scholarly journals Effects of the Circuit Arrangement on the Thermal Performance of Double U-Tube Ground Heat Exchangers

Energies ◽  
2020 ◽  
Vol 13 (12) ◽  
pp. 3275
Author(s):  
Aminhossein Jahanbin ◽  
Giovanni Semprini ◽  
Andrea Natale Impiombato ◽  
Cesare Biserni ◽  
Eugenia Rossi di Schio
Keyword(s):  
Thermal Resistance ◽  
Thermal Performance ◽  
Numerical Code ◽  
Geometrical Parameters ◽  
Fluid Temperature ◽  
The Finite Element Method ◽  
Ground Heat Exchangers ◽  
Borehole Thermal Resistance ◽  
The Impact ◽  
Circuit Configuration

Given that the issue of variations in geometrical parameters of the borehole heat exchanger (BHE) revolves around the phenomenon of thermal resistance, a thorough understanding of these parameters is beneficial in enhancing thermal performance of BHEs. The present study seeks to identify relative changes in the thermal performance of double U-tube BHEs triggered by alterations in circuit arrangements, as well as the shank spacing and the borehole length. The thermal performance of double U-tube BHEs with different configurations is comprehensively analyzed through a 3D transient numerical code developed by means of the finite element method. The sensitivity of each circuit configuration in terms of the thermal performance to variations of the borehole length and shank spacing is investigated. The impact of the thermal interference between flowing legs, namely thermal short-circuiting, on parameters affecting the borehole thermal resistance is addressed. Furthermore, the energy exchange characteristics for different circuit configurations are quantified by introducing the thermal effectiveness coefficient. The results indicate that the borehole length is more influential than shank spacing in increasing the discrepancy between thermal performances of different circuit configurations. It is shown that deviation of the averaged-over-the-depth mean fluid temperature from the arithmetic mean of the inlet and outlet temperatures is more critical for lower shank spacings and higher borehole lengths.

Understanding the Impact of Flow Bypass on the Thermal Performance of Air Cooled Heat Sinks

2014 ◽  
Author(s):  
Krishna Kota ◽  
Mohamed M. Awad
Keyword(s):  
Energy Conservation ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Laminar Regime ◽  
Flow Energy ◽  
Factor Α ◽  
The Impact ◽  
Fundamental Mass

In this effort, theoretical modeling was employed to understand the impact of flow bypass on the thermal performance of air cooled heat sinks. Fundamental mass and flow energy conservation equations across a longitudinal fin heat sink configuration and the bypass region were applied and a generic parameter, referred as the Flow Bypass Factor (α), was identified from the theoretical solution that mathematically captures the effect of flow bypass as a quantifiable parameter on the junction-to-ambient thermal resistance of the heat sink. From the results obtained, it was found that, at least in the laminar regime, the impact of flow bypass on performance can be neglected for cases when the bypass gap is typically less than 5% of the fin height, and is almost linear at high relative bypass gaps (i.e., usually for bypass gaps that are more than 10–15% of the fin height). It was also found that the heat sink thermal resistance is more sensitive to small bypass gaps and the effect of flow bypass decreases with increasing bypass gap.

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

2017 ◽  
Author(s):  
Shenghui Lei ◽  
Alexandre Shen ◽  
Ryan Enright
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Silicon Photonics ◽  
Communication Systems ◽  
Device Fabrication ◽  
Ring Resonators ◽  
Wide Range ◽  
Soi Substrates ◽  
The Impact

Silicon photonics has emerged as a scalable technology platform for future optotelectronic communication systems. However, the current use of SiO2-based silicon-on-insulator (SOI) substrates presents a thermal challenge to integrated active photonic components such as lasers and semiconductor optical amplifiers due to the poor thermal properties of the buried SiO2 optical cladding layer beneath these devices. To improve the thermal performance of these devices, it has been suggested that SiO2 be replaced with aluminum nitride (AlN); a dielectric with suitable optical properties to function as an effective optical cladding that, in its crystalline state, demonstrates a high thermal conductivity (∼100× larger than SiO2 in current SOI substrates). On the other hand, the tuning efficiencies of thermally-controlled optical resonators and phase adjusters, crucial components for widely tunable lasers and modulators, are directly proportional to the thermal resistance of these devices. Therefore, the low thermal conductivity buried SiO2 layer in the SOI substrate is beneficial. Moreover, to further improve the thermal performance of these devices air trenches have been used to further thermally isolate these devices, resulting in up to ∼10× increase in tuning efficiency. Here, we model the impact of changing the buried insulator on a SOI substrate from SiO2 to high quality AlN on the thermal performance of a MRR. We map out the thermal performance of the MRR over a wide range of under-etch levels using a thermo-electrical model that incorporates a pseudo-etching approach. The pseudo-etching model is based on the diffusion equation and distinguishes the regions where substrate material is removed during device fabrication. The simulations reveal the extent to which air trenches defined by a simple etch pattern around the MRR device can increase the thermal resistance of the device. We find a critical under-etch below which no benefit is found in terms of the MRR tuning efficiency. Above this critical under-etch, the tuning efficiency increases exponentially. For the SiO2-based MRR, the thermal resistance increases by ∼7.7× between the un-etched state up to the most extreme etch state. In the unetched state, the thermal resistance of the AlN-based MRR is only ∼4% of the SiO2-based MRR. At the extreme level of under-etch, the thermal resistance of the AlN-based MRR is still only ∼60% of the un-etched SiO2-based MRR. Our results suggest the need for a more complex MRR thermal isolation strategy to significantly improve tuning efficiencies if an AlN-based SOI substrate is used.

