Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

2021 ◽  
Author(s):  
Kidus Guye ◽  
De Dong ◽  
Yunseo Kim ◽  
Hyoungsoon Lee ◽  
Baris Dogruoz ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Interfacial Area ◽  
High Heat ◽  
Heat Fluxes ◽  
Air Cooling ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Maximum Heat ◽  
Maximum Heat Transfer ◽  
Evaporation Heat

Abstract Over the last several decades, cooling technologies have been developed to address the growing thermal challenges associated with high-powered electronics. However, within the next several years, the heat generated by these devices is predicted to exceed 1 kW/cm2, and traditional methods, such as air cooling, are limited in their capacities to dissipate such high heat fluxes. In contrast, two-phase cooling methods, such as microdroplet evaporation, are very promising due to the large latent heat of vaporization associated with the phase change process. Previous studies have shown non-axisymmetric droplets exhibit different evaporation characteristics than spherical droplets. For a droplet pinned atop a micropillar, the solid-liquid and liquid-vapor interfacial area, the volume, and thickness of the droplet are the major factors that govern the evaporation heat transport process. In this work, we develop a shape optimization tool using the particle swarm optimization algorithm to maximize evaporation from a droplet confined atop a micropillar. The tool is used to optimize the shape of a nonaxisymmetric droplet. Compared to droplets atop circular and regular equilateral triangular micropillar structures, we find that droplets confined on pseudo-triangular micropillar structures have 23.7% and 5.7% higher heat transfer coefficients, respectively. The results of this work will advance the design of microstructures that support droplets with maximum heat transfer performance.

Spatial and Temporal Wall Temperature Fluctuations in Two-Phase Flow in Microgap Coolers

2010 ◽  
Author(s):  
Jessica Sheehan ◽  
Avram Bar-Cohen
Keyword(s):  
Heat Transfer ◽  
High Heat ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Heat Transfer Coefficients ◽  
High Heat Transfer ◽  
Volumetric Cooling ◽  
Very High

Heat transfer to an evaporating refrigerant and/or dielectric liquid in a microgap channel can provide very high heat transfer coefficients and volumetric cooling rates. Recent studies at Maryland have established the dominance of the annular flow regime in such microgap channels and related the observed high-quality peak of an M-shaped heat transfer coefficient curve to the onset of local dryout. The present study utilizes infrared thermography to locate such nascent dryout regions and operating conditions. Data obtained with a 210 micron microgap channel, operated with a mass flux of 195.2 kg/m2-s and heat fluxes of 10.3 to 26 W/cm2 are presented and discussed.

Enhanced Pool Boiling With HFE7000 Over Selectively Sintered Microchannels

2017 ◽  
Author(s):  
Travis S. Emery ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Pool Boiling ◽  
Electronics Cooling ◽  
Fold Increase ◽  
High Heat ◽  
Heat Fluxes ◽  
Dielectric Fluid ◽  
Maximum Heat ◽  
Maximum Heat Transfer

As the need for efficient thermal management grows, pool boiling’s ability to dissipate high heat fluxes has gained significant interest. The objective of this work was to study the performance of pool boiling at atmospheric pressure using a dielectric fluid, HFE7000. Both plain and enhanced copper surfaces were tested, and these results were then compared to similar testing performed with water and FC-87. The enhanced surfaces utilized microchannels with porous coatings selectively located on different regions of the heat transfer surface. A maximum critical heat flux (CHF) of 41.7 W/cm2 was achieved here, which translated to a 29% CHF increase in comparison to a plain chip. A maximum heat transfer coefficient (HTC) of 104.0 kW/m2°C was also achieved, which translated to a 6-fold increase in HTC when compared to a plain copper chip. More notably, this HTC was achieved at a wall temperature of 38.4 °C. This HTC enhancement was greater than that of water and FC-87 when using the same enhanced surface. The effect of sintering location was found to have a similar effect on CHF with HFE7000 in comparison with water. The effect of microchannel size was shown to have similar effects on CHF when compared with FC-87 and water. From the results found here, it is concluded that the employment of selectively sintered open microchannels with HFE7000 has significant potential for enhanced heat dissipation in electronics cooling applications.

