scholarly journals A Review of the T-Stub Components for the Analysis of Bolted Moment Joints

2021 ◽  
Vol 11 (22) ◽  
pp. 10731
Author(s):  
Giovani Jesus Berrospi Aquino ◽  
Ana María Gómez Amador ◽  
Jorge Hernan Alencastre Miranda ◽  
Juan José Jiménez de Cisneros Fonfría

The analytical method for the calculation of the properties of a bolted joint established by the structural Eurocodes proposes the T-stub as a component for the characterization of the tension and compression zones in moment joints. In this article, a review of the state of the art on the T-stub component is developed, where the works developed since it was initially defined, and from the perspectives of formulation, experimentation and numerical simulation are summarized and discussed. Additionally, possible future lines of work are proposed.

Electronics ◽  
2020 ◽  
Vol 9 (12) ◽  
pp. 2112
Author(s):  
José M. Pérez-Escudero ◽  
Carlos Quemada ◽  
Ramón Gonzalo ◽  
Iñigo Ederra

In this paper the design and experimental characterization of a combined doubler-subharmonic mixer based on Schottky diodes which uses a 75 GHz MMIC based local oscillator is presented. This solution integrates in the same substrate the doubler and the mixer, which share the same metallic packaging with the local oscillator. The prototype has been fabricated and measured. For characterization, the Y-Factor technique has been used and the prototype yields a best conversion loss and equivalent noise temperature of 11 dB and 1976 K, respectively, at 305 GHz. This performance is close to the state of the art, and shows the potential of this approach, which allows a significant reduction in terms of size and volume.


1991 ◽  
Vol 225 ◽  
Author(s):  
H. H. Hoang ◽  
F. S. Chen ◽  
T. E. Turner ◽  
Y. S. Lin ◽  
G. A. Dixit ◽  
...  

ABSTRACTThis work investigates the reliability issues associated with an aluminum sputter process, called the Al-plug process, that results in the complete filling of submicron contacts and vias of various sizes. The state-of-the-art Al-plug technology has proven its superiority over conventional processes due to its process simplicity and complete elimination of metal step-coverage problems and dielectric voiding over contacts/vias, resulting in higher reliability. Materials and electrical characterization of this metal process are presented.


Electronics ◽  
2021 ◽  
Vol 10 (22) ◽  
pp. 2782
Author(s):  
Konstantinos D. Paschaloudis ◽  
Constantinos L. Zekios ◽  
Georgios C. Trichopoulos ◽  
Filippos Farmakis ◽  
George A. Kyriacou

In this work, we present a rigorous full-wave eigenanalysis for the study of nanoantennas operating at both terahertz (THz) (0.1–10 THz), and infrared/optical (10–750 THz) frequency spectrums. The key idea behind this effort is to reveal the physical characteristics of nanoantennas such that we can transfer and apply the state-of-the-art antenna design methodologies from microwaves to terahertz and optics. Extensive attention is given to penetration depth in metals to reveal whether the surface currents are sufficient for the correct characterization of nanoantennas, or the involvement of volume currents is needed. As we show with our analysis, the penetration depth constantly reduces until the region of 200 THz; beyond this point, it shoots up, requiring volume currents for the exact characterization of the corresponding radiating structures. The cases of a terahertz rectangular patch antenna and a plasmonic nanoantenna are modeled, showing in each case the need of surface and volume currents, respectively, for the antenna’s efficient characterization.


2007 ◽  
Vol 567-568 ◽  
pp. 39-44
Author(s):  
W. R. Tyson

Characterization of fracture toughness is discussed in relation to specification of steels for northern pipelines. The state of the art and research trends in measurement of CTOD for girth welds and CTOA for linepipe steel are described.


2001 ◽  
Vol 669 ◽  
Author(s):  
P. Borden ◽  
A. Al-Bayati ◽  
J. Madsen ◽  
C. Lazik ◽  
P. Carey ◽  
...  

ABSTRACTDoping process windows are becoming very narrow as VLSI technology nodes scale to smaller and smaller dimensions. The time and cost required to develop new doping methods and the desire to re-use equipment will make it likely that current methods will be applied as long as possible. This means that existing process tools will have very tight stability and uniformity requirements, and metrology will be required to drive process control. The paper describes the state-of-the-art of both doping processes involving ion implantation and spike annealing, and new metrology based on Carrier IlluminationTM methods that will be required to implement in-line process control for these processes. CI offers depth resolution on the order of1Å, providing a level of control required to extend existing doping methods. The prospects of new methods such as Laser Thermal Annealing (LTA) are also discussed.


2018 ◽  
Vol 3 (2) ◽  
pp. 128-145 ◽  
Author(s):  
S. K. Fierens ◽  
P. H. M. Van Steenberge ◽  
M.-F. Reyniers ◽  
D. R. D'hooge ◽  
G. B. Marin

A detailed overview is given on the currently developed analytical and advanced kinetic models to calculate the main bulk/solution chain-growth copolymerization characteristics.


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