Chip Warpage Damage Model for ACA Film Type Electronic Packages

2005 ◽  
pp. 887-892 ◽  
Author(s):  
Se Young Yang ◽  
Woon Seong Kwon ◽  
Soon Bok Lee ◽  
Kyoung Wook Paik
Keyword(s):  
Damage Model ◽  
Electronic Packages ◽  
Film Type

Chip Warpage Damage Model for ACA Film Type Electronic Packages

2005 ◽  
Vol 297-300 ◽  
pp. 887-892 ◽  
Author(s):  
Se Young Yang ◽  
Woon Seong Kwon ◽  
Soon Bok Lee ◽  
Kyoung Wook Paik
Keyword(s):  
Flip Chip ◽  
Damage Model ◽  
Critical Issue ◽  
Electrical Performance ◽  
Conductive Adhesives ◽  
Adhesive Film ◽  
Damage Level ◽  
Silicon Chips ◽  
Film Type ◽  
Performance Deterioration

The use of anisotropically conductive adhesives (ACA) for the direct interconnection of flipped silicon chips to printed circuits (flip chip packaging), offers numerous advantages such as reduced thickness, improved environmental compatibility, lowered assembly process temperature, increased metallization options, cut downed cost, and decreased equipment needs. Despite numerous benefits, ACA film type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. In this study, warpage of the chip is monitored by real time moiré interferometer during –50oC to +125oC temperature range. Moreover, reduction in chip warpage due to increase in delamination length is obtained as in function of thermal fatigue cycles. Finally, a new model to predict damage level of ACA package and remained life is proposed and developed.

Backside Application of Acoustic Micro Imaging (AMI) on Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) Packages

2004 ◽  
Author(s):  
Luis A. Curiel ◽  
Andrew J. Komrowski ◽  
Daniel J.D. Sullivan
Keyword(s):  
Ball Grid Array ◽  
Acoustic Microscopy ◽  
Electronic Packages ◽  
Nondestructive Technique ◽  
Molding Compound ◽  
Microscopy Technique ◽  
Plastic Ball ◽  
Die Surface ◽  
Plastic Ball Grid Array ◽  
Bond Pads

Abstract Acoustic Micro Imaging (AMI) is an established nondestructive technique for evaluation of electronic packages. Non-destructive evaluation of electronic packages is often a critical first step in the Failure Analysis (FA) process of semiconductor devices [1]. The molding compound to die surface interface of the Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) packages is an important interface to acquire for the FA process. Occasionally, with these packages, the standard acoustic microscopy technique fails to identify defects at the molding compound to die surface interface. The hard to identify defects are found at the edge of the die next to the bond pads or under the bonds wires. This paper will present a technique, Backside Acoustic Micro Imaging (BAMI) analysis, which can better resolve the molding compound to die surface interface at the die edge by sending the acoustic signal through the backside of the PBGA and PQFP packages.

Advanced Acoustic Micro Imaging Applications: Deciphering Multiple Acoustic Echoes and Reflections

2004 ◽  
Author(s):  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Daniel J. D. Sullivan ◽  
Quang Nguyen ◽  
Lisa Logan-Willams
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
New Technologies ◽  
Electronic Packages ◽  
Advanced Packaging ◽  
Ic Package ◽  
Non Destructive

Abstract The acquisition of reliable Acoustic Micro Images (AMI) are an essential non-destructive step in the Failure Analysis (FA) of electronic packages. Advanced packaging and new IC materials present challenges to the collection of reliable AMI signals. The AMI is complicated due to new technologies that utilize an increasing number of interfaces in ICs and packages. We present two case studies in which it is necessary to decipher the acoustic echoes from the signals generated by the interface of interest in order to acquire trustworthy information about the IC package.

