scholarly journals Electrochemical Corrosion of SAC Alloys: A Review

Metals ◽  
2020 ◽  
Vol 10 (10) ◽  
pp. 1276
Author(s):  
Ali Gharaibeh ◽  
Ilona Felhősi ◽  
Zsófia Keresztes ◽  
Gábor Harsányi ◽  
Balázs Illés ◽  
...  
Keyword(s):  
Electrochemical Impedance ◽  
Corrosion Behaviour ◽  
Electrochemical Techniques ◽  
Electrochemical Corrosion ◽  
Linear Sweep Voltammetry ◽  
Lead Free ◽  
Solder Alloys ◽  
Accelerated Corrosion ◽  
Manufacturing Technologies ◽  
Tin Silver Copper

Tin–silver–copper (SAC) solder alloys are the most promising candidates to replace Sn–Pb solder alloys. However, their application is still facing several challenges; one example is the electrochemical corrosion behaviour, which imposes a risk to electronics reliability. Numerous investigations have been carried out to evaluate the corrosion performance of SAC lead-free alloys, regarding the effect of the corrosive environment, the different manufacturing technologies, the effect of fluxes, the metallic contents within the SAC alloys themselves, and the different alloying elements. In these studies, widely used electrochemical techniques are applied as accelerated corrosion tests, such as linear sweep voltammetry and electrochemical impedance spectroscopy. However, there is lack of studies that try to summarise the various corrosion results in terms of lead-free solder alloys including low-Ag and composite solders. This study aims to review these studies by showing the most important highlights regarding the corrosion processes and the possible future developments.

scholarly journals Electrochemical Corrosion Behaviour of WE54 Magnesium Alloy

2013 ◽  
Vol 765 ◽  
pp. 644-647
Author(s):  
O. Kazum ◽  
Mathan Bobby Kannan ◽  
Nico Scharnagl ◽  
Carsten Blawert ◽  
Ying He He
Keyword(s):  
Magnesium Alloy ◽  
Electrochemical Impedance ◽  
Corrosion Behaviour ◽  
Electrochemical Techniques ◽  
Electrochemical Corrosion ◽  
Corrosion Current ◽  
Pure Magnesium ◽  
Pitting Corrosion Resistance ◽  
Electrochemical Corrosion Behaviour

The electrochemical corrosion behaviour of WE54 magnesium alloy in 0.5 wt.% NaCl solution was studied using electrochemical techniques. Polarization results suggested that the rare-earths in WE54 alloy enhanced the passivation tendency of the alloy and decreased the corrosion current by ~30% compared to pure magnesium. Pitting corrosion resistance was also higher in WE54 alloy than that in pure magnesium. Long-term electrochemical impedance results showed that the polarization resistance of WE54 alloy was more than two times higher than that of pure magnesium even after initial passivity breakdown.

scholarly journals Disposable Voltammetric Sensor Modified with Block Copolymer-Dispersed Graphene for Simultaneous Determination of Dopamine and Ascorbic Acid in Ex Vivo Mouse Brain Tissue

Biosensors ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 368
Author(s):  
Dinakaran Thirumalai ◽  
Seulah Lee ◽  
Minho Kwon ◽  
Hyun-jong Paik ◽  
Jaewon Lee ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Ascorbic Acid ◽  
Block Copolymer ◽  
Electrochemical Impedance ◽  
Ex Vivo ◽  
Electrochemical Techniques ◽  
Linear Sweep Voltammetry ◽  
Voltammetric Sensor ◽  
Peak Separation ◽  
Oxidation Potentials

Dopamine (DA) and ascorbic acid (AA) are two important biomarkers with similar oxidation potentials. To facilitate their simultaneous electrochemical detection, a new voltammetric sensor was developed by modifying a screen-printed carbon electrode (SPCE) with a newly synthesized block copolymer (poly(DMAEMA-b-styrene), PDbS) as a dispersant for reduced graphene oxide (rGO). The prepared PDbS–rGO and the modified SPCE were characterized using a range of physical and electrochemical techniques including Raman spectroscopy, scanning electron microscopy, transmission electron microscopy, cyclic voltammetry, electrochemical impedance spectroscopy, and linear sweep voltammetry. Compared to the bare SPCE, the PDbS–rGO-modified SPCE (PDbS–rGO/SPCE) showed better sensitivity and peak-to-peak separation for DA and AA in mixed solutions. Under the optimum conditions, the dynamic linear ranges for DA and AA were 0.1–300 and 10–1100 µM, and the detection limits were 0.134 and 0.88 µM (S/N = 3), respectively. Furthermore, PDbS–rGO/SPCE exhibited considerably enhanced anti-interference capability, high reproducibility, and storage stability for four weeks. The practical potential of the PDbS–rGO/SPCE sensor for measuring DA and AA was demonstrated using ex vivo brain tissues from a Parkinson’s disease mouse model and the control.

