Linear Electron Beam Assisted Roll-to-Roll in-Vacuum Flexographic Patterning for Flexible Thermoelectric Generators

In this work, we investigated the use of in-line linear electron beam irradiation (LEB) surface treatment integrated into a commercially compatible roll-to-roll (R2R) processing line, as a single fluorocarbon cleaning step, following flexography oil masking used to pattern layers for devices. Thermoelectric generators (TEGs) were selected as the flexible electronic device demonstrator; a green renewable energy harvester ideal for powering wearable technologies. BiTe/BiSbTe-based flexible TEGs (f-TEGs) were fabricated using in-line oil patterned aluminium electrodes, followed by a 600 W LEB cleaning step, in which the duration was optimised. A BiTe/BiSbTe f-TEG using an oil-patterned electrode and a 15 min LEB clean (to remove oil prior to BiTe/BiSbTe deposition) showed similar Seebeck and output power (S~0.19 mV K−1 and p = 0.02 nW at ΔT = 20 K) compared to that of an oil-free reference f-TEG, demonstrating the success of using the LEB as a cleaning step to prevent any remaining oil interfering with the subsequent active material deposition. Device lifetimes were investigated, with electrode/thermoelectric interface degradation attributed to an aluminium/fluorine reaction, originating from the fluorine-rich masking oil. A BiTe/GeTe f-TEG using an oil-patterned/LEB clean, exceeded the lifetime of the comparable BiTe/BiSbTe f-TEG, highlighting the importance of deposited material reactivities with the additives from the masking oil, in this case fluorine. This work therefore demonstrates (i) full device architectures within an R2R system using vacuum flexography oil patterned electrodes; (ii) an enabling Electron beam cleansing step for removal of oil remnants; and (iii) that careful selection of masking oils is needed for the materials used when flexographic patterning during R2R.

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Flexible film-based thermoelectric generators

MRS Advances ◽

10.1557/adv.2019.256 ◽

2019 ◽

Vol 4 (30) ◽

pp. 1691-1697

Author(s):

Shuping Lin ◽

Wei Zeng ◽

Lisha Zhang ◽

Xiaoming Tao

Keyword(s):

Seebeck Coefficient ◽

Thermoelectric Generator ◽

Low Cost ◽

Thermoelectric Generators ◽

Polystyrene Sulfonate ◽

Paper Substrate ◽

Thermoelectric Element ◽

Flexible Film ◽

P Type ◽

Flexible Thermoelectric

ABSTRACT:The present work highlights the progress in the field of flexible thermoelectric generator (f-TEGs) fabricated by 3-D printing strategy on the typing paper substrate. In this study, printable thermoelectric paste was developed. The dimension of each planer thermoelectric element is 30mm*4mm with a thickness of 50 μm for P-type Bismuth Tellurium (Bi2Te3)-based/ poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) leg. A single thermoleg with this dimension can generate a voltage of 5.38 mV at a temperature difference of 70 K. The calculated Seebeck Coefficient of a single thermoleg is 76.86 μV/K. This work demonstrates that low-cost printing technology is promising for the fabrication of f-TEGs.

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High-throughput physical vapour deposition flexible thermoelectric generators

Scientific Reports ◽

10.1038/s41598-019-41000-y ◽

2019 ◽

Vol 9 (1) ◽

Cited By ~ 7

Author(s):

Katrina A. Morgan ◽

Tian Tang ◽

Ioannis Zeimpekis ◽

Andrea Ravagli ◽

Chris Craig ◽

...

Keyword(s):

High Throughput ◽

Vapour Deposition ◽

Thermoelectric Generators ◽

Physical Vapour Deposition ◽

Flexible Thermoelectric

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Synthesis of Cotton Graft Copolymers Containing Glycidyl Methacrylate and Different Cyclodextrins Moieties Using Linear Electron Beam Radiation

Research Journal of Textile and Apparel ◽

10.1108/rjta-13-03-2009-b007 ◽

2009 ◽

Vol 13 (3) ◽

pp. 57-68 ◽

Cited By ~ 1

Author(s):

Ali A. Hebeish ◽

Essam S. Abdel-Halim ◽

Ibrahim A. Hamdy ◽

Sanaa M. El-Sawy ◽

Mervat S. Ibrahim ◽

...

