Study on the Preparation Technology of Fixed Abrasive Polishing Pad in Chemical Mechanical Polishing

2014 ◽  
Vol 602-605 ◽  
pp. 485-488
Author(s):  
Zhi Xiang Liu ◽  
Jian Guo Yao ◽  
Song Zhan Fan ◽  
Jian Xiu Su

According to the shortcomings of the traditional free abrasive chemical mechanical polishing (CMP), in recent years, the fixed abrasive chemical mechanical polishing (FA-CMP) technology is proposed. It is a new planarization technology developed on the basis of the traditional CMP. Pad is an important and dispensable part in FA-CMP. The cost and quality of FA-CMP pad are determined by the preparation technology. In order to study the FA-CMP pad of the low cost and high quality, in this paper, by reading a lot of literature, 5 kinds of preparation technology of FA-CMP pad are analyzed. Study results will provide some reference for further designing and manufacturing the FA-CMP pad.

2015 ◽  
Vol 727-728 ◽  
pp. 244-247
Author(s):  
Zhu Qing Zhang ◽  
Kang Lin Xing

Through experimental study on the role of the free abrasive in chemical mechanical polishing, in this paper, four different types of abrasive which were chosen were used for the research of material removal rate(MRR) and surface quality of SiC single crystal . Finally ,Diamond abrasive which is considered was the most suitable for chemical mechanical polishing(CMP) abrasive of SiC Crystal Substrate. With diamond Particle polish pad polishing, it is draw a comparison result on the influence of the free abrasive and consolidation abrasive for the material removal rate and surface quality of 6H-SiC. The results showed that: the MRR is 140nm / min, the material removal rate if fixed abrasive chemical mechanical polishing(FA-CMP) more than three times that of traditional CMP, fixed abrasive chemical mechanical polishing pad, are involved in a large proportion of micro abrasive cutting, can greatly improve the material removal efficiency. And results from the test procedure, the FA-CMP surface has scratches after more technical problems for the polishing pad, the surface damage is relatively free of abrasive chemical mechanical polishing is more serious.


Author(s):  
John M. Mackenzie

Over the past several years the capabilities of personal computers have advanced at a staggering rate. At the same time, the cost of the hardware has dropped to such a degree that one wonders whether such inexpensive hardware can perform adequately.The purpose of this discussion is to look at the minimum hardware necessary to do quality stereo imaging on CRT display devices and to discuss several important evaluation criteria in producing these stereo images.The most important criteria for producing high quality stereo pairs lies in the quality of the digitization of the image. Most TV rate imaging systems even after multiple frames are averaged are quite distorted and lack sufficient image detail. Slow scan imaging systems such as the one developed in this laboratory which use a gated integrator and can digitize at over one thousand pixels square with 256 gray levels produce images which are extremely close to photographic quality.


Author(s):  
X. H. Zhang ◽  
Z. J. Pei ◽  
Graham R. Fisher

Silicon is the primary semiconductor material used to fabricate integrated circuits. The quality of microchips depends directly on the quality of silicon wafers. A series of processes are required to manufacture the high-quality silicon wafers. Chemical mechanical polishing is a necessary step to achieve the required wafer flatness. In this paper, a finite element analysis has been conducted to study the effects of influencing factors (including Young’s modulus and Poisson’s ratio of the polishing pad, thickness of the pad, and polishing pressure) on the wafer flatness.


2010 ◽  
Vol 126-128 ◽  
pp. 82-87
Author(s):  
Mao Li ◽  
Yong Wei Zhu ◽  
Jun Li ◽  
Jian Feng Ye ◽  
Ji Long Fan

The polishing pad plays a significant role in the Chemical Mechanical Polishing (CMP) process and its wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is introduced and the law of pad wear along the pad radius is discussed, thus a new FAP with optimized pattern is designed and prepared in order. The flatness of the wafer lapped with a uniform pattern pad and that with an optimized pattern was compared. Results show that the PV value of the latter is lower that of the former.