Choosing Working Fluid for Two-Phase Thermosyphon Systems for Cooling of Electronics

2003 ◽  
Vol 125 (2) ◽  
pp. 276-281 ◽  
Author(s):  
Bjo¨rn Palm ◽  
Rahmatollah Khodabandeh
Keyword(s):  
Heat Transfer ◽  
High Pressure ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Air Cooling ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Heat Transfer Coefficients ◽  
And Performance ◽  
Cooling Of Electronics

The heat fluxes from electronic components are steadily increasing and have now, in some applications, reached levels where air-cooling is no longer sufficient. One alternative solution, which has received much attention during the last decade, is to use heat pipes or thermosyphons for transferring or spreading the dissipated heat. In this paper two-phase thermosyphon loops are discussed. Especially, the choice of fluid and its influence on the design and performance is treated. The discussion is supported by results from simulations concerning heat transfer and pressure drop. In general it is found that high-pressure fluids will give better performance and more compact designs as high-pressure results in higher boiling heat transfer coefficients and smaller necessary tube diameter.

Experimental and Analytical Investigation of Compact Liquid Cooled Heat Sinks

2004 ◽  
Author(s):  
M. Zugic ◽  
J. R. Culham ◽  
P. Teertstra ◽  
Y. Muzychka ◽  
K. Horne ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Experimental Tests ◽  
Reynolds Numbers ◽  
High Heat ◽  
Analytical Investigation ◽  
Boundary Resistance ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Air Cooling ◽  
Design Tools

Compact, liquid cooled heat sinks are used in applications where high heat fluxes and boundary resistance preclude the use of more traditional air cooling techniques. Four different liquid cooled heat sink designs, whose core geometry is formed by overlapped ribbed plates, are examined. The objective of this analysis is to develop models that can be used as design tools for the prediction of overall heat transfer and pressure drop of heat sinks. Models are validated for Reynolds numbers between 300 and 5000 using experimental tests. The agreement between the experiments and the models ranges from 2.35% to 15.3% RMS.

Reduced Pressure Boiling Heat Transfer in Rectangular Microchannels With Interconnected Reentrant Cavities

2005 ◽  
Vol 127 (10) ◽  
pp. 1106-1114 ◽  
Author(s):  
Ali Koşar ◽  
Chih-Jung Kuo ◽  
Yoav Peles
Keyword(s):  
Heat Transfer ◽  
Heat Fluxes ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Convective Boiling ◽  
Reduced Pressure ◽  
Exit Pressure ◽  
Mass Fluxes ◽  
Mechanism Transition ◽  
Two Phase Heat Transfer

Boiling flow of deionized water through 227μm hydraulic diameter microchannels with 7.5μm wide interconnected reentrant cavities at 47 kPa exit pressure has been investigated. Average two-phase heat transfer coefficients have been obtained over effective heat fluxes ranging from 28 to 445W∕cm2 and mass fluxes from 41 to 302kg∕m2s. A map is developed that divides the data into two regions where the heat transfer mechanisms are nucleation or convective boiling dominant. The map is compared to similar atmospheric exit pressure data developed in a previous study. A boiling mechanism transition criterion based on the Reynolds number and the Kandlikar k1 number is proposed.

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

2018 ◽  
Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Flow Boiling ◽  
Laser Diodes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Average Maximum

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.

Analytical Model Quantifying the Net Coolant Flow Rate to a Microstructured Copper Surface validated with Two-Phase PIV Measurements

2021 ◽  
Author(s):  
Matt Harrison ◽  
Joshua Gess
Keyword(s):  
Heat Transfer ◽  
Analytical Model ◽  
Flow Rate ◽  
Circular Disk ◽  
Nucleate Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
Coolant Flow ◽  
Coolant Flow Rate ◽  
Two Phase