scholarly journals Heat Transfer at the Interface of Graphene Nanoribbons with Different Relative Orientations and Gaps

Energies ◽  
2019 ◽  
Vol 12 (5) ◽  
pp. 796 ◽  
Author(s):  
Shahin Mohammad Nejad ◽  
Masoud Bozorg Bigdeli ◽  
Rajat Srivastava ◽  
Matteo Fasano
Keyword(s):  
Composite Materials ◽  
Thermal Resistance ◽  
Interplanar Spacing ◽  
Graphene Nanoribbons ◽  
Angular Displacement ◽  
Filler Loading ◽  
Interfacial Thermal Resistance ◽  
Geometrical Parameters ◽  
Thermal Transfer ◽  
The Impact

Because of their high thermal conductivity, graphene nanoribbons (GNRs) can be employed as fillers to enhance the thermal transfer properties of composite materials, such as polymer-based ones. However, when the filler loading is higher than the geometric percolation threshold, the interfacial thermal resistance between adjacent GNRs may significantly limit the overall thermal transfer through a network of fillers. In this article, reverse non-equilibrium molecular dynamics is used to investigate the impact of the relative orientation (i.e., horizontal and vertical overlap, interplanar spacing and angular displacement) of couples of GNRs on their interfacial thermal resistance. Based on the simulation results, we propose an empirical correlation between the thermal resistance at the interface of adjacent GNRs and their main geometrical parameters, namely the normalized projected overlap and average interplanar spacing. The reported correlation can be beneficial for speeding up bottom-up approaches to the multiscale analysis of the thermal properties of composite materials, particularly when thermally conductive fillers create percolating pathways.

System Level Thermal Performance Evaluation of New Inverted Exposed Pad Packages for Automotive Applications

2006 ◽  
Author(s):  
Victor Adrian Chiriac ◽  
Tien-Yu Tom Lee
Keyword(s):  
Thermal Resistance ◽  
Thermal Performance ◽  
Peak Temperature ◽  
System Level ◽  
Total Power ◽  
Automotive Applications ◽  
Typical Application ◽  
Cu Alloy ◽  
Die Attach ◽  
The Impact

An extensive 3-D conjugate numerical study is conducted to assess the thermal performance of the novel 54 lead SOIC (with inverted exposed Cu pad) packages for automotive applications. The thermal performance of the modified designs with exposed pad are investigated, ranging from smaller die/flag size to larger ones, with single or multiple heat sources operating under various powering conditions. The thermal performance is compared to other existing packages with typical application to the automotive industry. The impact of the lead frame geometrical structure and die attach material on the overall thermal behavior is evaluated. Under one steady state (4W) operating scenario, the package reaches a peak temperature of 117.1°C, corresponding to a junction-to-heatsink thermal resistance Rjhs of 4.27°C/W. For the design with a slightly smaller Cu alloy exposed pad (Cu Alloy), the peak temperature reached by the FETs is 117.8°C, slightly higher than for the design with the intermediate size flag. In this case, the junction-to-heatsink thermal resistance Rj-hs is 4.45°C/W. The worst case powering scenario is identified, with 1.312W/FET and total power of 10.5W, barely satisfying the overall thermal budget. The variation of the peak (junction) temperature is also evaluated for several powering scenarios. Finally, a comparison with a different exposed pad package is made. The impact of the higher thermal conductivity (solder) die attach is evaluated and compared to the epoxy die attach in the 54 lead SOIC package. Several cases are evaluated in the paper, with an emphasis on the superior thermal performance of new packages for automotive applications.

Causes of Degradation of Thermal Performance of Ball Grid Arrays After Thermal Cycling

2007 ◽  
Author(s):  
Roy W. Knight ◽  
Yasser Elkady ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Solder Joint ◽  
Thermal Resistance ◽  
Thermal Cycling ◽  
Thermal Performance ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Element Analysis ◽  
Solder Balls ◽  
Ball Grid Array Packages ◽  
The Impact

