Shear Ram Speed Characterization for Copper Wire Bond Shear Test

2012 ◽  
Vol 229-231 ◽  
pp. 670-673
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
A. H. M. Shapri ◽  
N. A. Z. Rahman ◽  
W.M.W. Norhaimi ◽  
...  
Keyword(s):  
Finite Element ◽  
Shear Test ◽  
Copper Wire ◽  
Preliminary Investigation ◽  
Von Mises Stress ◽  
Stress And Strain ◽  
Strain Response ◽  
Ball Bond ◽  
Wire Bond ◽  
Ram Speed

This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. The effects of the shear ram speed on the stress and strain response of the copper ball bond were investigated. A preliminary investigation confirms that shear ram speed has a significant effect on the von mises stress and equivalent strain response of the copper ball bond during wire bond shear test

Shear Ram Height Characterization for Copper Wire Bond Shear Test

2012 ◽  
Vol 229-231 ◽  
pp. 674-677 ◽  
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
A. H. M. Shapri ◽  
N. A. Z. Rahman ◽  
W.M.W. Norhaimi ◽  
...  
Keyword(s):  
Shear Test ◽  
Copper Wire ◽  
Equivalent Strain ◽  
Von Mises Stress ◽  
Stress And Strain ◽  
Strain Response ◽  
Element Analysis ◽  
Ball Bond ◽  
Wire Bond ◽  
Von Mises

The work here investigates the height effect during a shearing process of a copper ball bond in a wire bond. Finite element analysis was used to investigate this analysis.The effects of the shear ram height on the stress and strain response of the copper ball bond were investigated. The results obtained hows there is a significant effect of the shear height to the Von Mises stress and equivalent strain response to the copper ball bond during the shearing simulation.

Shear Ram Height Investigation for Gold Wire Bond Shear Test

2012 ◽  
Vol 622-623 ◽  
pp. 1447-1450 ◽  
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
A.H.M. Shapri ◽  
S. Taniselass ◽  
T.S. Ong
Keyword(s):  
Shear Test ◽  
Element Model ◽  
Gold Wire ◽  
Equivalent Strain ◽  
Von Mises Stress ◽  
Stress And Strain ◽  
Strain Response ◽  
Ball Bond ◽  
Wire Bond ◽  
Gold Ball

This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element model. The effects of the shear ram height on the stress and strain response of the gold ball bond were investigated. The results of the simulation confirms that shear ram height has a significant effect on the von mises stress and equivalent strain response of the gold ball bond during wire bond shear test.

Effects of Bond Pad Thickness on Shear Strength of Copper Wire Bonds

2017 ◽  
Vol 2017 (HiTEN) ◽  
pp. 000068-000073 ◽  
Author(s):  
Subramani Manoharan ◽  
Chandradip Patel ◽  
Stevan Hunter ◽  
Patrick McCluskey
Keyword(s):  
Shear Strength ◽  
Shear Test ◽  
Failure Modes ◽  
High Reliability ◽  
Copper Wire ◽  
Test Method ◽  
Ball Bond ◽  
Wire Bond ◽  
Industry Standards ◽  
Wire Bonds

Abstract Copper (Cu) wire bonding is now widely accepted as a replacement for gold (Au), however, its use in high reliability applications is limited due to early failures in high temperature and humid conditions. The Au to Cu wire transition is mainly driven by cost savings though there are other advantages to Cu such as better electrical and thermal conductivity, slower intermetallic compound (IMC) formation and reduced wire sweep during transfer molding. Some automotive, industrial and aerospace industries are still reluctant to adopt Cu wire bonded products due to perceived risks of wire and bond pad cracks, the potential for corrosion, and some lack of understanding about its reliability in harsh conditions. A wire bond is considered good if destructive sampling qualification tests and periodic monitors pass for the batch. Tests include wire pull strength, wire bond shear, IMC coverage, and thickness of bond pad aluminum (Al) remaining beneath the bond. Nondestructive inspections also verify acceptable ball diameter and Al “splash”. This paper focuses on the bond shear test and its contribution to Cu ball bond reliability assessment, especially when changing Al bond pad thickness. A new revision of the JEDEC Wire Bond Shear Test Method, JESD22-B116B, has just been released, to include Cu wirebonds for the first time. It helps to clarify shear test failure modes for Cu ball bonds. However, there are still questions to be answered through research and experimentation, especially to learn the extent to which one may predict Cu ball bond reliability based on shear test results. Pad Al thickness is not considered in the current industry standards for shear test. Yet bond pad Al thickness varies widely among semiconductor products. This research is intended to contribute toward improved industry standards. In this study, power and time bonding parameters along with bond pad thickness are studied for bond strength. Several wire bonds are created at different conditions, evaluated by optical microscope and SEM, IMC% coverage and bond shear strength. Similar bonding conditions are repeated for bond pads of 4um, 1um and 0.5um thickness.

scholarly journals Evaluation of Bone–Implant Interface Stress and Strain Using Heterogeneous Mandibular Bone Properties Based on Different Empirical Correlations

2021 ◽  
Author(s):  
Mostafa Omran Hussein ◽  
Mohammed Suliman Alruthea
Keyword(s):  
Finite Element ◽  
Group Iv ◽  
Von Mises Stress ◽  
Patient Specific ◽  
Dental Arch ◽  
Stress And Strain ◽  
Bone Implant ◽  
Bone Properties ◽  
Group I ◽  
Von Mises