Author(s):  
W. Ostrowski ◽  
K. Hanus

One of the popular uses of UAVs in photogrammetry is providing an archaeological documentation. A wide offer of low-cost (consumer) grade UAVs, as well as the popularity of user-friendly photogrammetric software allowing obtaining satisfying results, contribute to facilitating the process of preparing documentation for small archaeological sites. However, using solutions of this kind is much more problematic for larger areas. The limited possibilities of autonomous flight makes it significantly harder to obtain data for areas too large to be covered during a single mission. Moreover, sometimes the platforms used are not equipped with telemetry systems, which makes navigating and guaranteeing a similar quality of data during separate flights difficult. The simplest solution is using a better UAV, however the cost of devices of such type often exceeds the financial capabilities of archaeological expeditions. <br><br> The aim of this article is to present methodology allowing obtaining data for medium scale areas using only a basic UAV. The proposed methodology assumes using a simple multirotor, not equipped with any flight planning system or telemetry. Navigating of the platform is based solely on live-view images sent from the camera attached to the UAV. The presented survey was carried out using a simple GoPro camera which, from the perspective of photogrammetric use, was not the optimal configuration due to the fish eye geometry of the camera. Another limitation is the actual operational range of UAVs which in the case of cheaper systems, rarely exceeds 1 kilometre and is in fact often much smaller. Therefore the surveyed area must be divided into sub-blocks which correspond to the range of the drone. It is inconvenient since the blocks must overlap, so that they will later be merged during their processing. This increases the length of required flights as well as the computing power necessary to process a greater number of images. <br><br> These issues make prospection highly inconvenient, but not impossible. Our paper presents our experiences through two case studies: surveys conducted in Nepal under the aegis of UNESCO, and works carried out as a part of a Polish archaeological expedition in Cyprus, which both prove that the proposed methodology allows obtaining satisfying results. The article is an important voice in the ongoing debate between commercial and academic archaeologists who discuss the balance between the required standards of conducting archaeological works and economic capabilities of archaeological missions.


2018 ◽  
Vol 176 ◽  
pp. 01011
Author(s):  
YE Xin ◽  
JI Qian

The shared economy has been developing rapidly with low cost, low consumption and high environmental efficiency features under the background of internet waves. The shared economy model has emerged in housing, catering, and travel. As people look forward to high quality of life and their social interaction need, the shared kitchen platform arises at the right moment. This paper takes the shared kitchen as an example, focusing on the patients and their caregivers, the existing shared kitchens and its service platform as well as the space system design and human-computer interaction of the shared kitchen have been investigated and analysized. Taking the "high efficiency, the intelligence and the humanization" as the design principles, we are committed to exploring new directions for modular kitchen design under the background of shared economy.


1999 ◽  
Vol 566 ◽  
Author(s):  
Uday Mahajan ◽  
Marc Bielmann ◽  
Rajiv K. Singh

In this study, we have characterized the effects of abrasive properties, primarily particle size, on the Chemical Mechanical Polishing (CMP) of oxide films. Sol-gel silica particles with very narrow size distributions were used for preparing the polishing slurries. The results indicate that as particle size increases, there is a transition in the mechanism of material removal from a surface area based mechanism to an indentation-based mechanism. In addition, the surface morphology of the polished samples was characterized, with the results showing that particles larger than 0.5 μm are detrimental to the quality of the SiO2 surface.


2010 ◽  
Vol 97-101 ◽  
pp. 3-6 ◽  
Author(s):  
Ming Yi Tsai

A diamond conditioner or dresser is needed to regenerate the asperity structure of the pad and recover its designed ability in chemical mechanical polishing (CMP) process. In this paper a new design of diamond conditioner is made by shaping a sintered matrix of polycrystalline diamond (PCD) to form teethed blades. These blades are arranged and embedded in epoxy resin to make a designed penetration angle, called the blade diamond disk. The dressing characteristics of pad surface textures are studied by comparison with conventional diamond conditioner. It is found that the height variation of the diamond tip of blade diamond disk is significantly smaller than the conventional diamond disk. The dressing rate of blade diamond disk is lower than that of the conventional diamond disk, and hence the pad life is prolonged. As a result, reduction of the cost CMP is expected. In addition the pad surface roughness Ra of about 3.79μm is less than Ra of about 4.15μm obtained after dressing using a conventional diamond disk.


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