The thermal performance of Ball Grid Array packages depends upon many parameters including die size, use of thermal balls, number of perimeter balls, use of underfill, and printed circuit board heat spreader and thermal via design. Thermal cycling can affect the integrity of thermal paths in and around the BGA as a result of the cracking of solder balls and delamination of the package, including at underfill interfaces. In this study, the impact of thermal cycling on the thermal performance of BGA’s was investigated and quantified. A number of test boards which included a range of the parameters cited above were experimentally examined. A baseline thermal resistance was measured for each case, which was verified with numerical thermal modeling. The boards were then subjected to thermal cycling from −40°C to 125°C. Every 250 cycles the thermal performance was measured. Packages expected to be least reliable (with large die and no underfill), showed an increase in thermal resistance after 750 thermal cycles. Further increases in thermal resistance were observed with continuous thermal cycling until solder joint failure occurred at 1250 cycles, preventing additional measurements. Finite element analysis identified critical thermal and perimeter solder balls as the most likely sites for cracking. Boards were cross-sectioned and examined for solder joint cracks and delamination to identify the cause for the observed increases in thermal resistance. Cracking was found in the critical thermal and perimeter solder balls.

scholarly journals Thermal Performance Analyses of Multiborehole Ground Heat Exchangers

Geofluids ◽  
2017 ◽  
Vol 2017 ◽  
pp. 1-11
Author(s):  
Wanjing Luo ◽  
Changfu Tang ◽  
Yin Feng ◽  
Pu Miao
Keyword(s):  
Thermal Performance ◽  
Heat Exchangers ◽  
Geothermal Energy ◽  
Greenhouse Gas Emission ◽  
Energy Resource ◽  
Thermal Dissipation ◽  
Uniform Heat Flux ◽  
Fluid Temperature ◽  
Cooling Mode ◽  
Ground Heat Exchangers

Geothermal energy known as a clean, renewable energy resource is widely available and reliable. Ground heat exchangers (GHEs) can assist the development of geothermal energy by reducing the capital cost and greenhouse gas emission. In this paper, a novel semianalytical method was developed to study the thermal performance of multiborehole ground heat exchangers (GHEs) with arbitrary configurations. By assuming a uniform inlet fluid temperature (UIFT), instead of uniform heat flux (UHF), the effects of thermal interference and the thermal performance difference between different boreholes can be examined. Simulation results indicate that the monthly average outlet fluid temperatures of GHEs will increase gradually while the annual cooling load of the GHEs is greater than the annual heating load. Besides, two mechanisms, the thermal dissipation and the heat storage effect, will determine the heat transfer underground, which can be further divided into four stages. Moreover, some boreholes will be malfunctioned; that is, boreholes can absorb heat from ground when the GHEs are under the cooling mode. However, as indicated by further investigations, this malfunction can be avoided by increasing borehole spacing.

Optimization of Pass Design of Bidirectional Thermal-Insulation Bricks

2014 ◽  
Vol 1008-1009 ◽  
pp. 1348-1351
Author(s):  
Sha Sha Dong ◽  
Xiao Ping Feng
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Insulation ◽  
Thermal Performance ◽  
Element Model ◽  
Two Dimensional ◽  
Pass Design ◽  
Dimensional Finite Element ◽  
The Impact ◽  
Better Than

The thermal performance of perforated brick is affected by various factors, thermal conductivity, the holes rates, the pass design and etc. included. In order to analyze the impact of the pass design on the thermal performance of bidirectional thermal insulation bricks, the two-dimensional finite element model was developed using ANSYS. The simulated result shows that existence of vertical holes can enhance the thermal resistance in the longer dimension of the perforated brick. Under the condition of the same holes rates, narrowing the width of the vertical holes helps to improve the thermal resistance in the shorter dimension of the perforated brick. The function of these blocks are extremely influenced by the distribution of the vertical holes, the concentrated better than the both-sided when it comes to advancing the whole function.

scholarly journals Nanofluid suspensions as heat carrier fluids in single U-tube borehole heat exchangers

2021 ◽  
Vol 2116 (1) ◽  
pp. 012100
Author(s):  
A Jahanbin ◽  
G Semprini ◽  
B Pulvirenti
Keyword(s):  
Thermal Resistance ◽  
Heat Carrier ◽  
Thermal Performance ◽  
Heat Exchangers ◽  
Borehole Heat Exchanger ◽  
Carrier Fluid ◽  
Improve Energy Efficiency ◽  
Ground Source ◽  
Borehole Thermal Resistance ◽  
Borehole Heat Exchangers

Abstract The borehole heat exchanger (BHE) is a critical component to improve energy efficiency and decreasing environmental impact of ground-source heat pump systems. The lower thermal resistance of the BHE results in the better thermal performance and/or in the lower required borehole length. In the present study, effects of employing a nanofluid suspension as a heat carrier fluid on the borehole thermal resistance are examined. A 3D transient finite element code is adopted to evaluate thermal comportment of nanofluids with various concentrations in single U-tube borehole heat exchangers and to compare their performance with the conventional circuit fluid. The results show, in presence of nanoparticles, the borehole thermal resistance is reduced to some extent and the BHE renders a better thermal performance. It is also revealed that employing nanoparticle fractions between 0.5% and 2 % are advantageous in order to have an optimal decrement percentage of the thermal resistance.

Sign in / Sign up

Export Citation Format

Share Document