scholarly journals Aluminum/Stainless Steel Clad Materials Fabricated via Spark Plasma Sintering

Materials ◽  
2020 ◽  
Vol 13 (1) ◽  
pp. 239 ◽  
Author(s):  
Kwangjae Park ◽  
Dasom Kim ◽  
Kyungju Kim ◽  
Hansang Kwon
Keyword(s):  
Thermal Conductivity ◽  
Stainless Steel ◽  
Thermal Expansion ◽  
Spark Plasma Sintering ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
Laser Flash ◽  
High Heat ◽  
Plasma Sintering ◽  
Spark Plasma

Aluminum (Al)/stainless steel (SUS) clad materials were fabricated via the process of spark plasma sintering (SPS) using Al powder/bulk and an SUS sheet. Three Al/SUS clad types were fabricated: powder/bulk (P/B), bulk/bulk (B/B), and bulk/powder/bulk (B/P/B). During the SPS, Al and SUS reacted with each other, and intermetallic compounds were created in the clads. The thermal conductivity and thermal-expansion coefficient were measured using a laser flash analyzer and dynamic mechanical analyzer, respectively. The Al/SUS (P/B) clad had a thermal conductivity of 159.5 W/mK and coefficient of thermal expansion of 15.3 × 10−6/°C. To analyze the mechanical properties, Vickers hardness and three-point bending tests were conducted. The Al/SUS (P/B) clad had a flexural strength of about 204 MPa. The Al/SUS clads fabricated via SPS in this study are suitable for use in applications in various engineering fields requiring materials with high heat dissipation and high heat resistance.

Effects of Particle Size on Microstructures and Properties of Si/Al Composites

2013 ◽  
Vol 873 ◽  
pp. 361-365 ◽  
Author(s):  
Wei Chen Zhai ◽  
Zhao Hui Zhang ◽  
Fu Chi Wang ◽  
Shu Kui Li
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Thermal Expansion ◽  
Flexural Strength ◽  
Spark Plasma Sintering ◽  
Thermal Conductivity Coefficient ◽  
Coefficient Of Thermal Expansion ◽  
High Strength ◽  
Plasma Sintering ◽  
Spark Plasma

Si/Al composites with different Si particle sizes were fabricated using spark plasma sintering process for electronic packaging. The density, thermal conductivity, coefficient of thermal expansion and flexural strength of the composites were investigated. Effect of Si particle size on structure and properties of the Si/Al composites were studied. The results showed that the Si/Al composites synthesized by spark plasma sintering were composed of Si and Al. Al was uniformly distributed among the Si phase, leading to a high thermal conductivity (>120 W/m·k). The relative density of the Si/Al composites decreased with increasing Si particle size. Small Si particle size produced small grains, leading to a low coefficient of thermal expansion and a high strength. There is an optimal matching among the thermal conductivity, coefficient of thermal expansion and flexural strength when the Si particle size was 44 um.

Characterizations and Evaluations on the Bonding Quality of Molybdenum Disilicides

2011 ◽  
Vol 56 (4) ◽  
pp. 1271-1276 ◽  
Author(s):  
L. Lu ◽  
W. Qin
Keyword(s):  
Stainless Steel ◽  
Thermal Expansion ◽  
Residual Stresses ◽  
Spark Plasma Sintering ◽  
316L Stainless Steel ◽  
Coefficient Of Thermal Expansion ◽  
Bonding Quality ◽  
Plasma Sintering ◽  
Spark Plasma

Characterizations and Evaluations on the Bonding Quality of Molybdenum DisilicidesIn this study, we proposed a new method using the spark plasma sintering technique to bond ceramics to alloys. MoSi2and 316L stainless steel were chosen as sample materials and can be welded well with graded interlayers. We found that dense uniformed bondings were achieved because of the comparable coefficient of thermal expansion of the interlayers. Furthermore, such a compatibility between the graded interlayers prevented MoSi2with low toughness from the occurrence of microcracks resulted from the residual stresses formed during cooling of the bondings.

Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix-Composites Fabricated by Spark Plasma Sintering (SPS)

2010 ◽  
Vol 638-642 ◽  
pp. 2115-2120 ◽  
Author(s):  
Kiyoshi Mizuuchi ◽  
Kanryu Inoue ◽  
Yasuyuki Agari ◽  
Shinji Yamada ◽  
Motohiro Tanaka ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Spark Plasma Sintering ◽  
Packing Density ◽  
Coefficient Of Thermal Expansion ◽  
Diamond Particle ◽  
Holding Time ◽  
Matrix Composites ◽  
Plasma Sintering ◽  
Spark Plasma