Keyword(s):

Electron Beam ◽

Glycidyl Methacrylate ◽

Graft Copolymers ◽

Linear Electron ◽

Beam Radiation ◽

Electron Beam Radiation

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A Feasibility Study of Roll to Roll Printing on Graphene

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.799-800.402 ◽

2015 ◽

Vol 799-800 ◽

pp. 402-406 ◽

Cited By ~ 6

Author(s):

S. Hassan ◽

Mohd Sallehuddin Yusof ◽

M.I. Maksud ◽

M.N. Nodin ◽

Noor Azlina Rejab

Keyword(s):

High Speed ◽

Electronic Device ◽

Electronic Devices ◽

Printing Industry ◽

Micro Scale ◽

Roll To Roll ◽

Printing Technique ◽

Printing Ink ◽

Variable Substrate ◽

Printing Techniques

Roll to roll process is one of the famous printing techniques that are possible to create graphic and electronic device on variable substrate by using conductive ink. Graphene is an example of material that can be used as printing ink which usually used in producing micro-scale electronic devices. Here, it is proposed that extending roll to roll printing technique into the multiple micro-scale printing fine solid line onto substrate by using graphene as a printing ink. Flexography is a high speed roll to roll printing technique commonly used in paper printing industry. And this study elaborates the feasibility of graphene as a printing ink use in combination of flexography and micro-contact or micro-flexo printing for micro fine solid line. This paper will illustrates the review of graphene in producing multiple micro-solid lines printing capability for the application of printing electronic, graphic and bio-medical.

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Multifold enhancement of the output power of flexible thermoelectric generators made from cotton fabrics coated with conducting polymer

RSC Advances ◽

10.1039/c7ra08663f ◽

2017 ◽

Vol 7 (69) ◽

pp. 43737-43742 ◽

Cited By ~ 24

Author(s):

Y. Du ◽

K. F. Cai ◽

S. Z. Shen ◽

R. Donelsonand ◽

J. Y. Xu ◽

...

Keyword(s):

Conducting Polymer ◽

Output Power ◽

Cotton Fabrics ◽

Thermoelectric Generators ◽

Coated Fabric ◽

Metal Wires ◽

Flexible Thermoelectric

An flexible TE generator with enhanced output power was fabricated by combining PEDOT:PSS coated fabric with n-type metal wires.

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Tensile Ductility of Electron Beam Welded Titanium Alloys

Materials Science Forum ◽

10.4028/www.scientific.net/msf.713.133 ◽

2012 ◽

Vol 713 ◽

pp. 133-138

Author(s):

Timotius Pasang ◽

J.C. Sabol ◽

Wojciech Z. Misiolek ◽

Ryan Mitchell ◽

Andrew B. Short ◽

...

Keyword(s):

Mechanical Properties ◽

Electron Beam ◽

Grain Boundary ◽

Titanium Alloys ◽

Electron Beam Welding ◽

Tensile Ductility ◽

Commercially Pure ◽

Materials Used ◽

Cp Ti ◽

Welding Technique

Butt welded joins were produced between commercially pure (CP) titanium and various titanium alloys using an electron beam welding technique. The materials used were CP Ti, Ti-6Al-4V (Ti64) and Ti-5Al-5V-5Mo-3Cr (Ti5553). Grain boundary structures, mechanical properties, compositional profiles across the welds and fracture modes are presented. CP Ti has always been known for its excellent weldability, Ti64 has good weldability and, preliminary results indicated that Ti5553 alloy is also weldable.

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Potential Applications of Poly-Silicon as an Electronic-Device Material

MRS Proceedings ◽

10.1557/proc-5-249 ◽

1981 ◽

Vol 5 ◽

Cited By ~ 5

Author(s):

Dirk J. Bartelink

Keyword(s):

Electronic Material ◽

Grain Boundaries ◽

Electronic Device ◽

Crystalline Silicon ◽

Ground Plane ◽

Current Trend ◽

Active Material ◽

Flat Panel Display ◽

Large Area ◽

Potential Applications

ABSTRACTPoly-crystalline silicon can be regarded as a true electronic material if good p-n junctions can be made in it or if its state of depletion can be altered by reasonable gate voltages. The degree of perfection with which it must exhibit these electronic-material properties depends on whether the application is as a technology in VLSI (or other bulk-Si substrate use) where devices with bulk-crystalline properties are available or as the principal active material in Large Area Integration (LAI), such as flat-panel display addressing circuits, where the competition is much less demanding. The three main detrimental effects of grain boundaries on electronic-device function are the action of grain boundary traps as (1) extra charge centers, (2) lifetime killers, and (3) mobility-reducing scattering centers. The current trend in reducing or almost eliminating grain boundaries by laser recrystallization or lateral epitaxy has the effect of reducing the average number of traps. In terms of potential applications of the material, the improvement derived from these procedures must be balanced against other contraints placed on the overall structure. For example, the thickness and quality of the lower oxide (and interface) in these processes will determine whether an electronically active lower gate function is practical. Some currently envisioned applications include load devices in inverters either as resistors or as depletion transistors, common-gate staked CMOS structures, dual-channel MOSFET's, and other “vertical VLSI” applications. The systems-level topological advantages of stacked structures and the circuit-performance improvement provided by the ground plane in dielectrically isolated devices must also be balanced against the extra cost and yield loss of additional masking level complexity and design complication.

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