Evaluation on the Effectiveness of Removal VSON Package from FR4 Substrate Board

2018 ◽  
Author(s):  
Gan Sue Yin
Keyword(s):  
Environmental Stress ◽  
Failure Analysis ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Soldering Process ◽  
Root Cause ◽  
Non Destructive

Abstract This paper is focused on the de-soldering process on VSON package which was mounted on FR4 substrate board after being subjected to environmental stress. Abnormalities were found at package level during Scanning Acoustic Microscopy (SAM) inspection which is considered to be one of the non-destructive failure analysis processes. Root cause finding involved the investigation of the de-soldering equipment which is suspected to be one of the culprits to contribute to the defect during de-soldering process.

Failure Analysis of Broken Stitch Bonds in TSSOP Packages Using Scanning Acoustic Microscopy (SAM) and Time Domain Reflectometry (TDR)

2004 ◽  
Author(s):  
Bilal Abd-AlRahman ◽  
Corey Lewis ◽  
Todd Simons
Keyword(s):  
Failure Analysis ◽  
Mechanical Stress ◽  
Time Domain ◽  
Open Circuit ◽  
Time Domain Reflectometry ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Root Cause ◽  
Analysis Application

Abstract A failure analysis application utilizing scanning acoustic microscopy (SAM) and time domain reflectometry (TDR) for failure analysis has been developed to isolate broken stitch bonds in thin shrink small outline package (TSSOP) devices. Open circuit failures have occurred in this package due to excessive bending of the leads during assembly. The tools and their specific application to this technique as well as the limitations of C-SAM, TDR and radiographic analyses are discussed. By coupling C-SAM and TDR, a failure analyst can confidently determine whether the cause of an open circuit in a TSSOP package is located at the stitch bond. The root cause of the failure was determined to be abnormal mechanical stress placed on the pins during the lead forming operation. While C-SAM and TDR had proven useful in the analysis of TSSOP packages, it can potentially be expanded to other wire-bonded packages.

Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy

1996 ◽  
Author(s):  
O. Diaz de Leon ◽  
M. Nassirian ◽  
C. Todd ◽  
R. Chowdhury
Keyword(s):  
Failure Analysis ◽  
Large Scale ◽  
Flip Chip ◽  
Ultrasonic Waves ◽  
Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Chip Technology ◽  
Ball Joints ◽  
Non Destructive ◽  
Scanning Acoustic Microscope

Abstract Integration of circuits on semiconductor devices with resulting increase in pin counts is driving the need for improvements in packaging for functionality and reliability. One solution to this demand is the Flip- Chip concept in Ultra Large Scale Integration (ULSI) applications [1]. The flip-chip technology is based on the direct attach principle of die to substrate interconnection.. The absence of bondwires clearly enables packages to become more slim and compact, and also provides higher pin counts and higher-speeds [2]. However, due to its construction, with inherent hidden structures the Flip-Chip technology presents a challenge for non-destructive Failure Analysis (F/A). The scanning acoustic microscope (SAM) has recently emerged as a valuable evaluation tool for this purpose [3]. C-mode scanning acoustic microscope (C-SAM), has the ability to demonstrate non-destructive package analysis while imaging the internal features of this package. Ultrasonic waves are very sensitive, particularly when they encounter density variations at surfaces, e.g. variations such as voids or delaminations similar to air gaps. These two anomalies are common to flip-chips. The primary issue with this package technology is the non-uniformity of the die attach through solder ball joints and epoxy underfill. The ball joints also present defects as open contacts, voids or cracks. In our acoustic microscopy study packages with known defects are considered. It includes C-SCAN analysis giving top views at a particular package interface and a B-SCAN analysis that provides cross-sectional views at a desired point of interest. The cross-section analysis capability gives confidence to the failure analyst in obtaining information from a failing area without physically sectioning the sample and destroying its electrical integrity. Our results presented here prove that appropriate selection of acoustic scanning modes and frequency parameters leads to good reliable correlation between the physical defects in the devices and the information given by the acoustic microscope.

Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications

2010 ◽  
Author(s):  
Sebastian Brand ◽  
Matthias Petzold ◽  
Peter Czurratis ◽  
Peter Hoffrogge
Keyword(s):  
Image Processing ◽  
Failure Analysis ◽  
Signal Analysis ◽  
Flip Chip ◽  
Fault Isolation ◽  
Acoustic Microscopy ◽  
Specific Information ◽  
Full Potential ◽  
Time Frequency ◽  
Non Destructive