Diamond-particle-dispersed copper (Cu) matrix composites were fabricated from Cu-coated diamond particles by spark plasma sintering (SPS) process, and the microstructure and thermal properties of the composites fabricated were examined. These composites can well be consolidated in a temperature range between 973K and 1173K and scanning electron microscopy detects no reaction at the interface between the diamond particle and the Cu matrix. The relative packing density of the diamond-Cu composite increases with increasing sintering temperature and holding time, reaching 99.2% when sintered at a temperature of 1173K for a holding time of 2.1ks. Thermal conductivity of the diamond-Cu composite containing 43.2 vol. % diamond increases with increasing relative packing density, reaching a maximum (654W/mK) at a relative packing density of 99.2%. This thermal conductivity is 83% the theoretical value estimated by Maxwell-Eucken equation. The coefficient of thermal expansion of the composites falls in the upper line of Kerner’s model, indicating strong bonding between the diamond particle and the Cu matrix in the composite.

scholarly journals Effects of theTiB2-SiC Volume Ratio and Spark Plasma Sintering Temperature on the Properties and Microstructure of TiB2-BN-SiC Composite Ceramics

Crystals ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 29
Author(s):  
Shi Tian ◽  
Zelin Liao ◽  
Wenchao Guo ◽  
Qianglong He ◽  
Heng Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
High Temperature ◽  
Spark Plasma Sintering ◽  
Sintering Temperature ◽  
Volume Ratio ◽  
Expansion Rate ◽  
Composite Ceramics ◽  
Plasma Sintering ◽  
Spark Plasma

TiB2-BN composite ceramics combine excellent electrical conductivity, thermal shock resistance, high-temperature resistance, corrosion resistance, and easy processing of TiB2 and BN. However, in practical applications, their high-temperature oxidation resistance is poor and the resistivity distribution is uneven and changes substantially with temperature. A TiB2-BN-SiC composite ceramic with stable and controllable resistivity was prepared by introducing SiC into the TiB2-BN composite ceramics. In this work, spark plasma sintering (SPS) technology was used to prepare TiB2-BN-SiC composite ceramics with various TiB2-SiC ratios and sintering temperatures. The samples were tested by XRD, SEM, and thermal and mechanical analysis. The results show that as the volume ratio of TiB2-SiC was increased from 3:1 to 12:1, the resistivity of the sample decreased from 8053.3 to 4923.3 μΩ·cm, the thermal conductivity increased from 24.89 to 34.15 W/(m k), and the thermal expansion rate increased from 7.49 (10−6/K) to 10.81 (10−6/K). As the sintering temperature was increased from 1650 to 1950 °C, the density of the sample increased, the mechanical properties were slightly improved, and the resistivity, thermal expansion rate, and thermal conductivity changed substantially. The volume ratio and sintering temperature are the key factors that control the resistivity and thermal characteristics of TiB2-SiC-BN composite ceramics, and the in situ from liquid phases of FeB and FeO also promotes the sintering of the TiB2-BN-SiC ceramics.

Preparation of Graphene Nanosheets/Copper Composite by Spark Plasma Sintering

2013 ◽  
Vol 833 ◽  
pp. 276-279 ◽  
Author(s):  
Dong Qu ◽  
Fang Zhi Li ◽  
Hai Bin Zhang ◽  
Qian Wang ◽  
Tian Liang Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
Spark Plasma Sintering ◽  
Graphene Nanosheets ◽  
Physical Property Measurement System ◽  
Physical Property ◽  
Laser Flash ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Copper Composite

Graphene nanosheets (GNS)/copper composite has been prepared by spark plasma sintering (SPS). Microstructure of the sintered composite was characterized using scanning electron microscopy (SEM). Thermal conductivity and electrical resistivity properties are evaluated through laser flash apparatus and physical property measurement system. The obtained GNS/copper composite shows a layered structure. The GNS/copper composite prepared by SPS have an anisotropy of thermal conductivity and electrical resistivity.

Preparation and Characterisation of Gd2Zr2O7 Ceramic by Spark Plasma Sintering

2007 ◽  
Vol 280-283 ◽  
pp. 1507-1510 ◽  
Author(s):  
Qiang Xu ◽  
Wei Pan ◽  
Jing Dong Wang ◽  
Long Hao Qi ◽  
He Zhuo Miao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Relative Density ◽  
Spark Plasma Sintering ◽  
Microstructural Characterization ◽  
Laser Flash ◽  
Flash Method ◽  
Immersion Medium ◽  
Air Atmosphere ◽  
Plasma Sintering ◽  
Spark Plasma

Rare earth Gd2Zr2O7 ceramic was prepared by spark plasma sintering from Gd2O3 and ZrO2 powders. The powders were sintered at 1400°C for 10min. The synthesized ceramic was annealed at 800°C for 2h under air atmosphere. XRD structural and SEM microstructural characterization showed the formation of a single phase material with pyrochlore crystal structure. The relative density of Gd2Zr2O7 ceramic was measured by the Archimedes method with an immersion medium of water and the results revealed that the relative density of the ceramic was 92%. The thermal conductivity of the ceramic was tested by laser flash method from room temperature to 700°C. The result shows the thermal conductivity of Gd2Zr2O7 ceramic is lower than that of 7YSZ.