Abstract Using Particle Image Velocimetry (PIV), the amount of fluid required to sustain nucleate boiling was quantified to a microstructured copper circular disk. Having prepared the disk with preferential nucleation sites, an analytical model of the net coolant flow rate requirements to a single site has been produced and validated against experimental data. The model assumes that there are three primary phenomena contributing to the coolant flow rate requirements at the boiling surface; radial growth of vapor throughout incipience to departure, bubble rise, and natural convection around the periphery. The total mass flowrate is the sum of these contributing portions. The model accurately predicts the quenching fluid flow rate at low and high heat fluxes with 4% and 30% error of the measured value respectively. For the microstructured surface examined in this study, coolant flow rate requirements ranged from 0.1 to 0.16 kg/sec for a range of heat fluxes from 5.5 to 11.0 W/cm2. Under subcooled conditions, the coolant flow rate requirements plummeted to a nearly negligible value due to domination of transient conduction as the primary heat transfer mechanism at the liquid/vapor/surface interface. PIV and the validated analytical model could be used as a test standard where the amount of coolant the surface needs in relation to its heat transfer coefficient or thermal resistance is a benchmark for the efficacy of a standard surface or boiling enhancement coating/surface structure.

Predicting Heat Transfer in Long R-134a Filled Thermosyphons

2009 ◽  
Vol 131 (5) ◽  
Author(s):  
M. H. M. Grooten ◽  
C. W. M. van der Geld
Keyword(s):  
Heat Transfer ◽  
Saturation Temperature ◽  
Good Alternative ◽  
Condensation Heat Transfer ◽  
Air Cooling ◽  
Transfer Coefficients ◽  
Reduced Pressure ◽  
Evaporation Heat ◽  
Evaporation Heat Transfer ◽  
R 134A

When traditional air-to-air cooling is too voluminous, heat exchangers with long thermosyphons offer a good alternative. Experiments with a single thermosyphon with a large length-to-diameter ratio (188) and filled with R-134a are presented and analyzed. Saturation temperatures, filling ratios, and angles of inclination have been varied in wide ranges. A higher sensitivity of evaporation heat transfer coefficients on reduced pressure than in previous work has been found. Measurements revealed the effect of pressure or the saturation temperature on condensation heat transfer. The condensate film Reynolds number that marks a transition from one condensation heat transfer regime to another is found to depend on pressure. This effect was not accounted for by correlations from the literature. New correlations are presented to predict condensation and evaporation heat transfer rates.

Thermoreflectance Wall Temperature Measurement in Annular Two-Phase Flow

2019 ◽  
Author(s):  
Jason Chan ◽  
Brian E. Fehring ◽  
Roman W. Morse ◽  
Kristofer M. Dressler ◽  
Gregory F. Nellis ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Wall Temperature ◽  
Annular Flow ◽  
High Heat ◽  
High Heat Flux ◽  
Phase Flow ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Heat Transfer Coefficients ◽  
Dry Out

Abstract A thermoreflectance method to measure wall temperature in two-phase annular flow is described. In high heat flux conditions, momentary dry-out occurs as the liquid film vaporizes, resulting in dramatic decreases in heat transfer coefficient. Simultaneous liquid and vapor thermoreflectance measurements allow calculations of instantaneous and time-averaged heat transfer coefficients. Validation, calibration and uncertainty of the technique are discussed.

Investigation of Two Phase Heat Transfer Coefficients of Cryogenic Mixed Refrigerants

2013 ◽  
Author(s):  
Seungwhan Baek ◽  
Sangkwon Jeong
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Heat Exchanger ◽  
Transfer Coefficient ◽  
Transfer Coefficients ◽  
Two Phase ◽  
Microchannel Heat Exchanger ◽  
Heat Transfer Coefficients ◽  
Evaporation Heat ◽  
Two Phase Heat Transfer

Mixed Refrigerant Joule Thomson (MR-JT) refrigerators are widely used in various kinds of cryogenic systems these days. Although heat transfer coefficient estimation for a multiphase and multi-component fluid in cryogenic temperature range is necessarily required in the heat exchanger design of MR-JT refrigerator, it has been rarely discussed so far. In this paper, condensation and evaporation heat transfer coefficients of mixed refrigerant are measured in a microchannel heat exchanger. Printed Circuit Heat Exchanger (PCHE) has been developed as a compact microchannel heat exchanger and used in the experiment. Several two-phase heat transfer coefficient correlations are examined to discuss the experimental measurement results. The result of this paper shows that cryogenic mixed refrigerant heat transfer coefficients can be estimated by conventional two-phase heat transfer coefficient correlations.

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