X-Ray Tomography for Electronic Packages

2000 ◽  
Author(s):  
Deepak Goyal
Keyword(s):  
3D Imaging ◽  
Development Time ◽  
Analytical Techniques ◽  
Electronic Packages ◽  
X Ray ◽  
Imaging Capability ◽  
Imaging Results ◽  
Key Drivers ◽  
Analytical Tools ◽  
Non Destructive

Abstract Next generation assembly/package development challenges are primarily increased interconnect complexity and density with ever shorter development time. The results of this trend present some distinct challenges for the analytical tools/techniques to support this technical roadmap. The key challenge in the analytical tools/techniques is the development of non-destructive imaging for improved time to information. This paper will present the key drivers for the non-destructive imaging, results of literature search and evaluation of key analytical techniques currently available. Based on these studies requirements of a 3D imaging capability will be discussed. Critical breakthroughs required for development of such a capability are also summarized.

Why is it necessary to use a damage model to simulate the mechanical behavior of concrete under drying and leaching?

2010 ◽  
Vol 14 (6-7) ◽  
pp. 923-935
Author(s):  
Thomas Rougelot ◽  
Cheng Peng ◽  
Nicolas Burlion ◽  
Dominique Bernard
Keyword(s):  
Mechanical Behavior ◽  
Damage Model

scholarly journals A Novel Damage Model for Strata Layers and Coal Mass

Energies ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1928 ◽  
Author(s):  
Faham Tahmasebinia ◽  
Chengguo Zhang ◽  
Ismet Canbulat ◽  
Samad Sepasgozar ◽  
Serkan Saydam
Keyword(s):  
Constitutive Model ◽  
Strain Energy ◽  
Damage Model ◽  
Rock Joint ◽  
Coal Mass ◽  
Stored Energy ◽  
Rock Interaction ◽  
Geological Factors ◽  
Coal Rock ◽  
Joint Quality

Coal burst occurrences are affected by a range of mining and geological factors. Excessive slipping between the strata layers may release a considerable amount of strain energy, which can be destructive. A competent strata is also more vulnerable to riveting a large amount of strain energy. If the stored energy in the rigid roof reaches a certain level, it will be released suddenly which can create a serious dynamic reaction leading to coal burst incidents. In this paper, a new damage model based on the modified thermomechanical continuum constitutive model in coal mass and the contact layers between the rock and coal mass is proposed. The original continuum constitutive model was initially developed for the cemented granular materials. The application of the modified continuum constitutive model is the key aspect to understand the momentum energy between the coal–rock interactions. The transformed energy between the coal mass and different strata layers will be analytically demonstrated as a function of the rock/joint quality interaction conditions. The failure and post failure in the coal mass and coal–rock joint interaction will be classified by the coal mass crushing, coal–rock interaction damage and fragment reorganisation. The outcomes of this paper will help to forecast the possibility of the coal burst occurrence based on the interaction between the coal mass and the strata layers in a coal mine.

Ductile Crack Extension Analysis for X80 Bending Deformation Using Damage-Based Model

2014 ◽  
Author(s):  
Satoshi Igi ◽  
Mitsuru Ohata ◽  
Takahiro Sakimoto ◽  
Kenji Oi ◽  
Joe Kondo
Keyword(s):  
Plastic Strain ◽  
Simulation Model ◽  
Crack Growth ◽  
Crack Extension ◽  
Damage Model ◽  
Stress Triaxiality ◽  
Crack Growth Behavior ◽  
Ductile Crack ◽  
Ductile Crack Growth ◽  
Notch Tip

This paper presents experimental and analytical results focusing on the strain limit of X80 linepipe. Ductile crack growth behavior from a girth weld notch is simulated by FE analysis based on a proposed damage model and is compared with the experimental results. The simulation model for ductile crack growth accompanied by penetration through the wall thickness consists of two criteria. One is a criterion for ductile crack initiation from the notch-tip, which is described by the plastic strain at the notch tip, because the onset of ductile cracking can be expressed by constant plastic strain independent of the shape and size of the components and the loading mode. The other is a damage-based criterion for simulating ductile crack extension associated with damage evolution influenced by plastic strain in accordance with the stress triaxiality ahead of the extending crack tip. The proposed simulation model is applicable to prediction of ductile crack growth behaviors from a circumferentially-notched girth welded pipe with high internal pressure, which is subjected to tensile loading or bending (post-buckling) deformation.

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