Study on Thermal Stability Properties of Epoxy Matrix/Fluorine and Silicon Composites

2014 ◽  
Vol 670-671 ◽  
pp. 143-147
Author(s):  
Qin Lin ◽  
Zhen Jiang Song ◽  
Jian Liang Xie
Keyword(s):  
Thermal Stability ◽  
Epoxy Matrix ◽  
Weight Fraction ◽  
Matrix Resin ◽  
Nmr Spectrum ◽  
Excellent Thermal Stability ◽  
Stability Properties ◽  
Modified Epoxy ◽  
Unmodified Epoxy ◽  
Silicon Resin

Fluorine and silicon resin has excellent thermal stability properties. The thermal stability properties of polymers modified by fluorine and silicon resin can be improved. In this paper, fluorine and silicon resin has been prepared by (1,3,5-tris(trifluoropropylmethyl)-cyclotrisiloxane and 3-aminopropyltriethoxysilane. The FTIR spectra and the 1H NMR spectrum showed the structure of fluorine silicon resin. The thermo gravimetric traces indicated that fluorine silicon resin had improved the thermal stability properties of epoxy matrix resin significantly. The temperature of decomposition velocity of unmodified epoxy matrix resin and modified epoxy matrix resin began to increase rapidly were 356oC, 375oC respectively. The final weight fraction of unmodified epoxy matrix resin and modified epoxy matrix resin were 4.6%, 6.5% , respectively. The temperature of the maximum rate of degradation were 398oC, 420oC, respectively.

Preparation and Thermal Stability Properties of Epoxy Matrix/Nano-SiO2 Composites

2014 ◽  
Vol 788 ◽  
pp. 588-592 ◽  
Author(s):  
Qin Lin ◽  
Zhen Jiang Song ◽  
Jian Liang Xie
Keyword(s):  
Thermal Stability ◽  
Silica Nanoparticles ◽  
Coupling Agent ◽  
Potential Application ◽  
Epoxy Matrix ◽  
Maximum Rate ◽  
Decomposition Temperature ◽  
Mass Ratio ◽  
Thermo Gravimetric ◽  
Stability Properties

The addition of nanoparticles has been proven to a high potential application for improving polymer thermal stability properties. In this paper, the nanocomposites based on epoxy matrix modified with different mass ratio of silica nanoparticles were investigated. In order to disperse and incorporate silica nanoparticles into epoxy matrix, silica nanoparticles were modified with coupling agent (Gamma-glycidoxy propyl trimethoxy silan, KH-560). FTIR spectra showed that KH-560 was absorbed on the surface of SiO2 nanoparticles. The thermo gravimetric traces indicated that the addition of silica nanoparticles has improved the thermal stability properties of epoxy matrix significantly. The decomposition temperature of nanocomposite increased with the addition of nanoSiO2, and the temperatures of the maximum rate of degradation of the unmodified nanocomposite with 0wt%, 1wt%, 3wt%, 5wt% nanoSiO2 were 401oC, 405oC, 411oC, 421oC, respectively. The temperatures for 50% weight loose of the modified nanocomposite with 1wt% and 3wt% nanoSiO2 were 389oC and 405oC, respectively.

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

The Mechanical Properties of Organic Modified Epoxy Resin

2020 ◽  
Vol 43 (3) ◽  
pp. 10-14
Author(s):  
Georgel MIHU ◽  
Claudia Veronica UNGUREANU ◽  
Vasile BRIA ◽  
Marina BUNEA ◽  
Rodica CHIHAI PEȚU ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Composite Materials ◽  
Epoxy Resin ◽  
Epoxy Matrix ◽  
Epoxy Resins ◽  
Mechanical Tests ◽  
Organic Modification ◽  
Three Point Bending ◽  
Modified Epoxy

Epoxy resins have been presenting a lot of scientific and technical interests and organic modified epoxy resins have recently receiving a great deal of attention. For obtaining the composite materials with good mechanical proprieties, a large variety of organic modification agents were used. For this study gluten and gelatin had been used as modifying agents thinking that their dispersion inside the polymer could increase the polymer biocompatibility. Equal amounts of the proteins were milled together and the obtained compound was used to form 1 to 5% weight ratios organic agents modified epoxy materials. To highlight the effect of these proteins in epoxy matrix mechanical tests as three-point bending and compression were performed.

scholarly journals Boosted piezoelectricity with excellent thermal stability in tetragonal NaNbO3-based ceramics