Characterisation of Reinforced BTSE Films Deposited on Anodized Aluminium Substrate

2018 ◽  
Vol 69 (11) ◽  
pp. 2964-2968
Author(s):  
Ioana Alina Ciobotaru ◽  
Oana Claudia Ciobotea Barbu ◽  
Florin Mihai Benga ◽  
Danut Ionel Vaireanu
Keyword(s):  
Electrochemical Impedance ◽  
Corrosion Behaviour ◽  
Substrate Surface ◽  
Electrochemical Techniques ◽  
Surface Characteristics ◽  
Open Circuit ◽  
Point Of View ◽  
Aluminium Substrate ◽  
Anodised Aluminium ◽  
Deposited Films

This paper discusses the improvements achieved in the anticorrosive properties of some silane films by pretreating the metallic substrate prior to films deposition and by reinforcement with some reinforcement agents. One has compared the behaviour of silane films, deposited on aluminium substrate, and the reinforced silane films deposited on anodised aluminium substrate. The use of scanning electron microscopy highlighted the modifications of substrate surface characteristics prior and after the anodisation process, while electrochemical techniques such as open circuit potential, electrochemical impedance spectroscopy and potentiodynamic polarization were employed in order to characterize the deposited films from the corrosion behaviour point of view.

scholarly journals Influence of Surface Finishing on Corrosion Behaviour of 3D Printed TiAlV Alloy

Metals ◽  
2020 ◽  
Vol 10 (11) ◽  
pp. 1547
Author(s):  
Jaroslav Fojt ◽  
Vojtěch Hybášek ◽  
Zdeněk Kačenka ◽  
Eva Průchová
Keyword(s):  
Corrosion Behavior ◽  
Electrochemical Impedance ◽  
Corrosion Behaviour ◽  
Electrochemical Techniques ◽  
Surface Treatments ◽  
Localized Corrosion ◽  
Surface Finishing ◽  
Complex Shapes ◽  
Melting Technique ◽  
3D Printed

Additive manufacturing is currently one of the promising methods for the fabrication of products of complex shapes. It is also used in medical applications, thanks to technological progress, which also enables the printing of metallic materials. However, the final products often have to undergo a final surface treatment. In this work, the influence of surface finishing on the corrosion behavior of the medical alloy Ti-6Al-4V prepared by the selective laser melting technique is studied. The samples were subjected to mechanical, chemical and electrochemical treatments. Corrosion behavior was investigated using DC and AC electrochemical techniques such as potentiodynamic and potentiostatic curves and electrochemical impedance spectroscopy. Furthermore, the influence of surface treatments on the possibility of localized corrosion attack was evaluated. The results showed that the surface treatments have a positive effect on the corrosion resistance and reduce the risk of crevice corrosion.

scholarly journals Corrosion Protection by Octadecylphosphonic Acid in Flow Conditions

2019 ◽  
Vol 33 (3) ◽  
pp. 395-403 ◽  
Author(s):  
Ekatarina Kristan Mioč ◽  
Helena Otmačić Ćurković
Keyword(s):  
Stainless Steel ◽  
Flow Rate ◽  
Natural Waters ◽  
Electrochemical Impedance ◽  
Corrosion Behaviour ◽  
Electrochemical Techniques ◽  
Corrosive Media ◽  
Copper Nickel ◽  
The Stability ◽  
Octadecylphosphonic Acid

The aim of this work was to examine the influence of the flow rate of corrosive media on the stability of self-assembled films of octadecylphosphonic acid on copper-nickel alloy and stainless steel. The studies were conducted in river and seawater in a laboratory scale flow system. Corrosion behaviour of protected and unprotected alloys was examined by electrochemical techniques, electrochemical impedance spectroscopy, and polarization measurements. The results show that octadecylphosphonic acid films can efficiently protect copper-nickel and stainless steel from corrosion in flowing natural waters. The flow of corrosive media had the highest influence on the stability of films on CuNi in seawater, while in all other studied cases, the protective properties of ODPA film changed insignificantly with the change of the flow rate.

scholarly journals A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

2019 ◽  
Vol 32 (2) ◽  
pp. 115-126 ◽  
Author(s):  
Muhammad Aamir ◽  
Riaz Muhammad ◽  
Majid Tolouei-Rad ◽  
Khaled Giasin ◽  
Vadim V. Silberschmidt
Keyword(s):  
Carbon Nanotubes ◽  
Good Alternative ◽  
Global Market ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Silver Copper ◽  
Free Solder ◽  
Tin Silver Copper

Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

scholarly journals Experimental and Theoretical Study of Corrosion Behaviour of Maraging Steel in 1 M HCl in Presence of 5-Methyl-4-[(E)-(thiophen-2-ylmethylidene)amino]-4H-1,2,4-triazole-3-thiol

2020 ◽  
Vol 32 (4) ◽  
pp. 845-852 ◽  
Author(s):  
R.N. Mary ◽  
R. Nazareth ◽  
P. Krishna Murthy ◽  
P.A. Suchetan
Keyword(s):  
Maraging Steel ◽  
Electrochemical Impedance ◽  
Corrosion Behaviour ◽  
Theoretical Calculations ◽  
Electrochemical Techniques ◽  
Activation Parameters ◽  
Dft Method ◽  
Basis Set ◽  
Inhibitor Molecule ◽  
Tafel Polarization

The inhibitory action of a synthesized Schiff base (5-methyl-4-[(E)-(thiophen-2-ylmethylidene)amino]-4H-1,2,4-triazole-3-thiol) [MTATT] on the corrosion behaviour of maraging steel in 1 M HCl was investigated by electrochemical techniques like Tafel polarization studies and electrochemical impedance spectroscopy. According to experimental data, inhibition efficiency increased with increase in temperature and concentration of the inhibitor where MTATT acts as a mixed type inhibitor. The mode of inhibitor adsorption on maraging steel follows Langmuir adsorption isotherm. The calculated thermodynamic and activation parameters suggested chemisorption mode of inhibitor adsorption. Scanning electron microscope technology with energy dispersive X-ray spectroscopy (SEM-EDX) studies confirmed the adsorption of inhibitor molecule on the surface of maraging steel. Several global reactivity parameters were calculated using DFT method at B3LYP/6-311++(d,p) basis set. Theoretical calculations are in good concurrence with the experimental results.

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