Thermoelectric properties of synthesized Mg2Si0.95-xGe0.05Sbx by spark plasma sintering

2015 ◽  
Vol 1735 ◽  
Author(s):  
Asumi Sasaki ◽  
Koya Arai ◽  
Yuto Kimori ◽  
Tomoyuki Nakamura ◽  
Kenjiro Fujimoto ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Carrier Concentration ◽  
Spark Plasma Sintering ◽  
Phonon Scattering ◽  
Laser Flash ◽  
Magnesium Silicide ◽  
X Ray ◽  
Plasma Sintering ◽  
Spark Plasma

AbstractMagnesium silicide (Mg2Si) has attracted much interest as an n-type thermoelectric material because it is eco-friendly, non-toxic, light, and relatively abundant compared with other thermoelectric materials. In this study, we tried to improve the thermoelectric performance by doping Sb and Ge in the Mg2Si, as well as further optimizing x in the carrier concentration to cause phonon scattering. A high purity Mg2Si was synthesized from metal Mg and Sb doped Si-Ge alloy by using spark plasma sintering (SPS) equipment. The sintered samples were cut and polished. They were evaluated by using X-ray diffraction (XRD) and X-ray fluorescence (XRF) analyses. The carrier concentration of the samples was measured by using Hall measurement equipment. The electrical conductivity and Seebeck coefficient were measured by using a standard four-probe method in a He atmosphere. The thermal conductivity was measured by using a laser-flash system. We succeeded in obtaining a Sb doped Mg2Si0.95Ge0.05 sintered body easily without any impurities with the SPS equipment. The electrical conductivity of the sample was increased, and thermal conductivity was decreased by increasing the amount of doped Sb. The dimensionless figure of merit ZT became 0.74 at 733 K in the Mg2Si0.95-xGe0.05Sbx sample with x = 0.0022.

Microstructure and thermal properties of nickel-coated carbon fibers/aluminum composites

2020 ◽  
Vol 54 (19) ◽  
pp. 2539-2548
Author(s):  
Li-Fu Yi ◽  
Takashi Yamamoto ◽  
Tetsuhiko Onda ◽  
Zhong-Chun Chen
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Spark Plasma Sintering ◽  
Carbon Fibers ◽  
Nickel Coating ◽  
Coefficient Of Thermal Expansion ◽  
Aluminum Composites ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Coated Carbon

Electroless nickel-coated carbon fibers/aluminum composites were prepared by spark plasma sintering, and the effect of nickel coating on microstructure and thermal properties of the composites has been investigated. Nickel coating on carbon fibers resulted in more homogeneous distributions of carbon fibers in aluminum matrix, higher relative density of carbon fibers/aluminum composites, and stronger interfacial bonding between carbon fibers and aluminum. Microstructural observations exhibited that the majority of carbon fibers were randomly distributed on the sections (X-Y direction) perpendicular to spark plasma sintering pressing direction (Z direction), thus leading to an anisotropic behavior in thermal conductivity of the composites. The thermal conductivity values in the X-Y direction of the carbon fibers/aluminum composites were much higher than those in the Z direction. As a result, the nickel-coated carbon fibers/aluminum composites with a nickel-coating thickness of ∼0.2 µm showed higher thermal conductivity and lower coefficient of thermal expansion values in comparison with those of the uncoated carbon fibers/aluminum samples.

Densification and Thermal Conductivity of Y2O3-Doped AlN Ceramics by Spark Plasma Sintering

2007 ◽  
Vol 352 ◽  
pp. 227-231 ◽  
Author(s):  
Qiang Shen ◽  
Z.D. Wei ◽  
Mei Juan Li ◽  
Lian Meng Zhang
Keyword(s):  
Thermal Conductivity ◽  
Grain Boundaries ◽  
Spark Plasma Sintering ◽  
Particle Surface ◽  
Boundary Phase ◽  
Homogeneous Microstructure ◽  
Densification Mechanism ◽  
Sintering Additive ◽  
Plasma Sintering ◽  
Spark Plasma

AlN ceramics doped with yttrium oxide (Y2O3) as the sintering additive were prepared via the spark plasma sintering (SPS) technique. The sintering behaviors and densification mechanism were mainly investigated. The results showed that Y2O3 addition could promote the AlN densification. Y2O3-doped AlN samples could be densified at low temperatures of 1600-1700oC in 20-25 minutes. The AlN samples were characterized with homogeneous microstructure. The Y-Al-O compounds were created on the grain boundaries due to the reactions between Y2O3 and Al2O3 on AlN particle surface. With increasing the sintering temperature, AlN grains grew up, and the location of grain boundaries as well as the phase compositions changed. The Y/Al ratio in the aluminates increased, from Y3Al5O12 to YAlO3 and to Y4Al2O9. High-density, the growth of AlN grains and the homogenous dispersion of boundary phase were helpful to improve the thermal conductivity of AlN ceramics. The thermal conductivity of 122Wm-1K-1 for the 4.0 mass%Y2O3-doped AlN sample was reached.

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