽  
pp. 1-1
Author(s):  
Wenzhao Liu ◽  
Dao Zhou ◽  
Francesco Iannuzzo ◽  
Michael Hartmann ◽  
Frede Blaabjerg
Keyword(s):  
Failure Modes ◽  
Igbt Modules ◽  
Bond Wire ◽  
Solder Layer

Impact of Process Tolerances on the Performance of Bond Wire Antennas at RF/Microwave Frequencies

2011 ◽  
Vol 2011 (1) ◽  
pp. 000914-000920
Author(s):  
Ivan Ndip ◽  
Abdurrahman Öz ◽  
Christian Tschoban ◽  
Stefan Schmitz ◽  
Martin Schneider-Ramelow ◽  
...  
Keyword(s):  
Resonance Frequency ◽  
Wire Antenna ◽  
60 Ghz ◽  
Planar Antennas ◽  
Microwave Frequencies ◽  
Bond Wires ◽  
Bond Wire ◽  
Wire Antennas ◽  
The Impact ◽  
Rf Microwave

Due to the multitude of advantages bond wire antennas have over conventional planar antennas (especially on-chip planar antennas), they have received much research attention within the last four years. The focus of the contributions made so far has been on exploiting different configurations of single-element and array bond wire antennas for short-range applications at RF/microwave frequencies. However, the effects of process tolerances of bond wires on the radiation characteristics of bond wire antennas have not been studied in published literature. Therefore in this paper, we investigate the impact of up to 20% fluctuations in the parameters of bond wires on the performance of 42 GHz and 60 GHz bond wire antennas. Our results reveal that the length and radius of bond wires are the most and least sensitive parameters, respectively. Furthermore, the severity of the impact of process tolerances depends on the impedance bandwidth of the original antenna, before considering the tolerances. For example, a 10% change in the length of a bond wire causes the resonance frequency of a 42 GHz antenna to be shifted out of the specified 3GHz bandwidth (40.5 GHz–43.5 GHz) required for point-to-point communication. However, although a 10% change in length of a bond wire yields a 2.5 GHz shift in the resonance frequency of a 60 GHz bond wire antenna, it doesn’t completely detune the antenna because of the original 6 GHz bandwidth available, prior to the fluctuation. Therefore, to prevent the impact of process tolerances from severely degrading the performance bond wire antennas, these antennas should be designed to have larger bandwidths than specified. For experimental verification, a bond wire antenna was designed, fabricated and measured. Very good correlation was obtained between measurement and simulation.

Crystalline silica nanowires

2004 ◽  
Vol 19 (8) ◽  
pp. 2216-2220 ◽  
Author(s):  
F.L. Deepak ◽  
Gautam Gundiah ◽  
Md. Motin Seikh ◽  
A. Govindaraj ◽  
C.N.R. Rao
Keyword(s):  
Fumed Silica ◽  
X Ray Diffraction ◽  
X Ray ◽  
Starting Mixture ◽  
Resolution Electron ◽  
Silica Nanowires ◽  
Microscope Images ◽  
High Resolution Electron Microscope ◽  
Silica Ratio ◽  
First Time

α-Cristobalite nanowires of 50–100 nm diameter with lengths of several microns have been synthesized for the first time by the solid-state reaction of fumed silica and activated charcoal. The nanowires have been characterized by x-ray diffraction, electron microscopy, photoluminescence, and Raman scattering. The nanowires are single crystalline as revealed by high-resolution electron microscope images. The crystalline nanowires are clad by an amorphous silica sheath when the carbon to fumed silica ratio in the starting mixture is small. Use of hydrogen along with Ar helps to eliminate the amorphous sheath.

Solvothermal route to Bi3Se4 nanorods at low temperature

2001 ◽  
Vol 16 (12) ◽  
pp. 3361-3365 ◽  
Author(s):  
Yuan-fang Liu ◽  
Jing-hui Zeng ◽  
Wei-xin Zhang ◽  
Wei-chao Yu ◽  
Yi-tai Qian ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Reaction Mechanism ◽  
Low Temperature ◽  
Hydrazine Hydrate ◽  
Photoelectron Spectra ◽  
Elemental Selenium ◽  
X Ray ◽  
Transmission Electron ◽  
Microscope Images ◽  
Diffraction Patterns

Nanorods Bi3Se4 were synthesized directly through the reaction between BiCl3 and elemental selenium in an autoclave with hydrazine hydrate as solvent at 165 °C for 10 h. X-ray powder diffraction patterns, x-ray photoelectron spectra, and transmission electron microscope images show that the products are well-crystallized hexagonal Bi3Se4 nanorods. The solvent hydrazine hydrate played an important role in formation and growth of Bi3Se4 nanorods. The possible reaction mechanism was proposed.

Analysis of TID Failure Modes in SRAM-Based FPGA Under Gamma-Ray and Focused Synchrotron X-Ray Irradiation

2014 ◽  
Vol 61 (4) ◽  
pp. 1777-1784 ◽  
Author(s):  
Lili Ding ◽  
Hongxia Guo ◽  
Wei Chen ◽  
Zhibin Yao ◽  
Yihua Yan ◽  
...  
Keyword(s):  
Failure Modes ◽  
Gamma Ray ◽  
X Ray
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