scholarly journals Thermal Performance of Cryogenic Micro-Pin Fin Coolers with Two-Phase Liquid Nitrogen Flows

2021 ◽  
Vol 11 (22) ◽  
pp. 11071
Author(s):  
Kyoung Joon Kim ◽  
Hyeon Ho Yang ◽  
Wooheon Noh ◽  
Bongtae Han ◽  
Avram Bar-Cohen
Keyword(s):  
Heat Transfer ◽  
Liquid Nitrogen ◽  
Cooling System ◽  
High Heat ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Pin Fin ◽  
Order Of Magnitude ◽  
Phase Liquid ◽  
Nitrogen Flows

This study experimentally explores the thermofluidic performance of a cryogenic micro-pin fin cooler with two-phase liquid nitrogen flows. The liquid nitrogen cooling system is introduced to investigate the performance of the micro-pin cooler in a cryogenic condition. The result reveals that the nominal value of the base heat transfer coefficients of the micro-pin fin cooler with liquid nitrogen flows, 240 kW/m2-K at a mass flow rate of 2.23 g/s, is an order of magnitude greater than that with FC-72 flows. The result also demonstrates that the base heat transfer coefficient of the micro-pin fin cooler is nearly three times greater than that of the micro-gap cooler, not containing any fins. This study shows the feasibility of the cryogenic micro-pin fin cooler for thermally controlling very high heat density devices such as high-power laser diode bars, of which the heat density can reach 2000 kW/m2.

Thermoreflectance Wall Temperature Measurement in Annular Two-Phase Flow

2019 ◽  
Author(s):  
Jason Chan ◽  
Brian E. Fehring ◽  
Roman W. Morse ◽  
Kristofer M. Dressler ◽  
Gregory F. Nellis ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Wall Temperature ◽  
Annular Flow ◽  
High Heat ◽  
High Heat Flux ◽  
Phase Flow ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Heat Transfer Coefficients ◽  
Dry Out

Abstract A thermoreflectance method to measure wall temperature in two-phase annular flow is described. In high heat flux conditions, momentary dry-out occurs as the liquid film vaporizes, resulting in dramatic decreases in heat transfer coefficient. Simultaneous liquid and vapor thermoreflectance measurements allow calculations of instantaneous and time-averaged heat transfer coefficients. Validation, calibration and uncertainty of the technique are discussed.

Spatial and Temporal Wall Temperature Fluctuations in Two-Phase Flow in Microgap Coolers

2010 ◽  
Author(s):  
Jessica Sheehan ◽  
Avram Bar-Cohen
Keyword(s):  
Heat Transfer ◽  
High Heat ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Heat Transfer Coefficients ◽  
High Heat Transfer ◽  
Volumetric Cooling ◽  
Very High

Heat transfer to an evaporating refrigerant and/or dielectric liquid in a microgap channel can provide very high heat transfer coefficients and volumetric cooling rates. Recent studies at Maryland have established the dominance of the annular flow regime in such microgap channels and related the observed high-quality peak of an M-shaped heat transfer coefficient curve to the onset of local dryout. The present study utilizes infrared thermography to locate such nascent dryout regions and operating conditions. Data obtained with a 210 micron microgap channel, operated with a mass flux of 195.2 kg/m2-s and heat fluxes of 10.3 to 26 W/cm2 are presented and discussed.

Heat Transfer Analysis of Microgrooved Evaporator and Condenser Surfaces Utilized in a High Heat Flux Two-Phase Flow Loop

2007 ◽  
Author(s):  
Edvin Cetegen ◽  
Thomas Baummer ◽  
Serguei Dessiatoun ◽  
Michael Ohadi
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
High Heat ◽  
Phase Flow ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Pressure Drops ◽  
Heat Transfer Coefficients ◽  
High Heat Transfer ◽  
Microgrooved Surface

This paper investigates the heat transfer and pressure drop analysis of micro grooved surfaces utilized in evaporators and condensers of a two-phase flow cooling loop. These devices utilize the vapor-liquid phase change to transfer large amounts of heat, and they offer substantially higher heat flux performance with lower pumping power than most liquid cooling technologies. Microgrooved surfaces, combined with force-fed evaporation and condensation technology discussed in this paper yield high heat transfer coefficients with low pressure drops. Our most recent results, aiming to test the limits of the technology, demonstrated dissipation of almost 1kW/cm2 from silicon electronics using HFE 7100 as the working fluid. In a compact two phase system, the heat generated by the electronic components can be absorbed by microgrooved evaporators and rejected through the microgrooved surface condensers to liquid cooled slots with high heat transfer coefficients and low pressure drops on the refrigerant side. In the case of air-cooling, the same microgrooved surface heat exchanger can reject heat with a heat transfer coefficient of 3847 W/cm2 and a pressure drop of 4156 Pa. These heat transfer processes have the added capability of being combined and used together in a self-contained system cooled either by liquid or air.