Abstract Objective The purpose of this study was to compare methods used for calculating heterogeneous patient-specific bone properties used in finite element analysis (FEA), in the field of implant dentistry, with the method based on homogenous bone properties. Materials and Methods In this study, three-dimensional (3D) computed tomography data of an edentulous patient were processed to create a finite element model, and five identical 3D implant models were created and distributed throughout the dental arch. Based on the calculation methods used for bone material assignment, four groups—groups I to IV—were defined. Groups I to III relied on heterogeneous bone property assignment based on different equations, whereas group IV relied on homogenous bone properties. Finally, 150 N vertical and 60-degree-inclined forces were applied at the top of the implant abutments to calculate the von Mises stress and strain. Results Groups I and II presented the highest stress and strain values, respectively. Based on the implant location, differences were observed between the stress values of group I, II, and III compared with group IV; however, no clear order was noted. Accordingly, variable von Mises stress and strain reactions at the bone–implant interface were observed among the heterogeneous bone property groups when compared with the homogenous property group results at the same implant positions. Conclusion Although the use of heterogeneous bone properties as material assignments in FEA studies seem promising for patient-specific analysis, the variations between their results raise doubts about their reliability. The results were influenced by implants’ locations leading to misleading clinical simulations.

Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad

2012 ◽  
Vol 622-623 ◽  
pp. 647-651 ◽  
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
S. Taniselass ◽  
A.H.M. Shapri ◽  
R. Vairavan
Keyword(s):  
Stress Response ◽  
Shear Test ◽  
Copper Wire ◽  
Gold Wire ◽  
Shear Tests ◽  
Groove Surface ◽  
Wire Bond ◽  
Packaging Industry ◽  
Semiconductor Packaging ◽  
Surface Bond

Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.

The Optimization Design of Spindle Box for Large Friction Welder Based on the Sensitivity Analysis

2013 ◽  
Vol 655-657 ◽  
pp. 502-505
Author(s):  
Rui Cheng Feng ◽  
Hao Xu ◽  
Zhi Yuan Rui ◽  
Hai Yan Li ◽  
Bao Cheng Zhou
Keyword(s):  
Sensitivity Analysis ◽  
Finite Element ◽  
Static Analysis ◽  
Optimization Design ◽  
Simulation Software ◽  
Stress And Strain ◽  
Strain Response ◽  
Optimization Scheme ◽  
Element Simulation ◽  
Ansys Workbench

Focusing on the problem of accuracy machining to the friction welder,taking the spindle box of friction welder as the research object,the finite element simulation software of ANSYS workbench is applied to the static analysis of the box ,then the stress and strain response can be available. And through the using of sensitivity analysis optimization scheme is proposed ,which prerequisite basis is obtained for the optimization design and the improvement of breed to the spindle box of large friction welder

Basement Stretch and Ground Fissures Formation in Linfen Basin

2014 ◽  
Vol 711 ◽  
pp. 562-565 ◽  
Author(s):  
Ming Dong Zang ◽  
Ji Wei Xu ◽  
Ya Hong Deng ◽  
Jia He ◽  
Jian Wei Qiao ◽  
...  
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Tensile Deformation ◽  
Deep Structure ◽  
Stress And Strain ◽  
Strain Response ◽  
Fracture System ◽  
Ground Fissures ◽  
Response Characteristics ◽  
The World

The Linfen Basin can be the most developed area of ground fissures and the associated geo-hazard in China and even in the world. Taking the Linfen Basin as the prototype, a numerical analysis with finite element method is made to study the stress and strain response characteristics of superficial ground and multistage fracture system subjected to the action of basement stretching. The germination relationship between deep structure activities and ground fissures development is revealed. Results show that the basement stretching can cause the tensile deformation of superficial ground. When this kind of action is coupled with normal dip-slipping tension of faults, it can inevitably form or aggravate the tension-shear fracturing, and establish the tectonic foundation for the development of ground fissures.

Shear Ram Speed Analysis for Gold Wire Bond Shear Test

2013 ◽  
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Phaklen Ehkan ◽  
Nor Shakirina Nadzri
Keyword(s):  
Shear Test ◽  
Gold Wire ◽  
Wire Bond ◽  
Ram Speed

Finite Element Analysis of Copper Wire Bonding in Integrated Circuit Devices

2012 ◽  
Vol 566 ◽  
pp. 293-299 ◽  
Author(s):  
Nauman Dastgir ◽  
Pooria Pasbakhsh ◽  
Ning Qun Guo ◽  
Norhazlina Ismail ◽  
Kheng Lim Goh
Keyword(s):  
Finite Element ◽  
Integrated Circuit ◽  
Copper Wire ◽  
Bonding Temperature ◽  
Element Analysis ◽  
Appreciable Change ◽  
Bonding Force ◽  
Wire Bond ◽  
Aluminum Metallization ◽  
Induced Stresses

Axisymmetric finite element models of copper wire-bond-pad structure for an integrated circuit devicewere developed to investigate theeffects of bonding force, initial bonding temperature, Aluminum metallization thickness, bond pad thickness and free air ball (FAB) diameter on induced stresses in the wire-bond structure. The results show that an increase in bonding force greatly increased the induced stresses in the copper FAB and bond pad (aluminum and silicon). However, a change in bonding temperature while keeping the bonding force constant does not result in an appreciable change in the stress. Similarly an increase in aluminium metallization thickness does not yield appreciable variation in the stress and strain in the bond pad. Over the range of FAB diameters studied it is found that bigger FAB yields smaller stress in the overall structure

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