scholarly journals Evidence for Obliqueness of Angles as a Cue to Planar Surface Slant Found in Extremely Simple Symmetrical Shapes

Symmetry ◽  
2015 ◽  
Vol 7 (1) ◽  
pp. 241-254 ◽  
Author(s):  
Casper Erkelens
Keyword(s):  
Perception ◽  
1994 ◽  
Vol 23 (6) ◽  
pp. 645-658 ◽  
Author(s):  
Colin Ryan ◽  
Barbara Gillam

The way in which a planar surface is defined or configured may affect its apparent slant about a given axis, and the magnitude of slant-axis anisotropies. The authors have previously suggested that (i) these within-axis and between-axis configuration effects may be attributable, in part at least, to the perspective—disparity conflict generated when geometrically frontoparallel configured surfaces are slanted stereoscopically; and (ii) that implicit contours, defined by line endings or conjunctions, may have effects analogous to those seen with explicit contours. These possibilities were directly examined in two experiments. In experiment 1, slant-axis anisotropy was progressively induced by adding horizontal lines to a vertical-line (zero anisotropy) grid under conditions of cue conflict; slants about the vertical (but not the horizontal) were attenuated—demonstrating a clear and systematic nexus between surface configuration and slant-axis anisotropy. The presence of regular implicit horizontals similarly and selectively attenuated the slant perceived about the vertical. In experiment 2, cue conflict was seen to exacerbate slant-axis anisotropy, but clearly could not fully account for it. There was an axis asymmetry in the effect of degrading implicit contours: degradation had a marked impact on perceived slant about the horizontal but not the vertical axis.


2018 ◽  
Author(s):  
Sang Hoon Lee ◽  
Jeff Blackwood ◽  
Stacey Stone ◽  
Michael Schmidt ◽  
Mark Williamson ◽  
...  

Abstract The cross-sectional and planar analysis of current generation 3D device structures can be analyzed using a single Focused Ion Beam (FIB) mill. This is achieved using a diagonal milling technique that exposes a multilayer planar surface as well as the cross-section. this provides image data allowing for an efficient method to monitor the fabrication process and find device design errors. This process saves tremendous sample-to-data time, decreasing it from days to hours while still providing precise defect and structure data.


Author(s):  
D. Zudhistira ◽  
V. Viswanathan ◽  
V. Narang ◽  
J.M. Chin ◽  
S. Sharang ◽  
...  

Abstract Deprocessing is an essential step in the physical failure analysis of ICs. Typically, this is accomplished by techniques such as wet chemical methods, RIE, and mechanical manual polishing. Manual polishing suffers from highly non-uniform delayering particularly for sub 20nm technologies due to aggressive back-end-of-line scaling and porous ultra low-k dielectric films. Recently gas assisted Xe plasma FIB has demonstrated uniform delayering of the metal and dielectric layers, achieving a planar surface of heterogeneous materials. In this paper, the successful application of this technique to delayer sub-20 nm microprocessor chips with real defects to root cause the failure is presented.


10.1167/4.9.7 ◽  
2004 ◽  
Vol 4 (9) ◽  
pp. 7 ◽  
Author(s):  
Caterina Ripamonti ◽  
Marina Bloj ◽  
Robin Hauck ◽  
Kiran Mitha ◽  
Scott Greenwald ◽  
...  

2021 ◽  
Vol 180 ◽  
pp. 37-50
Author(s):  
Ross Goutcher ◽  
Laurie M. Wilcox
Keyword(s):  

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