2020 ◽  
Author(s):  
Lu Wang ◽  
Shengdong Sun ◽  
Huajie Luo ◽  
Yang Ren ◽  
Hui Liu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Temperature Stability ◽  
Lead Free ◽  
Excellent Thermal Stability ◽  
Lead Free Ceramics ◽  
Piezoelectric Performance

The realization of high piezoelectric performance and excellent temperature stability simultaneously in lead-free ceramics is the key for replacing Pb-containing perovskites in industry. In this study, large piezoelectric performance (d33...

scholarly journals High modulus polyimide particle-reinforcement of epoxy composites

2021 ◽  
Author(s):  
Johannes Essmeister ◽  
M. Josef Taublaender ◽  
Thomas Koch ◽  
D. Alonso Cerrón-Infantes ◽  
Miriam M. Unterlass ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Composite Materials ◽  
Epoxy Matrix ◽  
Epoxy Composites ◽  
High Modulus ◽  
Particle Reinforcement

A novel class of fully organic composite materials with well-balanced mechanical properties and improved thermal stability was developed by incorporating highly crystalline, hydrothermally synthesized polyimide microparticles into an epoxy matrix.

scholarly journals The influence of an ultra-high resistivity Ta underlayer on perpendicular magnetic anisotropy in Ta/Pt/Co/Pt heterostructures

RSC Advances ◽  
2020 ◽  
Vol 10 (19) ◽  
pp. 11219-11224
Author(s):  
Wei Zhang ◽  
Xiaoxiong Jia ◽  
Rui Wang ◽  
Huihui Liu ◽  
Zhengyu Xiao ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Magnetic Anisotropy ◽  
High Stability ◽  
Essential Role ◽  
Perpendicular Magnetic Anisotropy ◽  
Low Energy ◽  
High Resistivity ◽  
Excellent Thermal Stability ◽  
Low Energy Consumption

Thin films with perpendicular magnetic anisotropy (PMA) play an essential role in the development of technologies due to their excellent thermal stability and potential application in devices with high density, high stability, and low energy consumption.

Preparation of polyetheretherketone composites with nanohydroxyapatite rods and carbon nanofibers having high strength, good biocompatibility and excellent thermal stability

RSC Advances ◽  
2016 ◽  
Vol 6 (23) ◽  
pp. 19417-19429 ◽  
Author(s):  
Kai Wang Chan ◽  
Cheng Zhu Liao ◽  
Hoi Man Wong ◽  
Kelvin Wai Kwok Yeung ◽  
Sie Chin Tjong
Keyword(s):  
Thermal Stability ◽  
Carbon Nanofibers ◽  
Hybrid Composite ◽  
High Strength ◽  
Excellent Thermal Stability ◽  
Good Biocompatibility

The WST-1 assay shows that the PEEK/15 vol% nHA–1.9 vol% CNF hybrid composite has excellent biocompatibility.

Thermal Stabilities and the Thermal Degradation Kinetics Study of the Flame Retardant Epoxy Resins

2014 ◽  
Vol 1053 ◽  
pp. 263-267 ◽  
Author(s):  
Xiu Juan Tian
Keyword(s):  
Thermal Stability ◽  
Thermal Degradation ◽  
Flame Retardant ◽  
Epoxy Resin ◽  
Epoxy Resins ◽  
Degradation Kinetics ◽  
Thermal Degradation Kinetics ◽  
Thermal Stabilities ◽  
Degradation Kinetic ◽  
Modified Epoxy

Thermal stability and thermal degradation kinetics of epoxy resins with 2-(Diphenylphosphinyl)-1, 4-benzenediol were investegated by thermogravimetric analysis (TGA) at different heating rates of 5 K/min, 10 K/min, 20 K/min and 40 K/min. The thermal degradation kinetic mechanism and models of the modified epoxy resins were determined by Coast Redfern method.The results showed that epoxy resins modified with the flame retardant had more thermal stability than pure epoxy resin. The solid-state decomposition mechanism of epoxy resin and the modified epoxy resin corresponded to the controlled decelerating ځ˽̈́˰̵̳͂͆ͅ˼˰̴̱̾˰̸̵̈́˰̵̸̳̱̹̽̾̓̽˰̶̳̹̾̈́̿̾̓ͅ˰̶˸ځ˹˰̵̵͇͂˰̃˸́˽ځ˹2/3. The introduction of phosphorus-containing flame retardant reduced thermal degradation rate of epoxy resins in the primary stage, and promote the formation of carbon layer.

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