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

2021 ◽  
Author(s):  
Kidus Guye ◽  
De Dong ◽  
Yunseo Kim ◽  
Hyoungsoon Lee ◽  
Baris Dogruoz ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Interfacial Area ◽  
High Heat ◽  
Heat Fluxes ◽  
Air Cooling ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Maximum Heat ◽  
Maximum Heat Transfer ◽  
Evaporation Heat

Abstract Over the last several decades, cooling technologies have been developed to address the growing thermal challenges associated with high-powered electronics. However, within the next several years, the heat generated by these devices is predicted to exceed 1 kW/cm2, and traditional methods, such as air cooling, are limited in their capacities to dissipate such high heat fluxes. In contrast, two-phase cooling methods, such as microdroplet evaporation, are very promising due to the large latent heat of vaporization associated with the phase change process. Previous studies have shown non-axisymmetric droplets exhibit different evaporation characteristics than spherical droplets. For a droplet pinned atop a micropillar, the solid-liquid and liquid-vapor interfacial area, the volume, and thickness of the droplet are the major factors that govern the evaporation heat transport process. In this work, we develop a shape optimization tool using the particle swarm optimization algorithm to maximize evaporation from a droplet confined atop a micropillar. The tool is used to optimize the shape of a nonaxisymmetric droplet. Compared to droplets atop circular and regular equilateral triangular micropillar structures, we find that droplets confined on pseudo-triangular micropillar structures have 23.7% and 5.7% higher heat transfer coefficients, respectively. The results of this work will advance the design of microstructures that support droplets with maximum heat transfer performance.

Microchannel Cooling in Computing Platforms: Performance Needs and Challenges in Implementation

2004 ◽  
Author(s):  
Himanshu Pokharna ◽  
Kuroda Masahiro ◽  
Eric DiStefano ◽  
Rajiv Mongia ◽  
Jim Barry ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Single Phase ◽  
Cooling System ◽  
Heat Sinks ◽  
System Level ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Fluid Resistance ◽  
Microchannel Heat Sinks ◽  
Computing Platforms

Remote cooling is the established cooling scheme in notebook computers, and increasingly, other computing sectors like desktops and servers are evaluating this approach as an option for cooling future platforms. While remote cooling facilitates a larger heat exchanger than the space directly over the processor would allow, it introduces an additional thermal resistance, in particular, θp-f (plate to fluid resistance) — the resistance in getting the heat from the cold plate to the fluid. For any remote cooling system, this resistance needs to be carefully evaluated and minimized. Pumped fluid loops incorporating microchannel heat exchangers are a viable option to achieve low plate-to-fluid resistances. In this paper we will identify a reasonable target for θp-f and subsequently describe two similar but fundamentally different thermal systems to accomplish this target performance: single-phase and two-phase pumped loops. Although two phase flows are traditionally thought of as the way to accomplish the highest heat transfer coefficients and thus the lowest resistances, with microchannel heat sinks the contrast is not so acute. We will present results from our experimental work on single- and two-phase heat transfer from microchannel heat sinks and demonstrate a transition where single-phase performance matches that of two-phase operation. This will be followed by the analysis methods used to predict the heat transfer and the pressure drop data. Moreover, we will discuss system level issues and other hurdles that need to be overcome in commercialization of microchannel technology for cooling computer systems.

Temperature Distribution in Cocurrent Two-Phase (Liquid-Liquid) Laminar Flow on Inclined Surfaces

1964 ◽  
Vol 86 (4) ◽  
pp. 476-480 ◽  
Author(s):  
M. Bentwich ◽  
S. Sideman
Keyword(s):  
Heat Transfer ◽  
Temperature Distribution ◽  
Transverse Section ◽  
Heat Transfer Mechanism ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Heat Transfer Coefficients ◽  
Inclined Surfaces ◽  
Steady State Temperature ◽  
Phase Liquid

The steady-state temperature distribution in stratified two-phase, laminar viscous flow down an inclined solid plane is analyzed. With the plane and atmosphere kept at constant uniform temperatures, the temperature distribution is evaluated for various heat-transfer coefficients at the exposed surface. Graetz’s general approach is adopted here so that this solution holds for arbitrary given temperatures at a transverse section upstream. This method is modified here so as to account for the discontinuities of the physical properties at the interface. This analysis thus yields a detailed account of the heat-transfer mechanism which takes place at the interface.

Flow Boiling Heat Transfer Enhancement in Subcooled and Saturated Refrigerants in Minichannel Heat Sinks

2014 ◽  
Author(s):  
Ehsan Yakhshi-Tafti ◽  
Howard Pearlman ◽  
Seung M. You
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Laser Applications ◽  
Enhanced Boiling

Forced two-phase cooling is investigated for handling high power electronics and laser applications having high heat flux and isothermality requirements. Experimental results are reported for minichannel heat sinks with and without enhanced boiling coatings showing increased heat transfer coefficients and higher critical heat flux for coated versus uncoated surfaces.

