scholarly journals A New Physical Design Flow for a Selective State Retention Based Approach

2021 ◽  
Vol 11 (3) ◽  
pp. 35
Author(s):  
Joseph Rabinowicz ◽  
Shlomo Greenberg

This research presents a novel approach for physical design implementation aimed for a System on Chip (SoC) based on Selective State Retention techniques. Leakage current has become a dominant factor in Very Large Scale Integration (VLSI) design. Power Gating (PG) techniques were first developed to mitigate these leakage currents, but they result in longer SoC wake-up periods due to loss of state. The common State Retention Power Gating (SRPG) approach was developed to overcome the PG technique’s loss of state drawback. However, SRPG resulted in a costly expense of die area overhead due to the additional state retention logic required to keep the design state when power is gated. Moreover, the physical design implementation of SRPG presents additional wiring due to the extra power supply network and power-gating controls for the state retention logic. This results in increased implementation complexity for the physical design tools, and therefore increases runtime and limits the ability to handle large designs. Recently published works on Selective State Retention Power Gating (SSRPG) techniques allow reducing the total amount of retention logic and their leakage currents. Although the SSRPG approach mitigates the overhead area and power limitations of the conventional SRPG technique, still both SRPG and SSRPG approaches require a similar extra power grid network for the retention cells, and the effect of the selective approach on the complexity of the physical design has not been yet investigated. Therefore, this paper introduces further analysis of the physical design flow for the SSRPG design, which is required for optimal cell placement and power grid allocation. This significantly increases the potential routing area, which directly improves the convergence time of the Place and Route tools.

2018 ◽  
Vol 2018 (HiTEC) ◽  
pp. 000064-000070
Author(s):  
N. Chiolino ◽  
A. M. Francis ◽  
J. Holmes ◽  
M. Barlow

Abstract Advancements in Silicon Carbide (SiC) digital integrated circuit (IC) design have enabled the ability to design complex, dense, digital blocks. Because of the large number of transistors, these complex digital designs make the time and risk of hand-crafted digital design, which has been the norm for SiC, too costly and risky. For large scale integrated digital circuits, computer aided design (CAD) tools are necessary, specifically the use of automatic synthesis, rule-based placement and signal routing software. The tools are used in progression as a design flow and are necessary for the timely and accurate creation of high-density digital designs. Application of an automated digital design flow to high-temperature SiC processes presents new challenges, such as extraction of timing characteristics at high temperatures, specifically above 400°C, as well as managing the complexity of synthesis, optimization of cell placement, verification of timing enclosure, and identifying routing constraints. These activities all require a willingness to extend and enhance the CAD software. Presented is a high temperature SiC digital synthesis flow. This flow is fully integrated with the characterization of a standard cell library that considers the variation of voltage, temperature, and process characteristics. A digital controller for a 10,000-pixel UV focal plan array (FPA) in a SiC CMOS process was designed using this high temperature digital flow. The controller is comprised of a finite state machine (FSM), that monitors several counters, shift registers and combinational logic feedback signals. The FSM is configured to optimize the FPA for different applications and exposures. The Register-Transfer Level (RTL) design of the FSM produces between 900 and 1,000 gates, depending on the temperature-dependent time closure with a total footprint of 14mm2. Typical SiC processes present a non-monotonic clock speed over temperature. The advantage of this digital design flow is that it allows the designer to target a temperature corner for the netlist design but verify its operation over a > 400°C operating range. This flow is currently being enhanced for use with NASA's SiC JFET-R process to create a high temperature communication protocol interface.


2021 ◽  
Vol 26 (5) ◽  
pp. 1-25
Author(s):  
Heechun Park ◽  
Bon Woong Ku ◽  
Kyungwook Chang ◽  
Da Eun Shim ◽  
Sung Kyu Lim

Studies have shown that monolithic 3D ( M3D ) ICs outperform the existing through-silicon-via ( TSV ) -based 3D ICs in terms of power, performance, and area ( PPA ) metrics, primarily due to the orders of magnitude denser vertical interconnections offered by the nano-scale monolithic inter-tier vias. In order to facilitate faster industry adoption of the M3D technologies, physical design tools and methodologies are essential. Recent academic efforts in developing an EDA algorithm for 3D ICs, mainly targeting placement using TSVs, are inadequate to provide commercial-quality GDS layouts. Lately, pseudo-3D approaches have been devised, which utilize commercial 2D IC EDA engines with tricks that help them operate as an efficient 3D IC CAD tool. In this article, we provide thorough discussions and fair comparisons (both qualitative and quantitative) of the state-of-the-art pseudo-3D design flows, with analysis of limitations in each design flow and solutions to improve their PPA metrics. Moreover, we suggest a hybrid pseudo-3D design flow that achieves both benefits. Our enhancements and the inter-mixed design flow, provide up to an additional 26% wirelength, 10% power consumption, and 23% of power-delay-product improvements.


2021 ◽  
pp. 0958305X2110148
Author(s):  
Mojtaba Shivaie ◽  
Mohammad Kiani-Moghaddam ◽  
Philip D Weinsier

In this study, a new bilateral equilibrium model was developed for the optimal bidding strategy of both price-taker generation companies (GenCos) and distribution companies (DisCos) that participate in a joint day-ahead energy and reserve electricity market. This model, from a new perspective, simultaneously takes into account such techno-economic-environmental measures as market power, security constraints, and environmental and loss considerations. The mathematical formulation of this new model, therefore, falls into a nonlinear, two-level optimization problem. The upper-level problem maximizes the quadratic profit functions of the GenCos and DisCos under incomplete information and passes the obtained optimal bidding strategies to the lower-level problem that clears a joint day-ahead energy and reserve electricity market. A locational marginal pricing mechanism was also considered for settling the electricity market. To solve this newly developed model, a competent multi-computational-stage, multi-dimensional, multiple-homogeneous enhanced melody search algorithm (MMM-EMSA), referred to as a symphony orchestra search algorithm (SOSA), was employed. Case studies using the IEEE 118-bus test system—a part of the American electrical power grid in the Midwestern U.S.—are provided in this paper in order to illustrate the effectiveness and capability of the model on a large-scale power grid. According to the simulation results, several conclusions can be drawn when comparing the unilateral bidding strategy: the competition among GenCos and DisCos facilitates; the improved performance of the electricity market; mitigation of the polluting atmospheric emission levels; and, the increase in total profits of the GenCos and DisCos.


2008 ◽  
Vol 17 (03) ◽  
pp. 439-446
Author(s):  
HAOHANG SU ◽  
YIMEN ZHANG ◽  
YUMING ZHANG ◽  
JINCAI MAN

An improved method is proposed based on compressed and Krylov-subspace iterative approaches to perform efficient static and transient simulations for large-scale power grid circuits. It is implemented with CG and BiCGStab algorithms and an excellent result has been obtained. Extensive experimental results on large-scale power grid circuits show that the present method is over 200 times faster than SPICE3 and around 10–20 times faster than ICCG method in transient simulations. Furthermore, the presented algorithm saves the memory usage over 95% of SPICE3 and 75% of ICCG method, respectively while the accuracy is not compromised.


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