scholarly journals The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Materials ◽  
2020 ◽  
Vol 13 (19) ◽  
pp. 4443 ◽  
Author(s):  
Chaojun Li ◽  
Yanfu Yan ◽  
Tingting Gao ◽  
Guodong Xu
Keyword(s):  
Tensile Strength ◽  
High Temperature ◽  
Ultimate Tensile Strength ◽  
Mechanical Behavior ◽  
Melting Temperature ◽  
Solder Alloy ◽  
Testing Machine ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

To obtain Sn-3.0Ag-0.5Cu-xSb (x = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of IMC and refine the IMC layer. The addition of Sb significantly increased the melting temperature of the solder alloy. Among them, the thermal performance of Sn-3.0Ag-0.5Cu-25Sb is the best. The melting temperature of Sn-3.0Ag-0.5Cu-25Sb is 332.91 °C and the solid–liquid line range of Sn-3.0Ag-0.5Cu-25Sb solder alloy is 313.28–342.02 °C. Its pasty range is 28.74 °C, lower than 30 °C, which is beneficial for soldering. The test results of the mechanical behavior of Sn-3.0Ag-0.5Cu-xSb solder alloy show that with the increase of Sb addition, the ultimate tensile strength of the solder alloy also increases. However, the change of the elongation of the solder alloy is the opposite. The ultimate tensile strength of the solder alloy increased from 29.45 MPa of Sn-3.0Ag-0.5Cu solder to 70.81 MPa of Sn-3.0Ag-0.5Cu-31Sb solder. The reason for the increase in the strength of the solder alloy is the reduction of the thickness of IMC and the solid solution hardening effect of Sb.

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

2017 ◽  
Vol 751 ◽  
pp. 9-13
Author(s):  
Kogaew Inkong ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cooling Systems ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

2010 ◽  
Vol 650 ◽  
pp. 91-96 ◽  
Author(s):  
Ke Ke Zhang ◽  
Yao Li Wang ◽  
Yan Li Fan ◽  
Guo Ji Zhao ◽  
Yan Fu Yan ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Solder Alloy ◽  
Solder Joints ◽  
Rupture Life ◽  
Creep Rupture ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Properties ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effects of Ni on the properties of the Sn-2.5Ag-0.7Cu-0.1Re solder alloy and its creep properties of solder joints are researched. The results show that with adding 0.05wt% Ni in the Sn-2.5Ag-0.7Cu-0.1Re solder alloy, the elongation can be sharply improved without decreasing its tensile strength and it is 1.4 times higher than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. Accordingly the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints is the longest, which is 13.3 times longer than that of Sn-2.5Ag-0.7Cu-0.1Re and is also longer than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. In the same environmental conditions, the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints can sharply decrease with increasing the temperature and stress.

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

2008 ◽  
Vol 38 (2) ◽  
pp. 351-355 ◽  
Author(s):  
Chang Dong Zou ◽  
Yu Lai Gao ◽  
Bin Yang ◽  
Xin Zhi Xia ◽  
Qi Jie Zhai ◽  
...  
Keyword(s):  
Melting Temperature ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder ◽  
Temperature Depression ◽  
Melting Temperature Depression

Plate-like cell growth during directional solidification of a Zn–20wt%Sn high-temperature lead-free solder alloy

2014 ◽  
Vol 182 ◽  
pp. 29-36 ◽  
Author(s):  
Washington L.R. Santos ◽  
Crystopher Brito ◽  
José M.V. Quaresma ◽  
José E. Spinelli ◽  
Amauri Garcia
Keyword(s):  
High Temperature ◽  
Cell Growth ◽  
Directional Solidification ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy

2009 ◽  
Vol 484 (1-2) ◽  
pp. 777-781 ◽  
Author(s):  
Yulai Gao ◽  
Changdong Zou ◽  
Bin Yang ◽  
Qijie Zhai ◽  
Johan Liu ◽  
...  
Keyword(s):  
Melting Temperature ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snpb Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Bismuth-Antimony as an Alternative for High Temperature Lead Free Solder

2012 ◽  
Vol 476-478 ◽  
pp. 1163-1168 ◽  
Author(s):  
M.Z. Shahrul Fadzli ◽  
M.A. Azmah Hanim ◽  
T. Sai Hong ◽  
A. Aidy ◽  
R. Rohaizuan
Keyword(s):  
High Temperature ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Bulk Analysis ◽  
Rich Phase ◽  
Solder Bulk ◽  
Free Solder ◽  
Lead Free Solders

The development works on high temperature lead free solder are mostly discussed nowadays. To replace the current high temperature lead free solders, further research need to be done. A great deal of effort has been put into the development of lead free solder alloys. Bi (Bismuth) and Sb (Antimony) solder system proved as one of the promising candidates for electronic assembly. Melting temperature of three Bi-Sb solder alloys studied in this research enhanced their potential as the alternative solder candidates for high temperature lead free solder. At interface, Cu3Sb IMC layer was formed for 95Bi-5Sb solder alloy. Spallation of Cu3Sb IMC layer took placed with the results of Cu3Sb IMC also found in the solder bulk. Analysis of 97.5Bi-2.5Sb solder alloy classified as no metallurgical reaction at the interface and only the mechanical joining existed at the interface. The dissolution of Cu from subtrate affected the formation of Cu rich phase and the unstable Bi-Cu rich phase phenomena act as the isothermal product found in solder bulk. Mechanical grain boundary grooving observed in 98.5Bi-1.5Sb solder alloys at interface. Different compositions of Bi-Sb solder alloys resulted in different types of microstructures at interface and in solder bulk after reflow.

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