Microjet Impingement Cooling With Phase Change

2004 ◽  
Author(s):  
Evelyn N. Wang ◽  
Juan G. Santiago ◽  
Kenneth E. Goodson ◽  
Thomas W. Kenny
Keyword(s):  
Heat Transfer ◽  
Cooling System ◽  
Heated Surface ◽  
Heat Removal ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Impingement Cooling ◽  
Heat Transfer Coefficients ◽  
High Heat Transfer ◽  
Wall Superheat

The large heat generation rates in contemporary microprocessors require new thermal management solutions. Two-phase microjet impingement cooling promises high heat transfer coefficients and effective cooling of hotspots. We have fabricated integrated microjet structures with heaters and temperature sensors to study local heat transfer at the impingement surface of a confined microjet. Circular jets with diameters less than 100 μm are machined in glass. Preliminary temperature measurements (for Rej = 100–500) suggest that heat transfer coefficients of 1000 W/m2C close to the jet stagnation zone can be achieved. As the flowrate of the jet is increased, a tradeoff in heat removal capability and wall superheat is observed. To aid in understanding the mechanism for wall superheat during boiling at the heated surface, the devices allow for optical access through the top of the device. However, the formation of vapor from the top reservoir makes visualization difficult. This study aids in the design of microjet heat sinks used for integration into a closed-loop cooling system.

scholarly journals Visualization of Two-Phase Flow in Serpentine Heat Exchanger Passages With Microscale Pin Fins

2017 ◽  
Vol 140 (1) ◽  
Author(s):  
Dhruv C. Hoysall ◽  
Khoudor Keniar ◽  
Srinivas Garimella
Keyword(s):  
Two Phase Flow ◽  
Flow Regimes ◽  
High Heat ◽  
Phase Flow ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Pressure Drops ◽  
Pin Fin ◽  
High Heat Transfer ◽  
Pin Fins

Microchannel heat exchangers offer the potential for high heat transfer coefficients; however, implementation challenges must be addressed to realize this potential. Maldistribution of phases among the microchannels and the changing phase velocities associated with phase change present design challenges. Flow maldistribution and oscillatory instabilities can affect transfer rates and pressure drops. In condensers, evaporators, absorbers, and desorbers, changing phase velocities can change prevailing flow regimes from favorable to unfavorable. Geometries with serpentine passages containing pin fins can be configured to maintain favorable flow regimes throughout the component for phase-change heat and mass transfer applications. Due to the possibility of continuous redistribution of the flow across the pin fins along the flow direction, maldistribution can also be reduced. These features enable high heat transfer coefficients, thereby achieving considerable compactness. The characteristics of two-phase flow through a serpentine passage with micro-pin fin arrays with diameter 350 μm and height 406 μm are investigated. An air–water mixture is used to represent two-phase flow through the serpentine test section, and flow features are investigated using high-speed photography. Improved flow distribution is observed in the serpentine geometry. Distinct flow regimes, different from those observed in microchannels, are also established. Void fraction and interfacial area along the length of the serpentine passages are compared with the corresponding values for microchannels. A model developed for the two-phase frictional pressure drops across this serpentine micro-pin fin geometry predicts experimental values with a mean absolute error (MAE) of 7.16%.

Two Phase Pressure Drop and Boiling Heat Transfer in Micro Pin Fin Channel

2016 ◽  
Author(s):  
Ki Moon Jung ◽  
Hee Joon Lee
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Mass Flux ◽  
Boiling Heat Transfer ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Pin Fin ◽  
Boiling Heat Transfer Coefficient

In this paper, boiling experiments were conducted to study two-phase pressure drop and the heat transfer coefficient in a staggered array micro pin fin channel of degassed water at a mass flux range of 9.3 to 46.6 kg/m2s and a heat flux of 0.5 to 0.9 W/cm2. Copper was used for the pin fin array microchannel heat sink, which was 31 mm in width and 82 mm in length. Micro pin fins, of 400 μm in diameter and 700 μm in height, were manufactured using a micro milling machine on the channel block. The distance between two pin fin surfaces is 300 μm. A thin film heater, which supplies a maximum constant heat flux of 1.55 W/cm2, was attached underneath the heat sink. From the experimental results, at a vapor quality of up to 0.04, the boiling heat transfer coefficient decreased as the quality increased. Results show that the heat transfer coefficient is dependent on the mass flux. The data also showed that the pressure drop increased with increasing mass flux. The data obtained in this study were compared to the existing correlations of boiling pressure drop and heat transfer coefficients. Results showed that the correlation with boiling pressure drop of Qu and Siu-Ho[22] yielded a prediction of 21.3% average error Additionally, as a result of comparison with the four existing correlations of boiling heat transfer coefficient, all correlations had a lower prediction for the heat transfer coefficients obtained in this study. Through visualization, it was found that the bubbles generated between the fins began to grow and moved downstream. We observed a stationary vapor pocket in which bubbles did not flow.

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