scholarly journals Improved Reliability and Mechanical Performance of Ag Microalloyed Sn58Bi Solder Alloys

Metals ◽  
2019 ◽  
Vol 9 (4) ◽  
pp. 462 ◽  
Author(s):  
Guang Ren ◽  
Maurice N. Collins
Keyword(s):  
Mechanical Properties ◽  
Mechanical Performance ◽  
Temperature Cycling ◽  
Time To Failure ◽  
Solder Alloys ◽  
Hardening Mechanism ◽  
Solder Microstructure ◽  
Free Solder ◽  
Board Level ◽  
Board Level Reliability

Ag microalloyed Sn58Bi has been investigated in this study as a Pb-free solder candidate to be used in modern electronics industry in order to cope with the increasing demands for low temperature soldering. Microstructural and mechanical properties of the eutectic Sn58Bi and microalloyed Sn57.6Bi0.4Ag solder alloys were compared. With the addition of Ag microalloy, the tensile strength was improved, and this was attributed to a combination of microstructure refinement and an Ag3Sn precipitation hardening mechanism. However, ductility was slightly deteriorated due to the brittle nature of the Ag3Sn intermetallic compounds (IMCs). Additionally, a board level reliability study of Ag microalloyed Sn58Bi solder joints produced utilizing a surface-mount technology (SMT) process, were assessed under accelerated temperature cycling (ATC) conditions. Results revealed that microalloyed Sn57.6Bi0.4Ag had a higher characteristic lifetime with a narrower failure distribution. This enhanced reliability corresponds with improved bulk mechanical properties. It is postulated that Ag3Sn IMCs are located at the Sn–Bi phase boundaries and suppress the solder microstructure from coarsening during the temperature cycling, hereby extending the time to failure.

scholarly journals Improved Reliability and Mechanical Performance of Sn58Bi Solder Alloys

2019 ◽  
Author(s):  
Guang Ren ◽  
Maurice N. Collins
Keyword(s):  
Mechanical Properties ◽  
Mechanical Performance ◽  
Temperature Cycling ◽  
Time To Failure ◽  
Solder Alloys ◽  
Hardening Mechanism ◽  
Solder Microstructure ◽  
Board Level ◽  
Board Level Reliability ◽  
Ag3sn Imcs

Abstract: Microstructural and mechanical properties of the eutectic Sn58Bi and micro-alloyed Sn57.6Bi0.4Ag solder alloys were compared. With the addition of Ag micro-alloy, the tensile strength was improved and this is attributed to a combination of microstructure refinement and an Ag3Sn precipitation hardening mechanism. However, ductility is slightly deteriorated due to the brittle nature of the Ag3Sn intermetallic compounds (IMCs). Additionally, a board level reliability study of Ag micro-alloyed Sn58Bi solder joints produced utilising a surface-mount technology (SMT) process, were assessed under accelerated temperature cycling (ATC) conditions. Results reveal that micro-alloyed Sn57.6Bi0.4Ag has a higher characteristic lifetime with a narrower failure distribution. This enhanced reliability corresponds with improved bulk mechanical properties. It is postulated that Ag3Sn IMCs are located at the Sn-Bi phase boundaries and suppress the solder microstructure from coarsening during the temperature cycling, hereby extending the time to failure.

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys

2017 ◽  
Vol 266 ◽  
pp. 196-200 ◽  
Author(s):  
Suchart Chantaramanee ◽  
Phairote Sungkhaphaitoon ◽  
Thawatchai Plookphol
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Vickers Microhardness ◽  
Lead Free ◽  
Mechanical And Thermal Properties ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Sac305 Solder ◽  
Percent Elongation ◽  
Free Solder

In this research, we investigated the influence of indium and antimony additions on the microstructure, mechanical and thermal properties of Sn-3.0Ag-0.5Cu lead free solder alloys. The results revealed that the addition of 0.5 wt.%InSb into SAC305 solder alloys resulted to a reduced melting temperature by 3.8 °C and IMCs phases formed new Ag3(Sn,In) and SnSb in the Sn-rich matrix with a decreased grain size of 28%. These phases improved the mechanical properties of solder alloys. In addition, the mechanical properties of SAC305 solder alloys increased by adding 0.5 wt.%InSb, resulting in an increase of ultimate tensile strength of 24%, but the percent elongation decreased to 45.8%. Furthermore, the Vickers microhardness slightly increased of the SAC305 solder alloys.

scholarly journals Evaluation of Mechanical Properties of Pb Free Solder Alloys.

1997 ◽  
Vol 12 (7) ◽  
pp. 503-506
Author(s):  
Kazuki TATEYAMA ◽  
Takashi EBISUYA ◽  
Hiroshi YAMADA ◽  
Kuniaki TAKAHASHI
Keyword(s):  
Mechanical Properties ◽  
Solder Alloys ◽  
Free Solder

Effect of Presence of Carbon Nanotubes on the Wettability and Mechanical Performance of Sn-Ag-Cu Solder

2005 ◽  
Author(s):  
S. M. L. Nai ◽  
J. Wei ◽  
Manoj Gupta
Keyword(s):  
Mechanical Properties ◽  
Carbon Nanotubes ◽  
Flip Chip ◽  
Composite Solder ◽  
Mechanical Performance ◽  
Melting Temperatures ◽  
Micron Size ◽  
Free Solder ◽  
Mechanical Properties Characterization ◽  
Made In

In this study, Sn-Ag-Cu based nanocomposites with carbon nanotubes (CNTs) as reinforcements were successfully synthesized using the powder metallurgy technique. Micron size lead-free solder particles were blended together with varying weight percentages of CNTs. Blended powder mixtures were then compacted, sintered and finally extruded at room temperature. The extruded materials were characterized for their melting temperatures, wettability and mechanical properties. Experimental results revealed that the melting temperatures of the composite solders did not have any significant changes. Wettability property of the composite solder was also found to improve with addition of reinforcements. Moreover, the results of mechanical properties characterization exhibited an increase in overall strength of the composite solders. An attempt is made in the present study to correlate the variation in weight percentages of reinforcement with the properties of the resultant nanocomposite materials. These advanced interconnect materials will benefit industries like the microelectronics flip chip assembly and packaging, MEMS systems and NEMS systems.

Real Time Synchrotron X-Ray Imaging for Nucleation and Growth of Cu6Sn5 in Sn-7Cu-0.05Ni High Temperature Lead-Free Solder Alloys

2012 ◽  
Vol 626 ◽  
pp. 200-204 ◽  
Author(s):  
Kazuhiro Nogita ◽  
Hideyuki Yasuda ◽  
Stuart D. McDonald ◽  
Kentaro Uesugi
Keyword(s):  
High Temperature ◽  
Real Time ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
X Ray ◽  
X Ray Imaging ◽  
Solder Microstructure ◽  
Free Solder ◽  
Solidification Pathway

This paper demonstrates how recent progress for real-time solidification observation at SPring-8 synchrotron has contributed to the development of Sn-7wt%Cu-0.05wt%Ni high temperature lead-free solder alloys. Lead-free solder alloys in the composition range Sn-0.7 to 7.6wt%Cu that consist of primary Cu6Sn5in a eutectic Sn-Cu6Sn5matrix have been proposed as solders for application at temperatures up to 400°C for the assembly high current semiconductors. It is shown that trace levels of Al have a marked effect on the solder microstructure and refine the size of the primary Cu6Sn5. The solidification pathway that leads to the refinement was observed in real-time using X-ray synchrotron observations.

Sign in / Sign up

Export Citation Format

Share Document