Abstract In industrial manufacturing of microelectronic components, non-destructive failure analysis methods are required for either quality control or for providing a rapid fault isolation and defect localization prior to detailed investigations requiring target preparation. Scanning acoustic microscopy (SAM) is a powerful tool enabling the inspection of internal structures in optically opaque materials non-destructively. In addition, depth specific information can be employed for two- and three-dimensional internal imaging without the need of time consuming tomographic scan procedures. The resolution achievable by acoustic microscopy is depending on parameters of both the test equipment and the sample under investigation. However, if applying acoustic microscopy for pure intensity imaging most of its potential remains unused. The aim of the current work was the development of a comprehensive analysis toolbox for extending the application of SAM by employing its full potential. Thus, typical case examples representing different fields of application were considered ranging from high density interconnect flip-chip devices over wafer-bonded components to solder tape connectors of a photovoltaic (PV) solar panel. The progress achieved during this work can be split into three categories: Signal Analysis and Parametric Imaging (SA-PI), Signal Analysis and Defect Evaluation (SA-DE) and Image Processing and Resolution Enhancement (IP-RE). Data acquisition was performed using a commercially available scanning acoustic microscope equipped with several ultrasonic transducers covering the frequency range from 15 MHz to 175 MHz. The acoustic data recorded were subjected to sophisticated algorithms operating in time-, frequency- and spatial domain for performing signal- and image analysis. In all three of the presented applications acoustic microscopy combined with signal- and image processing algorithms proved to be a powerful tool for non-destructive inspection.

Failure and Stress Analysis of Cu TSVs Using GHz-Scanning Acoustic Microscopy and Scanning Infrared Polariscopy

2015 ◽  
Author(s):  
Ingrid De Wolf ◽  
Ahmad Khaled ◽  
Martin Herms ◽  
Matthias Wagner ◽  
Tatjana Djuric ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Stress Analysis ◽  
Rayleigh Waves ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Through Silicon Vias ◽  
Stress Anisotropy ◽  
Silicon Vias ◽  
Ic Technology ◽  
Detection Of Defects

Abstract This paper discusses the application of two different techniques for failure analysis of Cu through-silicon vias (TSVs), used in 3D stacked-IC technology. The first technique is GHz Scanning Acoustic Microscopy (GHz- SAM), which not only allows detection of defects like voids, cracks and delamination, but also the visualization of Rayleigh waves. GHz-SAM can provide information on voids, delamination and possibly stress near the TSVs. The second is a reflection-based photoelastic technique (SIREX), which is shown to be very sensitive to stress anisotropy in the Si near TSVs and as such also to any defect affecting this stress, such as delamination and large voids.

scholarly journals Possibilities of using scanning acoustic microscopy to analyze incompatibilities in braze welded joints

2019 ◽  
Vol 91 (10) ◽  
pp. 7-15
Author(s):  
Tomasz Piwowarczyk ◽  
Marcin Korzeniowski ◽  
Dawid Majewski
Keyword(s):  
Aluminum Alloys ◽  
Welded Joints ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Ultrasonic Techniques ◽  
Titanium Grade ◽  
Non Destructive

This article explores the possibilities of using non-destructive ultrasonic techniques to analyze the quality of lapped braze-welded joints. The tests were performed for 4 material groups (DC03+ZE steel and X5CrNi18-19 steel, aluminum alloys AW-5754 and AW-6061, titanium Grade 2 and copper Cu-ETP). As part of the work, additional materials and joint processes and its parameters were selected (TIG, MIG, laser). The quality of joints was monitored using scanning acoustic microscopy. Based on the A-scan andC-scan images, potential joints imperfections were determined. The possibilities of using advanced ultrasonic techniques to analyze the quality of braze joints was assessed.

scholarly journals Scanning acoustic microscopy as a non-destructive imaging tool to localize defects inside battery cells

2020 ◽  
Vol 6 ◽  
pp. 100035 ◽  
Author(s):  
L. Pitta Bauermann ◽  
L.V. Mesquita ◽  
C. Bischoff ◽  
M. Drews ◽  
O. Fitz ◽  
...  
Keyword(s):  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Imaging Tool ◽  
Non Destructive ◽  
Battery Cells

Failure Analysis of a Qualification Unit Injector for a Satellite Thruster

1998 ◽  
Author(s):  
M. Lipschutz ◽  
R. Brannam ◽  
T. Nguyentat
Keyword(s):  
Failure Analysis ◽  
Cross Section ◽  
Combustion Products ◽  
Design Parameters ◽  
Cross Sectional ◽  
X Ray ◽  
Root Cause ◽  
Qualification Testing ◽  
Non Destructive ◽  
Unit Injector

Abstract This article details the results of a failure analysis performed on a Qualification Unit injector for a military satellite thrusters and explains that the failure was initially detected due to a shift in performance during qualification testing. Failure analysis involved non-destructive evaluation on the injector using micro-focus X-ray and scanning electron microscopy. Serial cross-sectional metallography was then performed, with each cross-section documented by optical microscopy and SEM. The failure analysis resulted in three main conclusions: (1) the root cause of the failure was attributed to multiple detonations in or around the damaged orifice; these detonations were likely caused by fuel and/or combustion products condensing in the orifice between pulses and then igniting during a subsequent pulse; (2) multiple damage mechanisms were identified in addition to the ZOT detonations; and (3) the material and platelet manufacturing process met all design parameters.

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